Methods for the development of commercial scale nano-engineered ultraconductive copper wire
When forming ultra-conductive wire, multi-walled carbon nanotubes (MWCNTs) are dispersed and de-agglomerated in hot metal. The MWCNTs are dispersed in a precursor matrix via mixing and sintering to form precursor material, which is hot-extruded multiple rounds at a predetermined temperature to form a nano-composite material. The nano-composite material is inserted into a metal bar to form a nano-composite billet ( 306 ), which is subjected to multiple rounds of hot extrusion to form an ultra-conductive material. The ultra-conductive material is subjected to one or more rounds of hot wire drawing to form an ultra-conductive wire comprising a nano-composite filament.
1. A method of de-agglomerating and dispersing multi-walled carbon nanotubes (MWCNTs) in hot metal and forming ultra-conductive wire, comprising:
dispersing and aligning the MWCNTs in a precursor matrix via mixing and sintering to form precursor material;
hot-extruding the precursor material at a predetermined temperature to form a nano-composite material;
inserting nano-composite material into a metal bar to form a nano-composite billet ( 306 );
subjecting the nano-composite billet to multiple rounds of hot extrusion to form an ultra-conductive material; and
subjecting the ultra-conductive material to one or more rounds of hot wire drawing to form an ultra-conductive wire comprising a nano-composite filament.
2. The method according to claim 1 , further comprising:
cutting the ultra-conductive wire into predetermined lengths;
bundling the lengths of ultra-conductive wire; and
re-extruding the bundles to form a plurality of nano-composite filaments in a refined ultra-conductive wire.
3. The method according to claim 2 , further comprising re-extruding the bundles in a vacuum environment.
4. The method according to claim 2 , further comprising subjecting the bundles to a full melt at a temperature above the melting point of the of the precursor matrix prior to final re-extrusion in thereby establishing complete contacts under high pressure.
5. The method according to claim 4 , further comprising reducing the temperature at which the re-extrusion is performed to below the melting point of the precursor matrix thereby re-solidifying the precursor matrix during the re-extrusion.
6. The method according to claim 4 , wherein the temperature at which the full melt is performed is in the range of approximately 800. degree. C. to 900. degree. C.
7. The method according to claim 1 , wherein the metal is copper.
8. The method according to claim 1 , wherein the precursor matrix comprises magnesium.
9. The method according to claim 1 , further comprising performing the hot extrusion of at least one of the precursor material and the nano-composite billet in a vacuum environment.
10. The method according to claim 1 , wherein the predetermined temperature is between approximately 525. degree C. and 550. degree C.
11. The method according to claim 1 , wherein the ratio of nano-composite material to metal is approximately 1:5.
12. The method according to claim 1 , further comprising sealing the nano-composite material into the metal bar using metal plugs comprising the same metal as the metal bar.