Method for soldering electronic component and method for manufacturing LED display
A method for soldering electronic components includes providing a circuit substrate; providing a plurality of electronic components; placing the plurality of electronic components onto the circuit substrate; applying a conductor between the plurality of electronic components and the circuit substrate; providing an energy source which projects an energy beam with a first coverage; enlarging the energy beam and projecting the energy beam onto the circuit substrate with a second coverage; and melting the conductor within the second coverage via the energy beam and fixing the corresponding electronic components on the circuit substrate through the melted conductor. Besides, a method for manufacturing a LED display is disclosed.
1. A method for soldering electronic components, comprising:
providing a circuit substrate;
providing a plurality of electronic components;
placing the plurality of electronic components onto the circuit substrate;
applying a conductor between the plurality of electronic components and the circuit substrate;
providing an energy source which projects an energy beam with a first coverage;
enlarging the energy beam and projecting the energy beam onto the circuit substrate with a second coverage, wherein the second coverage is continuous to cover the plurality of electronic components and larger than the first coverage; and
melting the conductor within the second coverage via the energy beam and fixing the corresponding electronic components on the circuit substrate through the melted conductor.
2. The method according to claim 1 , wherein the energy source is a laser source.
3. The method according to claim 1 , wherein the energy beam is enlarged by an optical lens.
4. The method according to claim 1 , wherein the electronic components are LED chips.
5. A method for manufacturing a LED display, comprising using the method of claim 4 to solder the LED chips onto the circuit substrate.