Circuit substrate

1 . A circuit substrate comprising:

a first transistor comprising:

a first gate electrode;

a first insulating film over the first gate electrode;

an oxide semiconductor film over the first insulating film; and

a first metal and a second metal over the oxide semiconductor film, the first metal and the second metal being electrically connected to the oxide semiconductor film;

a second transistor comprising:

a semiconductor film including silicon;

a second insulating film over the semiconductor film and under the first gate electrode;

a second gate electrode over the second insulating film; and

a third metal and a fourth metal electrically connected to the semiconductor film; and

an interlayer film located over the first metal and the second metal,

wherein the interlayer film is sandwiched between the third metal and the second insulating film and between the fourth metal and the second insulating film, and

wherein a conductive layer is disposed under the second insulating film and overlaps the first gate electrode in a plane view.

2 . The circuit substrate according to claim 1 ,

wherein a capacitor is formed by the conductive layer, the first gate electrode, and the second insulating film.

3 . The circuit substrate according to claim 1 ,

wherein the conductive layer includes silicon.

4 . The circuit substrate according to claim 1 ,

wherein an area of the oxide semiconductor film is smaller than an area of the first gate electrode.