Electromagnetic interference shielding structures

1. A method of forming EMI shielding structures, comprising:

forming rectangular EMI shielding panels that each comprise a first end and a second end;

affixing a pair of rectangular EMI shielding panels orthogonal to each other at their first ends;

successively overlapping the pair of rectangular EMI shielding panels over each other to thereby form a plurality of interconnected EMI shielding planes; and

affixing the pair of rectangular EMI shielding panels to each other at their second ends to thereby form a helical EMI shielding (“HES”) structure that unfolds to an unfolded state and folds to a folded state along its center axis, the plurality of interconnected EMI shielding planes are each angularly offset from each other about the center axis to form a helical structure when in the unfolded state.

2. The method of forming electromagnetic interference (“EMI”) shielding structures of claim 1 , further comprising:

forming a conductive composition that comprises:

a polymer;

fully exfoliated single sheets of graphene that are present as a three-dimensional percolated network within the polymer;

wherein

forming the rectangular EMI shielding panels comprises:

applying the conductive composition to a side of a substrate to thereon form a conductive layer, the substrate comprises one or more of a film or a fabric; and

parsing the coated substrate into rectangular panels.

3. The method of forming EMI shielding structures of claim 1 , wherein

the plurality of interconnected EMI shielding planes each rotate about the center axis when the HES structure transitions between the folded state and unfolded state.

4. The method of forming EMI shielding structures of claim 1 , wherein

the angular offset between adjacent EMI shielding planes increases as the distance between the adjacent EMI shielding structures increases.

5. The method of forming EMI shielding structures of claim 1 , wherein

the plurality of interconnected EMI shielding planes each axially rotate about the center axis when the HES structure transitions between the unfolded state and the folded state.

6. The method of forming the EMI shielding structures of claim 1 , further comprising:

rigidly affixing a plurality of HES structures to a first rigid panel via a top end, the plurality of HES structures longitudinally positioned side by side in one or more of a row or a column; and

rotatably affixing the plurality of HES structures to a second rigid panel via a bottom end.

7. The method of forming the EMI shielding structures of claim 1 , further comprising:

forming a conductive composition that comprises:

a first polymer;

fully exfoliated single sheets of graphene that are present as a three-dimensional percolated network within the polymer;

wherein

forming the rectangular EMI shielding panels comprises:

applying the conductive composition on a side of a substrate to thereon form a conductive layer, the substrate is planar, flexible, and comprises one or more of a first film and a first fabric;

positioning an encapsulating layer proximate to one or more of the conductive layer the substrate, and the conductive layer to thereby form an encapsulated body, the encapsulating layer comprises one or more of a second film, a second fabric, a second polymer; and

parsing the encapsulated body into rectangular panels.

8. The method of forming the EMI shielding structures of claim 1 , further comprising:

forming a conductive composition that comprises:

a first polymer;

fully exfoliated single sheets of graphene that are present as a three-dimensional percolated network within the polymer;

wherein

forming the rectangular EMI shielding panels comprises:

applying the conductive composition on a side of a substrate to thereon form a conductive layer, the substrate is planar, flexible, and comprises one or more of a first film and a first fabric;

positioning an encapsulating layer proximate to one or more of the conductive layer and the substrate to thereby form an encapsulated body, the encapsulating layer comprises one or more of a second film, a second fabric, and a second polymer;

applying a metallic layer to the encapsulated body to thereby form a shrouded body, the metallic layer is planar, flexible, and comprises one or more of a metallic film, metallic fiber, and a metallic screen; and

parsing the shrouded body into rectangular panels.

9. A electromagnetic interference (“EMI”) shielding structure, comprising:

a plurality of interconnected EMI shielding planes;

a conductive composition;

wherein

the plurality of interconnected EMI shielding planes comprise:

a pair of rectangular EMI shielding panels that each comprise a first end and a second end;

are affixed orthogonal to each other at their first ends;

successively overlap each other to thereby form a plurality of interconnected EMI shielding planes;

affixed at their second ends to thereby form a helical EMI shielding (“HES”) structure;

the HES structure unfolds to an unfolded state and folds to a folded state along its center axis;

the conductive composition is positioned on each EMI shielding panel; and

the plurality of interconnected EMI shielding planes are each angularly offset from each other about the center axis to form a helical structure when in the unfolded state.

10. The EMI shielding structure of claim 9 , wherein

the rectangular EMI shielding panels comprises:

a substrate;

a conductive layer;

the substrate comprises

a rectangular shape;

one or more of a film or a fabric;

the conductive layer

is positioned proximate to the substrate;

comprises a conductive composition;

the conductive composition comprises:

a polymer; and

fully exfoliated single sheets of graphene that are present as a three-dimensional percolated network within the polymer.

11. The EMI shielding structure of claim 9 , wherein

the plurality of interconnected EMI shielding planes each rotate about the center axis when the HES structure transitions between the folded state and unfolded state.

12. The EMI shielding structure of claim 9 , wherein

the angular offset between adjacent EMI shielding planes increases as the distance between the adjacent EMI shielding structures increases.

13. The EMI shielding structure of claim 9 , wherein

the plurality of interconnected EMI shielding planes each axially rotate about the center axis when the HES structure transitions between the unfolded state and the folded state.

14. The EMI shielding structure of claim 9 , further comprising:

a plurality of HES structures that are

rigidly affixed to a first rigid panel via their first end;

rotatably affixed to a second rigid panel via their second end; and

wherein

the plurality of HES structures are longitudinally positioned side by side in one or more of a row or a column to thereby form an EMI shielding construct.

15. The EMI shielding structure of claim 9 , wherein

each rectangular EMI shielding panel comprises:

a substrate that comprises one or more of a first film and a first fabric;

a conductive layer;

an encapsulating layer;

the conductive layer

is positioned proximate to a side of the first substrate;

comprises:

a first polymer;

fully exfoliated single sheets of graphene;

the fully exfoliated single sheets of graphene are present as a three-dimensional percolated network within the polymer;

the encapsulating layer

comprises one or more of a second film, a second fabric, a second polymer; and

is positioned proximate to one or more of the conductive layer, the substrate, and the conductive layer.

16. The EMI shielding structure of claim 9 , wherein

each rectangular EMI shielding panel comprises:

a substrate that comprises one or more of a first film and a first fabric;

an encapsulating layer;

a conductive layer;

a metallic layer;

the conductive layer

is positioned proximate to each side of the first substrate;

comprises:

a first polymer;

fully exfoliated single sheets of graphene;

the fully exfoliated single sheets of graphene are present as a three-dimensional percolated network within the polymer;

the encapsulating material comprises one or more of a second film, a second fabric, a second polymer;

is positioned proximate to one or more of the conductive layer, the substrate, and the conductive layer;

the metallic substrate

comprises one or more of a metallic film and a metallic fabric; and

is positioned proximate to one or more of the conductive layer, the substrate, the conductive layer, and the encapsulating material.

17. A method of forming EMI shielding structures, comprising:

forming a conductive composition that comprises:

a polymer;

fully exfoliated single sheets of graphene that are present as a three-dimensional percolated network within the polymer;

forming rectangular EMI shielding panels that each comprise a first end and a second end by applying the conductive composition to a side of a substrate to thereon form a conductive layer, the substrate is planar and flexible, the substrate comprises one or more of a film or a fabric;

affixing a pair of rectangular EMI shielding panels orthogonal to each other at their first ends;

successively overlapping the pair of rectangular EMI shielding panels over each other to thereby form a plurality of interconnected EMI shielding planes; and

affixing the pair of rectangular EMI shielding panels to each other at their second ends to thereby form a helical EMI shielding (“HES”) structure that unfolds to an unfolded state and folds to a folded state along its center axis, the plurality of interconnected EMI shielding planes are each angularly offset from each other about the center axis to form a helical structure when in the unfolded state, the plurality of interconnected EMI shielding planes each rotate about the center axis when the HES structure transitions between the folded state and unfolded state.

18. The method of forming the EMI shielding structures of claim 17 , further comprising:

rigidly affixing a plurality of HES structures to a first rigid panel via a top end, the plurality of HES structures longitudinally positioned side by side in one or more of a row or a column; and

rotatably affixing the plurality of HES structures to a second rigid panel via a bottom end.

19. The method of forming the EMI shielding structures of claim 18 , wherein

forming the rectangular EMI shielding panels comprises:

positioning an encapsulating layer proximate to one or more of the conductive layer the substrate, and the conductive layer to thereby form an encapsulated body, the encapsulating layer comprises one or more of a second film, a second fabric, a second polymer; and

parsing the encapsulated body into rectangular panels.