Multi-zone radio frequency transistor amplifiers
RF transistor amplifiers include an RF transistor amplifier die having a Group III nitride-based semiconductor layer structure and a plurality of gate terminals, a plurality of drain terminals, and at least one source terminal that are each on an upper surface of the semiconductor layer structure, an interconnect structure on an upper surface of the RF transistor amplifier die, and a coupling element between the RF transistor amplifier die and the interconnect structure that electrically connects the gate terminals, the drain terminals and the source terminal to the interconnect structure.
1 . A radio frequency (“RF”) transistor amplifier, comprising:
an RF transistor amplifier die having a Group III nitride-based semiconductor layer structure that comprises a Group III nitride based channel layer and a Group III nitride based barrier layer on the Group III nitride based channel layer, the Group III nitride based barrier layer having a higher bandgap than the Group III nitride based channel layer; and
a plurality of unit cell transistors that are formed at least partially in the Group III nitride-based semiconductor layer structure,
wherein a first of the unit cells comprises a first drain finger, a first source finger and a first gate finger that is positioned in between the first drain finger and the first source finger, and a second of the unit cells comprises a second drain finger, a second source finger and a second gate finger that is positioned in between the second drain finger and the second source finger, and
wherein the first gate finger has a first length and the second gate finger has a second length that is different than the first length.
2 . The RF transistor amplifier of claim 1 , wherein the RF transistor amplifier die is divided into a plurality of zones that are configured for operation in different frequency bands, and wherein the first of the gate fingers is in a first of the zones and the second of the gate fingers is in a second of the zones.
3 . The RF transistor amplifier of claim 2 , wherein the first of the zones is configured to amplify RF signals in a first frequency range and the second of the zones is configured to amplify RF signals in a second frequency range that is different from the first frequency range.
4 . The RF transistor amplifier of claim 3 , further comprising:
an interconnect structure on a surface of the RF transistor amplifier die; and
a coupling element between the RF transistor amplifier die and the interconnect structure that electrically connects the RF transistor amplifier die to the interconnect structure.
5 . The RF transistor amplifier of claim 4 , wherein the interconnect structure includes a first RF input that corresponds to the first zone and a second RF input that corresponds to the second zone.
6 . The RF transistor amplifier of claim 5 , wherein a plurality of circuit elements are mounted on the interconnect structure.
7 . The RF transistor amplifier of claim 6 , wherein the circuit elements comprise at least one of a surface mount capacitor and a surface mount inductor.
8 . The RF transistor amplifier of claim 2 , wherein the RF transistor amplifier die further includes a plurality of gate terminals, a plurality of drain terminals, and at least one source terminal, and wherein each of the gate terminals is coupled to a respective one of the plurality of zones.
9 . A radio frequency (“RF”) transistor amplifier, comprising:
an RF transistor amplifier die having a Group III nitride-based semiconductor layer structure and a plurality of gate manifolds;
an interconnect structure on an upper surface of the RF transistor amplifier die, the interconnect structure including an RF input;
a coupling element between the RF transistor amplifier die and the interconnect structure that electrically connects the RF transistor amplifier die to the interconnect structure; and
a plurality of RF transmission lines that extend from the RF input to the respective gate manifolds, where each of the RF transmission lines has substantially the same electrical length.
10 . The RF transistor amplifier of claim 9 , wherein each of the RF transmission lines has substantially the same physical length.
11 . The RF transistor amplifier of claim 9 , wherein the RF transistor amplifier die is divided into a plurality of zones and each of the zones includes a plurality of unit cell transistors, and wherein each gate manifold is connected to the unit cell transistors of a respective one of the zones.
12 . The RF transistor amplifier of claim 9 , wherein the coupling element comprises a plurality of conductive pillars and the interconnect structure comprises a redistribution layer laminate structure and/or a printed circuit board.
13 . The RF transistor amplifier of claim 9 , wherein some of the RF transmission lines comprise meandered RF transmission lines.
14 . A radio frequency (“RF”) transistor amplifier, comprising:
an RF transistor amplifier die having a Group III nitride-based semiconductor layer structure that comprises a Group III nitride based channel layer and a Group III nitride based barrier layer on the Group III nitride based channel layer, the Group III nitride based barrier layer having a higher bandgap than the Group III nitride based channel layer; and
an interconnect structure on an upper surface of the RF transistor amplifier die, the interconnect structure including an RF input;
an input splitter;
an output combiner;
wherein the RF transistor amplifier die is divided into a plurality of zones, wherein each of the zones includes a plurality of unit cell transistors that are formed at least partially in the Group III nitride-based semiconductor layer structure, and
wherein a first set of one or more of the plurality of zones implements a main amplifier of a Doherty amplifier and a second set of one or more of the plurality of zones implements a peaking amplifier of the Doherty amplifier.
15 . The RF transistor amplifier of claim 14 , wherein the splitter is formed on the interconnect structure.
16 . The RF transistor amplifier of claim 15 , wherein the output combiner is formed on the interconnect structure.
17 . The RF transistor amplifier of claim 14 , wherein the interconnect structure comprises one of a plurality of different interconnect structures, and different of the interconnect structures connect to different numbers of the plurality of zones.
18 . The RF transistor amplifier of claim 14 , further comprising a coupling element that is positioned between the RF transistor amplifier die and the interconnect structure that electrically connects the RF transistor amplifier die to the interconnect structure.
19 . The RF transistor amplifier of claim 18 , wherein the coupling element comprises a plurality of conductive pillars and the interconnect structure comprises a redistribution layer laminate structure and/or a printed circuit board.