Semiconductor device
A semiconductor device includes a first die pad having a main surface, a second die pad having a second main surface, a first switching element connected to the first main surface, a second switching element connected to the second main surface, a first connecting member connecting the first main surface electrode of the first switching element to the second die pad, an encapsulation resin encapsulating the first switching element, the second switching element, the first die pad, the second die pad, and the first connecting member, and leads projecting out of one of the resin side surfaces of the encapsulation resin.
1 . A semiconductor device comprising:
a first die pad including a first main surface;
a second die pad spaced apart from the first die pad in a first direction that extends parallel to the first main surface, wherein the second die pad includes a second main surface facing the same direction as the first main surface;
a first switching element, mounted on the first main surface, and including a first element main surface facing the same direction as the first main surface, a first element back surface facing in the opposite direction of the first element main surface, a first main surface electrode and a first control electrode that are arranged on the first element main surface, and a first back surface electrode arranged on the first element back surface, wherein the first back surface electrode is connected to the first main surface;
a second switching element, mounted on the second main surface, and including a second element main surface facing the same direction as the second main surface, a second element back surface facing in the opposite direction of the second element main surface, a second main surface electrode and a second control electrode that are arranged on the second element main surface, and a second back surface electrode arranged on the second element back surface, wherein the second back surface electrode is connected to the second main surface;
a first connecting member connecting the first main surface electrode of the first switching element to the second die pad;
an encapsulation resin including resin side surfaces facing a direction extending parallel to the first main surface and the second main surface, wherein the encapsulation resin encapsulates the first switching element, the second switching element, the first die pad, the second die pad, and the first connecting member; and
leads arranged in the first direction, wherein the leads project out of one of the resin side surfaces of the encapsulation resin in a second direction intersecting the first direction, and the leads extend in the second direction.
2 . The semiconductor device according to claim 1 , wherein the first connection member comprises a conductive plate or conductive wires.
3 . The semiconductor device according to claim 1 , wherein the first switching element is located toward the second die pad from a central part of the first die pad as viewed in the second direction.
4 . The semiconductor device according to claim 3 , wherein a first distance from a side of the first die pad located toward the second die pad to a side of the first switching element located toward the second die pad as viewed in a direction orthogonal to the first main surface is greater than or equal to a thickness of the first die pad.
5 . The semiconductor device according to claim 1 , wherein the second switching element is located toward the first die pad from a central part of the second die pad as viewed in the second direction.
6 . The semiconductor device according to claim 5 , wherein a second distance from a side of the second die pad located toward the first die pad to a side of the second switching element located toward the first die pad as viewed in a direction orthogonal to the second main surface is greater than or equal to a thickness of the second die pad.
7 . The semiconductor device according to claim 1 , wherein:
the leads include
a first control lead connected to the first control electrode of the first switching element and arranged at an end of the encapsulation resin at a side at which the first die pad is located,
a second control lead connected to the second control electrode of the second switching element and arranged at an end of the encapsulation resin at a side at which the second die pad is located,
a first drive lead connected to the first back surface electrode of the first switching element,
a second drive lead connected to the second main surface electrode of the second switching element, and
an output lead connected to the second die pad; and
the first drive lead, the second drive lead, and the output lead are located between the first control lead and the second control lead.
8 . The semiconductor device according to claim 7 , wherein the output lead is located between the first drive lead and the second drive lead.
9 . The semiconductor device according to claim 7 , wherein the second drive lead is located between the first drive lead and the output lead.
10 . The semiconductor device according to claim 7 , wherein the leads include:
a first source lead connected to the first main surface electrode of the first switching element and located toward the second die pad from the first control lead; and
a second source lead connected to the second main surface electrode of the second switching element and located toward the first die pad from the second control lead.
11 . The semiconductor device according to claim 7 , wherein the first drive lead, the second drive lead, and the output lead each have a thickness that is equal to that of the first die pad and the second die pad.
12 . The semiconductor device according to claim 7 , further comprising a second connecting member connecting the second main surface electrode of the second switching element to the second drive lead.
13 . A semiconductor device comprising:
a first die pad including a first main surface;
a second die pad spaced apart from the first die pad in a first direction that extends parallel to the first main surface, wherein the second die pad includes a second main surface facing the same direction as the first main surface;
a first switching element, mounted on the first main surface, and including a first element main surface facing the same direction as the first main surface, a first element back surface facing in the opposite direction of the first element main surface, a first main surface electrode and a first control electrode that are arranged on the first element main surface, and a first back surface electrode arranged on the first element back surface, wherein the first back surface electrode is connected to the first main surface;
a second switching element, mounted on the second main surface, and including a second element main surface facing the same direction as the second main surface, a second element back surface facing in the opposite direction of the second element main surface, a second main surface electrode and a second control electrode that are arranged on the second element main surface, and a second back surface electrode arranged on the second element back surface, wherein the second back surface electrode is connected to the second main surface;
a first connecting member connected to the first main surface electrode of the first switching element;
an encapsulation resin including resin side surfaces facing a direction extending parallel to the first main surface and the second main surface, wherein the encapsulation resin encapsulates the first switching element, the second switching element, the first die pad, the second die pad, and the first connecting member;
a first lead group including leads projecting out of, among the resin side surfaces, a first resin side surface that faces a second direction intersecting the first direction; and
a second lead group including leads projecting out of a second resin side surface facing in the opposite direction of the first resin side surface,
wherein the first main surface electrode of the first switching element is electrically connected to the second die pad by the first connecting member.
14 . The semiconductor device according to claim 13 , wherein:
the leads of the first lead group include
a first drive lead connected to the first back surface electrode of the first switching element,
a second drive lead connected to the second main surface electrode of the second switching element, and
an output lead connected to the second die pad; and
the leads of the second lead group include
a first control lead connected to the first control electrode of the first switching element, and
a second control lead connected to the second control electrode of the second switching element.
15 . The semiconductor device according to claim 13 , wherein:
the leads of the first lead group include
a first drive lead connected to the first back surface electrode of the first switching element, and
a second drive lead connected to the second main surface electrode of the second switching element;
the leads of the second lead group include
a first control lead connected to the first control electrode of the first switching element,
a second control lead connected to the second control electrode of the second switching element, and
an output lead connected to the second die pad; and
the first main surface electrode of the first switching element is connected to the second die pad by the first connecting member and the output lead.
16 . The semiconductor device according to claim 14 or 15 , wherein the first drive lead and the second drive lead are adjacent to each other.
17 . The semiconductor device according to claim 14 , wherein the second lead group includes:
a first source lead connected to the first main surface electrode of the first switching element and located toward a central part of the encapsulation resin from the first control lead; and
a second source lead connected to the second main surface electrode of the second switching element and located toward a central part of the encapsulation resin from the second control lead.
18 . The semiconductor device according to claim 14 , further comprising a second connecting member connecting the second main surface electrode of the second switching element to the second drive lead.
19 . The semiconductor device according to claim 13 , wherein:
the first switching element mounted on the first die pad is one of a plurality of first switching elements; and
the second switching element mounted on the second die pad is one of a plurality of second switching elements.
20 . The semiconductor device according to claim 19 , wherein the first switching elements and the second switching elements are arranged in the second direction.
21 . The semiconductor device according to claim 19 , wherein the first main surface electrode of each of the first switching elements is connected to the second die pad by the first connecting member.
22 . The semiconductor device according to claim 19 , wherein:
the first switching elements are arranged in the first direction and located toward the second resin side surface; and
the second switching elements are arranged in the first direction and located toward the first resin side surface.
23 . The semiconductor device according to claim 13 , wherein the first switching element is located toward the second die pad from a central part of the first die pad as viewed in the second direction.
24 . The semiconductor device according to claim 23 , wherein a first distance from a side of the first die pad located toward the second die pad to a side of the first switching element located toward the second die pad as viewed in a direction orthogonal to the first main surface is greater than or equal to a thickness of the first die pad.
25 . The semiconductor device according to claim 13 , wherein the second switching element is located toward the first die pad from a central part of the second die pad as viewed in the second direction.
26 . The semiconductor device according to claim 25 , wherein a second distance from a side of the second die pad located toward the first die pad to a side of the second switching element located toward the first die pad as viewed in a direction orthogonal to the second main surface is greater than or equal to a thickness of the second die pad.