Housing and electronic device
A housing and an electronic device. The housing includes a first support plate, a second support plate, and a vapor chamber. The first support plate, the vapor chamber, and the second support plate are laminated, and the vapor chamber is located between the first support plate and the second support plate, and is connected to the first support plate and the second support plate. Heat dissipation channels are disposed on the vapor chamber, the heat dissipation channels include a main heat dissipation channel and an auxiliary heat dissipation channel, the main heat dissipation channel and the auxiliary heat dissipation channel are connected, and heat exchange may occur between the main heat dissipation channel and the auxiliary heat dissipation channel. The housing may improve heat dissipation performance of the housing.
1 . A housing configured as a battery cover of an electronic device, the housing comprising:
a first support plate;
a second support plate;
a vapor chamber located between and connected to the first support plate and the second support plate, wherein the vapor chamber comprises a top wall, a bottom wall, and a side wall; and
a heat dissipation channel disposed on the vapor chamber, the heat dissipation channel comprising:
a main heat dissipation channel;
a first auxiliary heat dissipation channel connected to the main heat dissipation channel;
a second auxiliary heat dissipation channel connected to the main heat dissipation channel;
a first guide channel, wherein one end of the first guide channel is connected to the main heat dissipation channel and another end of the first guide channel is connected to the first auxiliary heat dissipation channel; and
a second guide channel, wherein one end of the second guide channel is connected to the main heat dissipation channel and another end of the second guide channel is connected to the second auxiliary heat dissipation channel,
wherein the main heat dissipation channel and the auxiliary heat dissipation channels are configured such that a) when the main heat dissipation channel is a high-temperature area and the auxiliary heat dissipation channels are low-temperature areas, heat is transferred from the main heat dissipation channel to the auxiliary heat dissipation channels, and b) when the main heat dissipation channel is a low-temperature area and the auxiliary heat dissipation channels are high-temperature areas, heat is transferred from the auxiliary heat dissipation channels to the main heat dissipation channel,
wherein a first capillary structure is disposed in the heat dissipation channel on an inner surface of the top wall of the vapor chamber, and wherein a second capillary structure is disposed in the heat dissipation channel on an inner surface of the bottom wall of the vapor chamber, and
wherein the first support plate, the vapor chamber, and the second support plate are laminated.
2 . The housing of claim 1 , wherein the vapor chamber is filled with coolant, and the coolant is configured to be vaporized in the high-temperature area and condensed in the low-temperature area to conduct heat in the high-temperature area to the low-temperature area.
3 . The housing of claim 2 , wherein the coolant is filled in one or more of the first and second capillary structures, and the coolant is configured to undergo a gas-liquid circulation in the main heat dissipation channel and the auxiliary heat dissipation channel to conduct heat in the high-temperature area to the low-temperature area.
4 . The housing of claim 3 , wherein a width of the first guide channel is less than widths of the main heat dissipation channel and the first auxiliary heat dissipation channel, and wherein a width of the second guide channel is less than widths of the main heat dissipation channel and the second auxiliary heat dissipation channel.
5 . The housing of claim 1 , wherein a material of the vapor chamber is copper, a carbon fiber, graphene, or graphite flake.
6 . The housing of claim 1 , wherein a thickness of the housing is 0.5-0.65 mm.
7 . The housing of claim 1 further comprising a protection plate having an accommodation groove disposed thereon, wherein the vapor chamber is located in the accommodation groove, and is fixedly connected to the protection plate.
8 . The housing of claim 1 , wherein either a) a mounting groove is disposed on a surface of the first support plate that faces the vapor chamber, and the vapor chamber is located in the mounting groove, or b) a mounting groove is disposed on a surface of the second support plate that faces the vapor chamber, and the vapor chamber is located in the mounting groove.
9 . The housing of claim 1 , wherein a first mounting groove is disposed on a surface of the first support plate that faces the vapor chamber, a second mounting groove is disposed on a surface of the second support plate that faces the vapor chamber, and the first mounting groove is buckled with the second mounting groove to fasten the vapor chamber.
10 . The housing of claim 1 , wherein the housing is an integrally formed component.
11 . The housing of claim 1 , further comprising a decorative layer laminated on a surface of the first support plate that faces away from the vapor chamber.
12 . The housing of claim 11 , wherein the decorative layer is formed on the surface of the first support plate by a spraying or non-conductive coating process.
13 . The housing of claim 1 , further comprising an ink layer laminated on a surface of the second support plate that faces away from the vapor chamber.
14 . An electronic device, comprising:
a body; and
a housing mounted in the body and configured as a battery cover of the electronic device, the housing comprising:
a first support plate;
a second support plate;
a vapor chamber located between and connected to the first support plate and the second support plate, wherein the vapor chamber comprises a top wall, a bottom wall, and a side wall; and
a heat dissipation channel disposed on the vapor chamber, the heat dissipation channel comprising:
a main heat dissipation channel;
a first auxiliary heat dissipation channel connected to the main heat dissipation channel;
a second auxiliary heat dissipation channel connected to the main heat dissipation channel;
a first guide channel, wherein one end of the first guide channel is connected to the main heat dissipation channel and another end of the first guide channel is connected to the first auxiliary heat dissipation channel; and
a second guide channel, wherein one end of the second guide channel is connected to the main heat dissipation channel and another end of the second guide channel is connected to the second auxiliary heat dissipation channel,
wherein the main heat dissipation channel and the auxiliary heat dissipation channels are configured such that a) when the main heat dissipation channel is a high-temperature area and the auxiliary heat dissipation channels are low-temperature areas, heat is transferred from the main heat dissipation channel to the auxiliary heat dissipation channels, and b) when the main heat dissipation channel is a low-temperature area and the auxiliary heat dissipation channels are high-temperature areas, heat is transferred from the auxiliary heat dissipation channels to the main heat dissipation channel,
wherein a first capillary structure is disposed in the heat dissipation channel on an inner surface of the top wall of the vapor chamber, and wherein a second capillary structure is disposed in the heat dissipation channel on an inner surface of the bottom wall of the vapor chamber, and
wherein the first support plate, the vapor chamber, and the second support plate are laminated.
15 . The electronic device of claim 14 , wherein a first heating element and a second heating element are mounted in the body, an amount of heat produced by the first heating element is greater than an amount of heat produced by the second heating element, and the high-temperature area is opposite to the first heating element.
16 . The electronic device of claim 14 , wherein the vapor chamber is filled with coolant, and the coolant is configured to be vaporized in the high-temperature area and condensed in the low-temperature area to conduct heat in the high-temperature area to the low-temperature area.
17 . The electronic device of claim 16 , wherein the coolant is filled in one or more of the first and second capillary structures, and the coolant is configured to undergo a gas-liquid circulation in the main heat dissipation channel and the auxiliary heat dissipation channel to conduct heat in the high-temperature area to the low-temperature area.
18 . The electronic device of claim 17 , wherein a width of the first guide channel is less than widths of the main heat dissipation channel and the first auxiliary heat dissipation channel, and wherein a width of the second guide channel is less than widths of the main heat dissipation channel and the second auxiliary heat dissipation channel.
19 . The electronic device of claim 14 , wherein a material of the vapor chamber is copper, a carbon fiber, graphene, or graphite flake.
20 . The electronic device of claim 14 , wherein a thickness of the housing is 0.5-0.65 mm.