Heat-conductive resin composition and heat dissipation sheet
A heat-conductive resin composition containing an inorganic filler component and a resin component, wherein the inorganic filler component includes first and second inorganic fillers, a particle size distribution has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second, the diameter at the first maximum point is 15 μm or more, the diameter at the second is ⅔ or less that at the first, an integrated amount of frequency between a peak start and end in a peak having the first maximum point is 50% or more, and the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more. The heat dissipation sheet is obtained by molding the heat-conductive resin composition.
1. A heat-conductive resin composition comprising an inorganic filler component and a resin component, wherein
the inorganic filler component comprises a first inorganic filler and a second inorganic filler,
a particle size distribution of the inorganic filler component has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second inorganic filler,
a particle diameter at the first maximum point is 15 μm or more,
a particle diameter at the second maximum point is 30% or more and ⅔ or less of the particle diameter at the first maximum point,
an integrated amount of frequency between a peak start and a peak end in a peak having the first maximum point is 70% or more,
an integrated amount of frequency between a peak start and a peak end in a peak having the second maximum point is 25% or more, and
the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more.
2. The heat-conductive resin composition according to claim 1 , wherein the second inorganic filler is boron nitride particles.
3. The heat-conductive resin composition according to claim 2 , wherein the second inorganic filler is massive boron nitride particles formed by agglomerating hexagonal boron nitride primary particles and having a crushing strength of 6 MPa or more.
4. The heat-conductive resin composition according to claim 1 , wherein in particle size accumulation of the inorganic filler component, an integrated amount of the frequency of particle diameters of 0 to 15 μm is less than 60%.
5. A heat dissipation sheet obtained by molding the heat conductive resin composition according to claim 1 .
6. The heat dissipation sheet according to claim 5 , having a thickness of 0.35 mm or less.
7. The heat dissipation sheet according to claim 5 , further comprising a base material having a thickness of 0.05 mm or less.