Shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate
The invention relates to a shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, use of a shield body system, and a method for a chemical and/or electrolytic surface treatment of a substrate in a process fluid. The shield body system comprises a shield body and an agitation unit. The shield body has a plurality of openings to direct the process fluid flow and/or a current density distribution towards the substrate to be treated. The agitation unit is configured to move the shield body together with the substrate vertically and/or horizontally relative to a distribution body. Alternatively or additionally, the agitation unit is configured to move the shield body together with the substrate vertically and/or horizontally relative to a deposition chamber for chemical and/or electrolytic surface treatment.
1 . A shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, the shield body system comprising:
a substrate holder, a shield body, and an agitation unit,
wherein the substrate holder is configured to hold the substrate during surface treatment,
wherein the shield body defines a plurality of openings to direct a process fluid flow and/or a current density distribution towards the substrate to be treated held by the substrate holder,
wherein the agitation unit is configured to move the shield body and substrate held by the substrate holder together vertically and horizontally relative to a distribution body for chemical and/or electrolytic surface treatment, and
the shield body system further comprising the distribution body defining a plurality of openings through which the process fluid flow and/or the current density distribution can be directed towards the shield body,
wherein the shield body is configured to be arranged between the substrate held by the substrate holder and the distribution body,
wherein the shield body is arranged next to the distribution body within a distance of 50 μm to 12 mm.
2 . The shield body system according to claim 1 , wherein the shield body is positioned and/or dimensioned so that the openings of the shield body correspond to surface elements of the substrate, which are to be deposited.
3 . The shield body system according to claim 1 , the shield body system further comprising a rotation unit configured to rotate the shield body together with the substrate on an axis relative to the distribution body and/or relative to a deposition chamber for chemical and/or electrolytic surface treatment.
4 . The shield body system according to claim 1 , wherein the shield body comprises at least one return aperture configured to direct a return flow of the process fluid in an opposite direction to a direction towards the substrate.
5 . The shield body system according to claim 4 , wherein the at least one return aperture has an aperture diameter, which is smaller than a diameter equal to the sum of diameters of the plurality of openings of the shield body.
6 . The shield body system according to claim 1 , further comprising an attachment unit configured to attach the shield body to the substrate or to the substrate holder holding the substrate.
7 . The shield body system according to claim 1 , the shield body system further comprising an alignment unit configured to align the shield body relative the substrate.