Granted Patent B2

US 12,660,442 · App. 18/015,965 · Granted Jun 16, 2026

Inventors: Chao Pu (Beijing, CN); Shengji Yang (Beijing, CN); Pengcheng Lu (Beijing, CN); Kuanta Huang (Beijing, CN); Xiaochuan Chen (Beijing, CN)

Assignees: Yunnan Invensight Optoelectronics Technology Co., Ltd.; BOE Technology Group Co., Ltd

H10K59/131H10K59/1201

Abstract

Claims (33)

1 . A display substrate, comprising a display area and a bonding area located on one side of the display area; wherein the display substrate comprises a base substrate and a circuit structure layer disposed on the base substrate; the circuit structure layer comprises a circuit structure layer in the display area and a circuit structure layer in the bonding area, a pixel driving circuit is disposed in the circuit structure layer of the display area, the pixel driving circuit comprises a plurality of transistors, the display area further comprises a light emitting structure layer and a package structure layer which are sequentially stacked on a side of the circuit structure layer away from the base substrate, and the light emitting structure layer comprises a light emitting device connected to the pixel driving circuit; a pad is provided in the circuit structure layer of the bonding area, the pad is configured to be bonded and connected to an external circuit board, and a surface of the pad is disposed flush with a surface of the circuit structure layer around the pad and away from the base substrate,

wherein the circuit structure layer in the display area comprises a plurality of insulating layers and the circuit structure layer in the bonding area comprises a plurality of insulating layers;

wherein the plurality of insulating layers of the circuit structure layer of the bonding area each is arranged in a same layer as a corresponding insulating layer in the plurality of insulating layers of the circuit structure layer of the display area;

wherein a number of the plurality of insulating layers of the circuit structure layer of the bonding area is less than a number of the plurality of insulating layers of the circuit structure layer of the display area;

wherein a bottom surface, facing the base substrate, of an insulating layer, farthest from the base substrate, of the plurality of insulating layers in the circuit structure layer of the bonding area is flush with a bottom surface, facing to the base substrate, of an insulating layer, farthest from the base substrate, of the plurality of insulating layers in the circuit structure layer of the display area;

wherein a top surface, facing away from the base substrate, of the insulating layer, farthest from the base substrate, of the plurality of insulating layers in the circuit structure layer of the bonding area is not flush with a top surface, facing away from the base substrate, of the insulating layer, farthest from the base substrate, of the plurality of insulating layers in the circuit structure layer of the display area; and

wherein a thickness of the insulating layer farthest from the base substrate in the circuit structure layer of the bonding area is less a thickness of the insulating layer farthest from the base substrate in the circuit structure layer of the display area.

2 . The display substrate according to claim 1 , wherein the circuit structure layer of the display area comprises a plurality of conductive layers sequentially disposed in a direction away from the base substrate, and the plurality of insulating layers in the circuit structure layer in the display area and the plurality of conductive layers are disposed in an alternating manner;

the pad comprises a bonding electrode and at least one connection layer disposed on a side of the bonding electrode away from the base substrate, in a case there is one connection layer, the one connection layer close to the bonding electrode is connected to the bonding electrode by a conductive post; in a case there are at least two connection layers, two adjacent connection layers of the at least two connection layers are connected by a conductive post; and one connection layer of the at least two connection layers close to the bonding electrode is connected to the bonding electrode by a conductive post;

the bonding electrode and any one of the at least one connection layer each is disposed in a same layer as one of the plurality of conductive layers.

3 . The display substrate according to claim 2 , wherein the plurality of conductive layers comprise a first conductive layer and a second conductive layer sequentially disposed in the direction away from the base substrate and at least one conductive layer disposed on a side of the second conductive layer away from the base substrate;

gate electrodes of the transistors are disposed at the first conductive layer, and source electrodes and drain electrodes of the transistors are disposed at the second conductive layer; the bonding electrode is disposed in a same layer as the second conductive layer.

4 . The display substrate according to claim 2 , wherein a material of the conductive post comprises tungsten.

5 . The display substrate according to claim 4 , wherein the plurality of conductive layers comprise a first conductive layer and a second conductive layer sequentially disposed in the direction away from the base substrate and at least one conductive layer disposed on a side of the second conductive layer away from the base substrate;

gate electrodes of the transistors are disposed at the first conductive layer, and source electrodes and drain electrodes of the transistors are disposed at the second conductive layer; the bonding electrode is disposed in a same layer as the second conductive layer.

6 . The display substrate according to claim 1 , wherein the circuit structure layer of the bonding area comprises a bonding electrode, the plurality of insulating layers of the circuit structure layer in the bonding area comprises a composite insulating layer, the composite insulating layer is disposed on a side of the bonding electrode away from the base substrate, the composite insulating layer is provided with a groove exposing a surface of the bonding electrode away from the base substrate, and the groove is provided with a filling layer, a surface of the filling layer is disposed flush with a surface of the composite insulating layer around the groove and away from the base substrate; the pad comprises the bonding electrode and the filling layer, and the surface of the pad is the surface of the filling layer.

7 . A display apparatus, comprising a display substrate, wherein:

the display substrate comprises a display area and a bonding area located on one side of the display area; the display substrate comprises a base substrate and a circuit structure layer disposed on the base substrate; the circuit structure layer comprises a circuit structure layer in the display area and a circuit structure layer in the bonding area, a pixel driving circuit is disposed in the circuit structure layer of the display area, the pixel driving circuit comprises a plurality of transistors, the display area further comprises a light emitting structure layer and a package structure layer which are sequentially stacked on a side of the circuit structure layer away from the base substrate, and the light emitting structure layer comprises a light emitting device connected to the pixel driving circuit; a pad is provided in the circuit structure layer of the bonding area, the pad is configured to be bonded and connected to an external circuit board, and a surface of the pad is disposed flush with a surface of the circuit structure layer around the pad and away from the base substrate,

wherein the circuit structure layer in the display area comprises a plurality of insulating layers and the circuit structure layer in the bonding area comprises a plurality of insulating layers;

wherein the plurality of insulating layers of the circuit structure layer of the bonding area each is arranged in a same layer as a corresponding insulating layer in the plurality of insulating layers of the circuit structure layer of the display area;

wherein a number of the plurality of insulating layers of the circuit structure layer of the bonding area is less than a number of the plurality of insulating layers of the circuit structure layer of the display area;

wherein a bottom surface, facing the base substrate, of an insulating layer, farthest from the base substrate, of the plurality of insulating layers in the circuit structure layer of the bonding area is flush with a bottom surface, facing to the base substrate, of an insulating layer, farthest from the base substrate, of the plurality of insulating layers in the circuit structure layer of the display area;

wherein a top surface, facing away from the base substrate, of the insulating layer, farthest from the base substrate, of the plurality of insulating layers in the circuit structure layer of the bonding area is not flush with a top surface, facing away from the base substrate, of the insulating layer, farthest from the base substrate, of the plurality of insulating layers in the circuit structure layer of the display area; and

wherein a thickness of the insulating layer farthest from the base substrate in the circuit structure layer of the bonding area is less a thickness of the insulating layer farthest from the base substrate in the circuit structure layer of the display area.

8 . A preparing method of a display substrate, the display substrate comprising a display area and a bonding area located on one side of the display area, wherein the preparing method comprises:

forming a circuit structure layer on a base substrate, wherein the circuit structure layer comprises a circuit structure layer in the display area and a circuit structure layer in the bonding area, the circuit structure layer of the display area is provided with a pixel driving circuit, and the pixel driving circuit comprises a plurality of transistors, the circuit structure layer of the display area comprises a plurality of insulating layers, the circuit structure layer of the bonding area comprises a plurality of insulating layers and a bonding electrode, the plurality of insulating layers in the circuit structure layer of the bonding area comprises a composite insulating layer disposed on a side of the bonding electrode away from the base substrate, and the composite insulating layer is provided with a groove exposing a surface of the bonding electrode away from the base substrate;

forming a filling layer in the groove, wherein a surface of the filling layer is disposed flush with a surface of the composite insulating layer around the groove and away from the base substrate; the bonding electrode and the filling layer form a pad, and the pad is configured to be bonded and connected to an external circuit board; and

forming a light emitting structure layer on the circuit structure layer of the display area, wherein the light emitting structure layer comprises a light emitting device connected to the pixel driving circuit,

wherein the plurality of insulating layers of the circuit structure layer of the bonding area each is arranged in a same layer as a corresponding insulating layer in the plurality of insulating layers of the circuit structure layer of the display area;

wherein a number of the plurality of insulating layers of the circuit structure layer of the bonding area is less than a number of the plurality of insulating layers of the circuit structure layer of the display area,

wherein a bottom surface, facing the base substrate, of an insulating layer, farthest from the base substrate, of the plurality of insulating layers in the circuit structure layer of the bonding area is flush with a bottom surface, facing to the base substrate, of an insulating layer, farthest from the base substrate, of the plurality of insulating layers in the circuit structure layer of the display area;

wherein a top surface, facing away from the base substrate, of the insulating layer, farthest from the base substrate, of the plurality of insulating layers in the circuit structure layer of the bonding area is not flush with a top surface, facing away from the base substrate, of the insulating layer, farthest from the base substrate, of the plurality of insulating layers in the circuit structure layer of the display area; and

wherein a thickness of the insulating layer farthest from the base substrate in the circuit structure layer of the bonding area is less a thickness of the insulating layer farthest from the base substrate in the circuit structure layer of the display area.

Assignments (1)

Continuity (1)

References Cited (20)