Apparatus and method for forming thin film
Provided are an apparatus and method for forming a thin film. The apparatus for forming a thin film include a chamber configured to define a substrate processing space therein, a substrate support part connected to the chamber to support a substrate inside the chamber, a heat source part connected to the chamber to face the substrate support part, and a plasma generation part connected to the chamber to supply radicals between the substrate support part and the heat source part at at least two points.
1. An apparatus for forming a thin film, the apparatus comprising:
a chamber provided in a hollow shape having a width, a thickness, and a height, and configured to define a substrate processing space therein;
a substrate support part connected to the chamber to support a substrate inside the chamber;
a heat source part connected to the chamber to face the substrate support part;
at least two injection ports passing through a sidewall of the chamber in one direction of the width and thickness directions of the chamber;
an exhaust port passing through the sidewall of the chamber at a side facing the at least two injection ports of the one direction; and
a plasma generation part connected to the chamber to supply radicals between the substrate support part and the heat source part through the at least two injection ports;
wherein one injection port of the two injection ports is disposed in the one direction toward the center of the substrate to supply the radicals through a first path comprising a central portion of the substrate, and the other injection port is disposed in the one direction toward the edge of the substrate to supply the radicals through a second path comprising the edge of the substrate,
wherein the exhaust port comprises first exhaust ports having a spaced distance greater than a diameter of the substrate support part in the other direction of the width and thickness directions of the chamber.
2. The apparatus of claim 1 , wherein the processing space is defined to have a height less than each of a width and a thickness thereof.
3. The apparatus of claim 2 , wherein the at least two injection ports are disposed at the same height in the height direction of the chamber.
4. The apparatus of claim 2 , wherein the at least two injection ports are disposed parallel to each other, or at least one of the at least two injection ports is disposed to be inclined in a horizontal direction.
5. The apparatus of claim 2 , wherein the substrate support part comprises a substrate support that is rotatable and installed inside the chamber, and a spaced distance of the injection portions is less than a radius of the substrate support.
6. The apparatus of claim 2 , further comprising a guide member disposed inside the chamber to define a passage communicating with each of the at least two injection ports.
7. The apparatus of claim 2 , wherein the exhaust port further comprises:
a second exhaust port disposed between the first exhaust ports.
8. The apparatus of claim 2 , wherein the plasma generation part comprises:
a plurality of plasma generators configured to generate radicals; and
at least two connection tubes configured to connect the plurality of plasma generators to the at least two injection ports, respectively.
9. The apparatus of claim 2 , wherein the plasma generation part comprises:
a plasma generator configured to generate radicals;
a connection tube configured to connect the plasma generator to the at least two injection ports; and
at least two branch tubes connected to the connection tube and connected to the at least two injection ports, respectively.
10. The apparatus of claim 9 , wherein the plasma generation part comprises a flow regulation member installed in at least one of the two branch tubes.
11. The apparatus of claim 9 , wherein the plasma generation part comprises a heating member installed on the connection tube or the at least two branch tubes.
12. A method for forming a thin film, the method comprising:
loading a substrate into a chamber and seating the substrate on a substrate support part;
heating the substrate;
generating radicals;
supplying the radicals to one side of the substrate in a direction parallel to the substrate through at least two paths;
allowing the radicals to be in contact with the substrate so as to form a thin film; and
exhausting residual radicals to the other side of the substrate,
wherein the chamber is provided in a hollow shape having a width, a thickness, and a height,
wherein the supplying of the radicals comprises:
supplying the radicals through a first path from one injection port, which is provided toward the center of the substrate, of at least two injection ports passing through a sidewall of the chamber in a width or thickness direction of the chamber, wherein the first path comprises a central portion of the substrate from one side to the other side of the chamber; and
supplying the radicals through a second path from the other injection port provided toward an edge of the substrate, wherein the second path comprises the edge of the substrate,
wherein the exhausting of the residual radicals comprises exhausting the residual radicals through first exhaust ports of an exhaust port passing through the chamber at a side facing the at least two injection ports, wherein the first exhaust ports have a spaced distance greater than a diameter of the substrate support part.
13. The method of claim 12 , wherein the supplying of the radicals comprises supplying the radicals at the same height in a direction in which the substrate extends.
14. The method of claim 12 , wherein the supplying of the radicals comprises:
generating the radicals outside the chamber; and
transferring the radicals to the chamber,
wherein the transferring of the radicals comprises adjusting a temperature of the radicals.
15. The method of claim 12 , wherein the supplying of the radicals comprises regulating a flow rate of the radicals supplied to each of at least two paths.
16. The method of claim 12 , wherein the exhausting of the residual radicals further comprises:
exhausting the residual radicals through a second exhaust port disposed between the first exhaust ports; and
adjusting at least one of a position, at which the residual radicals are exhausted, of the first exhaust ports and the second exhaust port, or an amount of the residual radicals to be exhausted.