POLYAMIDE COMPOSITION
The present invention relates to a polyamide, to a composition comprising same, and to the use thereof, and also to a molded article deriving therefrom and to a process for producing same. The polyamide is particularly suitable as hot-melt adhesive for the low-pressure and low-temperature overmolding of a heat-sensitive battery, for example a lithium-polymer battery.
1 - 15 . (canceled)
16 . A polyamide which is the product of polycondensation of an acid component and of an amine component,
the acid component comprising, per mole of acid component:
from 25 to 50 mol% of at least one fatty acid dimer;
from 46 to 70 mol% of at least one aliphatic diacid; and
from 0 to 11 mol% of at least one chain limiter;
the amine component comprising, per mole of amine component:
from 13 to 29 mol% of at least one aliphatic diamine;
from 66 to 82 mol% of at least one cycloaliphatic diamine; and
from 0 to 15 mol% of at least one polyetheramine;
the polyamide comprising a —COOH/(—NH and/or —NH 2 ) molar ratio of from 1.00 to 1.20.
17 . The polyamide as claimed in claim 16 , wherein the fatty acid dimer is a product of a reaction for coupling unsaturated monocarboxylic acids.
18 . The polyamide as claimed in claim 16 , wherein the aliphatic diacid is selected from the group consisting of saturated aliphatic dicarboxylic acids.
19 . The polyamide as claimed in claim 16 , wherein the chain limiter comprises monocarboxylic acids, anhydrides, monohalogenated acids, monoesters or monoisocyanates.
20 . The polyamide as claimed in claim 16 , wherein the aliphatic diamine comprises linear or branched, saturated aliphatic diamines.
21 . The polyamide as claimed in claim 16 , wherein the cycloaliphatic diamine is selected from the group consisting of bis(3,5-dialkyl-4-aminocyclohexyl)methane, bis(3,5-dialkyl-4-aminocyclohexyl)ethane, bis(3,5-dialkyl-4-aminocyclohexyl)propane, bis(3,5-dialkyl-4-aminocyclohexyl)butane, bis(3-methyl-4-aminocyclohexyl)methane (BMACM or MACM), bis(p-aminocyclohexyl)methane (PACM), isopropylidenedi(cyclohexylamine) (PACP), isophoronediamine, piperazine, aminoethylpiperazine, norbornyl methane, cyclohexylmethane, dicyclohexylpropane, di(methylcyclohexyl), di(methylcyclohexyl) propane, 1,4-cyclohexanediamine, 4,4′-diamino-dicyclohexylmethane, piperazine, cyclohexane-bis-(methylamine), isophoronediamine (IPDA), dimethylpiperazine, dipiperidylpropane, norbornanediamine, and mixtures thereof.
22 . The polyamide as claimed in claim 16 , wherein the polyetheramine is selected from the group consisting of polyoxyalkylenediamines with a number-average molecular weight (Mn) ranging from 200 to 4000 g/mol.
23 . The polyamide as claimed in claim 16 , wherein the polyamide is a product of polycondensation of an acid component and of an amine component,
the acid component comprising, per mole of acid component:
from 35 to 50 mol% of at least one fatty acid dimer;
from 52 to 70 mol% of at least one aliphatic diacid; and
from 2 to 5 mol% of at least one chain limiter;
the amine component comprising, per mole of amine component:
from 19 to 23 mol% of at least one aliphatic diamine, which is ethylenediamine;
from 72 to 76 mol% of at least one cycloaliphatic diamine, which is piperazine; and
from 3 to 5 mol% of at least one polyetheramine, which is polyoxypropylenediamine;
the polyamide comprising a —COOH/(—NH and/or —NH 2 ) molar ratio of from 1.07 to 1.11.
24 . A composition comprising the polyamide as defined in claim 16 .
25 . The composition as claimed in claim 24 , comprising at least one additive selected from the group consisting of fillers, antioxidants or stabilizers, mold-release agents, adhesion promoters, pigments and mixtures thereof.
26 . The composition as claimed in claim 24 , wherein the polyamide composition has a viscosity of 10,000 mPa.s or less at a temperature of 150° C.
27 . The composition as claimed in claim 24 , wherein the polyamide composition has a softening point of 150° C. or less.
28 . A molded article comprising an insert and the polyamide composition as claimed in claim 24 , said insert being overmolded at least in part by the polyamide composition.
29 . A process for producing a molded article, comprising the following steps:
providing a mold;
inserting an insert into the mold;
heating a polyamide composition to a temperature of 150° C. or less, in order to obtain a molten polyamide composition;
injecting the molten polyamide composition at a pressure of from 0.5 × 10 5 to 50 × 10 5 Pa;
cooling the injected polyamide composition;
optionally removing the obtained molded article from the mold.
30 . A hot-melt adhesive for low-pressure overmolding of a heat-sensitive battery comprising the polyamide of claim 16 .
31 . The polyamide as claimed in claim 17 , wherein the fatty acid dimer is a product of a reaction for coupling unsaturated monocarboxylic acids, wherein the unsaturated monocarboxylic acids are selected from the group consisting of unsaturated monocarboxylic acids comprising from 10 to 22 carbon atoms.
32 . The polyamide as claimed in claim 18 , wherein the aliphatic diacid is selected from the group consisting of succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, brassylic acid, tetradecanedioic acid, pentadecanedioic acid, thapsic acid, and mixtures thereof.
33 . The polyamide as claimed in claim 19 , wherein the chain limiter comprises a monocarboxylic acid.
34 . The polyamide as claimed in claim 20 , wherein the aliphatic diamine is selected from the group consisting of ethylenediamine, propanediamine, butanediamine, pentanediamine, hexanediamine, decanediamine and mixtures thereof.