Method of producing resin and method of producing insulating structure
A resin producing method is a method of producing a resin with which an insulating structure formed on an outer peripheral portion of a conductor is impregnated. The resin producing method includes a dispersion liquid mixing step of mixing an epoxy resin and a dispersion liquid in which a nanofiller is dispersed in a reactive diluent that reduces a viscosity of the epoxy resin by reacting with the epoxy resin, and a curing agent mixing step of mixing a composition produced by the dispersion liquid mixing step, with a curing agent that cures the epoxy resin. The epoxy resin includes, for example, an alicyclic epoxy resin.
1. A method of producing a resin with which an insulating structure formed on an outer peripheral portion of a conductor is impregnated, the method comprising:
a dispersion liquid mixing step of mixing an epoxy resin with a dispersion liquid in which a nanofiller is dispersed in a reactive diluent that reduces a viscosity of the epoxy resin by reacting with the epoxy resin; and
a curing agent mixing step of mixing a composition produced by the dispersion liquid mixing step, with a curing agent that cures the epoxy resin.
2. The method of producing a resin according to claim 1 , wherein
the epoxy resin includes an alicyclic epoxy resin.
3. The method of producing a resin according to claim 2 , wherein
the reactive diluent includes butyl glycidyl ether.
4. The method of producing a resin according to claim 1 , wherein
a particle diameter of the nanofiller in the dispersion liquid is 50 nm or less.
5. The method of producing a resin according to claim 1 , wherein
a content of the nanofiller with respect to an entire mixture other than the nanofiller included in the resin is 2 wt % to 30 wt %.
6. The method of producing a resin according to claim 2 , wherein
a particle diameter of the nanofiller in the dispersion liquid is 50 nm or less.
7. The method of producing a resin according to claim 3 , wherein
a particle diameter of the nanofiller in the dispersion liquid is 50 nm or less.
8. The method of producing a resin according to claim 2 , wherein
a content of the nanofiller with respect to an entire mixture other than the nanofiller included in the resin is 2 wt % to 30 wt %.
9. The method of producing a resin according to claim 3 , wherein
a content of the nanofiller with respect to an entire mixture other than the nanofiller included in the resin is 2 wt % to 30 wt %.
10. The method of producing a resin according to claim 4 , wherein
a content of the nanofiller with respect to an entire mixture other than the nanofiller included in the resin is 2 wt % to 30 wt %.
11. The method of producing a resin according to claim 6 , wherein
a content of the nanofiller with respect to an entire mixture other than the nanofiller included in the resin is 2 wt % to 30 wt %.
12. The method of producing a resin according to claim 7 , wherein
a content of the nanofiller with respect to an entire mixture other than the nanofiller included in the resin is 2 wt % to 30 wt %.
13. A method of producing an insulating structure formed on an outer peripheral portion of a conductor, the method comprising:
a resin production step of producing a resin including a nanofiller; and
a step of impregnating a non-conductive tape-shaped member wound around an outer peripheral portion of the conductor, with the resin, wherein
the resin production step includes
a dispersion liquid mixing step of mixing an epoxy resin with a dispersion liquid in which the nanofiller is dispersed in a reactive diluent that reduces a viscosity of the epoxy resin by reacting with the epoxy resin, and
a curing agent mixing step of mixing a composition produced by the dispersion liquid mixing step, with a curing agent that cures the epoxy resin.
14. The method of claim 13 , wherein
the epoxy resin includes an alicyclic epoxy resin.
15. The method of claim 14 , wherein
the reactive diluent includes butyl glycidyl ether.
16. The method of claim 13 , wherein
a particle diameter of the nanofiller in the dispersion liquid is 50 nm or less.
17. The method of claim 13 , wherein
a content of the nanofiller with respect to an entire mixture other than the nanofiller included in the resin is 2 wt % to 30 wt %.