IP Library › Granted Patent US 12,241,668
Granted Patent B2
US 12,241,668 · App. 18/043,601 · Granted Mar 4, 2025

Heat management system

Inventor: Tomonori Haraguchi (Isesaki, JP)
Assignee: SANDEN CORPORATION
F25B41/42B60H1/00885B60H1/32284B60K11/02F25B25/005F25B29/003B60K1/00B60K2001/003B60K2001/005B60K2001/006F25B2339/047
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Quick Facts
Patent No.
US 12,241,668
App. No.
18/043,601
Granted
Mar 4, 2025
Kind
B2
Abstract

A heat management system includes: a refrigerant circuit; a high-temperature heat medium circuit through which heat medium is heated to a high temperature by heat released from the refrigerant, and circulated; a low-temperature heat medium circuit through which heat medium is cooled to a low temperature by absorbing heat into the refrigerant, and circulated; a temperature adjustment heat exchanger to adjust a temperature of a heat management subject; a heat medium mixer connected to an upstream side of the temperature adjustment heat exchanger to mix high-temperature heat medium and low-temperature heat medium at a ratio depending on a target temperature of the heat management subject; and a branch connected to a downstream side of the temperature adjustment heat exchanger to return the heat medium having gone through the temperature adjustment heat exchanger to the high-temperature heat medium circuit and the low-temperature heat medium circuit.

Claims (11)

1. A heat management system comprising:

a refrigerant circuit through which a refrigerant is circulated;

a high-temperature heat medium circuit through which heat medium pumped from a first pump is heated by heat released from the refrigerant, and circulated;

a low-temperature heat medium circuit through which heat medium pumped from a second pump is cooled by absorbing heat into the refrigerant, and circulated;

a temperature adjustment heat exchanger configured to adjust a temperature of a heat management subject;

a heat medium mixer connected to an upstream side of the temperature adjustment heat exchanger, and configured to mix high-temperature heat medium from the high-temperature heat medium circuit and low-temperature heat medium from the low-temperature heat medium circuit at a ratio depending on a target temperature of the heat management subject; and

a branching point provided at a downstream side of the temperature adjustment heat exchanger, and configured to return the heat medium from the temperature adjustment heat exchanger to the high-temperature heat medium circuit and the low-temperature heat medium circuit wherein:

a first part of the heat medium branched at the branching point is returned to the high-temperature heat medium circuit through a first connector upstream of the first pump;

a second part of the heat medium branched at the branching point is returned to the low-temperature heat medium circuit through a second connector upstream of the second pump; and

a check valve is provided in each of the flow paths between the branching point and the first connector and between the branching point and the second connector.

2. The heat management system according to claim 1 , wherein the heat medium mixer is provided for each of a plurality of heat management subjects.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2023
From: HARAGUCHI, TOMONORI
To: SANDEN CORPORATION
Reel/Frame 062839/0147 →
Priority Claims (1)
JP 2020-158973 · Sep 23, 2020 · national
Continuity (1)
Related Publication 20230349606A1 · Nov 2, 2023
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