System for thermal management of storage devices
Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, a data processing system may include hardware components that provide the computer implemented services. Any of the hardware components may have thermal limitations. To mitigate the impact of the thermal limitations, the data processing system may include host circuit card integrated heating assemblies. The heating assemblies may be used to warm hardware components of devices connected to the host circuit card. When connected to the host circuit card, a thermal conduction path between a device and a heating assembly may be established.
1 . A data processing system for providing computer implemented services, comprising:
a storage device comprising:
an edge connector, and
a hardware component for storing data;
a host circuit card;
an edge connector receptacle positioned on the host circuit card and adapted to reversibly receive the storage device; and
a heating assembly positioned on the host circuit card and with the edge connector to be between the host circuit card and the storage device while the edge connector is connected to the edge connector receptacle, the heating assembly being adapted to:
monitor a temperature of the hardware component, and
selectively generate heat to warm the hardware component substantially by conduction heating.
2 . The data processing system of claim 1 , wherein the heating assembly comprises:
a heating element adapted to selectively generate the heat.
3 . The data processing system of claim 2 , wherein the heating assembly further comprises:
a temperature sensor to monitor the temperature of the hardware component.
4 . The data processing system of claim 3 , wherein the heating assembly further comprises:
a heat transfer layer, positioned, at least in part, on the heating element, the heat transfer layer comprising a thermally conductive and compliant material that conforms a shape of the heat transfer layer to a shape of the storage device.
5 . The data processing system of claim 4 , wherein connecting the edge connector to the edge connector receptacle comprises:
an approach of the edge connector along a straight path toward the edge connector receptacle until electrodes of the edge connector are seated with complementary electrodes of the edge connector receptacle; and
a rotation of the storage device about the edge connector, the rotation placing the storage device in contact with the heat transfer layer.
6 . The data processing system of claim 1 , wherein the storage device further comprises:
a circuit card, the edge connector and the hardware component being positioned with the circuit card.
7 . The data processing system of claim 6 , wherein while the edge connector is connected to the edge connector receptacle, the host circuit card is positioned a distance away from the circuit card, and the circuit card and the host circuit card are positioned in substantially parallel planes separated by the distance.
8 . The data processing system of claim 7 , wherein, while the edge connector is connected to the edge connector receptacle:
the hardware component is positioned on a first surface on a first side of the circuit card,
a second surface on a second side of the circuit card is proximate to the heating assembly, and
the first side is opposite to the second side.
9 . The data processing system of claim 8 , wherein, while the edge connector is connected to the edge connector receptacle:
the heating assembly is in thermal communication with the hardware component via a conduction path that comprises the circuit card.
10 . The data processing system of claim 9 , wherein the storage device further comprises:
a heat management enclosure that is in contact with the heating assembly while the edge connector is connected to the edge connector receptacle.
11 . The data processing system of claim 1 , further comprising:
a processor operably connected to the edge connector receptacle,
wherein while the edge connector is connected to the edge connector receptacle, the storage device is operably connected to the processor.
12 . The data processing system of claim 11 , wherein the processor is adapted to access data stored in the hardware component when providing at least a portion of the computer implemented services.
13 . The data processing system of claim 1 , further comprising:
a second edge connector receptacle positioned on the host circuit card and adapted to reversibly receive the storage device; and
a second heating assembly positioned on the host circuit card and with the second edge connector receptacle to be between the host circuit card and the storage device while the edge connector is connected to the second edge connector receptacle.
14 . The data processing system of claim 13 , wherein the heating assembly and the second heating assembly are positioned on opposite sides of the host circuit card.
15 . A circuit card assembly, comprising:
a host circuit card;
an edge connector receptacle positioned on the host circuit card and adapted to reversibly receive an edge connector of a device; and
a heating assembly positioned on the host circuit card and with the edge connector to be between the host circuit card and the device while the edge connector is connected to the edge connector receptacle, the heating assembly being adapted to:
monitor a temperature of the device, and
selectively generate heat to warm the device substantially by conduction heating.
16 . The circuit card assembly of claim 15 , wherein the heating assembly comprises:
a heating element adapted to selectively generate the heat.
17 . The circuit card assembly of claim 16 , wherein the heating assembly further comprises:
a temperature sensor to monitor the temperature of the device.
18 . The circuit card assembly of claim 17 , wherein the heating assembly further comprises:
a heat transfer layer, positioned, at least in part, on the heating element, the heat transfer layer comprising a thermally conductive and compliant material that conforms a shape of the heat transfer layer to a shape of the device.
19 . The circuit card assembly of claim 18 , further comprising:
a second edge connector receptacle positioned on the host circuit card and adapted to reversibly receive the device; and
a second heating assembly positioned on the host circuit card and with the second edge connector receptacle to be between the host circuit card and the device while the edge connector is connected to the second edge connector receptacle.
20 . The circuit card assembly of claim 19 , wherein the heating assembly and the second heating assembly are positioned on opposite sides of the host circuit card.