Ceramic electronic component and method of manufacturing the same
A ceramic electronic component includes a multilayer chip in which dielectric layers, which contain ceramic as a main component, and internal electrode layers, which contain a first metal as a main component, are alternately stacked, wherein one face of first and second faces opposite to each other in a stack direction of each of the internal electrode layers is covered with a metal oxide film of a second metal that is more easily oxidized than the first metal and the other face of the first and second faces is not covered with the metal oxide film, or the one face is covered with the metal oxide film and an area of the metal oxide film covering the other face is smaller than an area of the metal oxide film covering the one face.
1. A ceramic electronic component comprising:
a multilayer chip in which dielectric layers, which contain ceramic as a main component, and internal electrode layers, which contain a first metal as a main component, are alternately stacked,
wherein each of the internal electrode layers has a first face and a second face opposite to the first face in a same stack direction of the internal electrode layers, and each of the first face and the second face of each of the internal electrode layers is covered with a metal oxide film of a second metal that is more easily oxidized than the first metal, wherein an area of the metal oxide film covering the second face is smaller than an area of the metal oxide film covering the first face.
2. The ceramic electronic component according to claim 1 , wherein the first metal is nickel.
3. The ceramic electronic component according to claim 1 , wherein the metal oxide film is a chromium oxide film.
4. The ceramic electronic component according to claim 1 , wherein a ratio of the metal oxide film to each corresponding internal electrode layer is 0.1 at % to 5 at %.
5. The ceramic electronic component according to claim 4 , wherein a ratio of the metal oxide film to each corresponding internal electrode layer is 3 at % or less.
6. The ceramic electronic component according to claim 4 , wherein a ratio of the metal oxide film to each corresponding internal electrode layer is 1.5 at % or less.
7. The ceramic electronic component according to claim 1 , wherein the area of the metal oxide film covering the second face is equal to or less than ½ of the area of the metal oxide film covering the first face.
8. The ceramic electronic component according to claim 1 , wherein the internal electrode layers are constituted by an internal electrode material containing the first metal, wherein an entire area of the first face of each of the internal electrode layers, which is constituted by the internal electrode material, is covered with the metal oxide film of the second metal.
9. A ceramic electronic component comprising:
a multilayer chip in which dielectric layers, which contain ceramic as a main component, and internal electrode layers, which are constituted by an internal electrode material containing a first metal as a main component, are alternately stacked,
wherein each of the internal electrode layers has a first face and a second face opposite to the first face in a same stack direction of the internal electrode layers, wherein an entire area of the first face of each of the internal electrode layers, which is constituted by the internal electrode material, is covered with a metal oxide film of a second metal that is more easily oxidized than the first metal, and the second face of each of the internal electrode layers is not covered with the metal oxide film.
10. The ceramic electronic component according to claim 9 , wherein the first metal is nickel.
11. The ceramic electronic component according to claim 9 , wherein the metal oxide film is a chromium oxide film.
12. The ceramic electronic component according to claim 9 , wherein a ratio of the metal oxide film to each corresponding internal electrode layer is 0.1 at % to 5 at %.
13. The ceramic electronic component according to claim 12 , wherein a ratio of the metal oxide film to each corresponding internal electrode layer is 3 at % or less.
14. The ceramic electronic component according to claim 12 , wherein a ratio of the metal oxide film to each corresponding internal electrode layer is 1.5 at % or less.