Photochemical and thermal release layer processes and uses in device manufacturing
A process for transferring a component from a release layer by exposing the release layer to light and heat from different sources is described. The process includes providing an assembly comprising a substrate, a release layer and a component, heating the release layer and exposing the release layer to an actinic wavelength of light, wherein the heating source and the actinic irradiation source are different sources.
1 . A process for transferring a component, comprising:
providing an assembly comprising a substrate, a release layer and a component, wherein the release layer is disposed over the substrate and the component is adhered to the release layer;
heating the release layer from a heating source to at least a decomposition temperature, wherein the heating is selected from the group consisting of a conductive heating, a radiative heating, and combinations thereof; and
exposing the release layer to an actinic wavelength of light from an actinic irradiation source;
wherein the release layer comprises a photo enhanced decomposition compound selected from at least one of a polymer and an oligomer, and wherein the photo enhanced decomposition compound is configured to decompose when heated and exposed to the actinic wavelength of light;
wherein the heating and exposing steps degrade the release layer and transfer the component from the substrate to a target substrate;
wherein the heating source and the actinic irradiation source are different sources; and
wherein at least one of the heating and exposing steps are performed within a pulse period.
2 . The process of claim 1 , wherein the heating comprises radiative heating with a radiative wavelength of light, wherein the overlap between the radiative wavelength and actinic wavelength is at most 20%.
3 . The process of claim 2 , wherein the radiative heating is at a radiative wavelength selected from the group consisting of a UV wavelength, a visible wavelength, an IR wavelength, a microwave wavelength, and combinations thereof.
4 . The process of claim 2 , wherein the radiative heating is at a radiative wavelength of about 300 nm to about 100000 nm.
5 . The process of claim 2 , wherein the substrate comprises a donor plate and a light absorbing material.
6 . The process of claim 5 , wherein the light absorbing material is selected from the group consisting of Nd 2 O 3 , Sm 2 O 3 , V 2 O 3 , CoO, NiO, MnO 2 , a polycarbonate compound, an aromatic compound, and combinations thereof.
7 . The process of claim 2 , wherein the radiative heating is applied from a side edge of the assembly.
8 . The process of claim 1 , wherein the decomposition temperature is about 100° C. to about 350° C.
9 . The process of claim 1 , further comprising heating the release layer to a first temperature prior to heating the release layer to the decomposition temperature.
10 . The process of claim 9 , wherein the first temperature is about 100° C. to about 350° C.
11 . The process of claim 1 , wherein the pulse period is about 10 ns to about 10 μs.
12 . The process of claim 1 , wherein the heating step is performed prior to the exposing step.
13 . The process of claim 1 , wherein the heating step is performed subsequent to the exposing step.
14 . The process of claim 1 , wherein the heating step is performed concurrently with the exposing step.
15 . The process of claim 1 , wherein the actinic wavelength of light is selected from the group consisting of a UV wavelength, a visible wavelength, and combinations thereof.
16 . The process of claim 1 , wherein the actinic wavelength of light is about 200 nm to about 400 nm.
17 . The process of claim 1 , wherein the actinic irradiation source comprises a power density of about 10 mJ/cm 2 to about 200 mJ/cm 2 .
18 . The process of claim 1 , wherein the heating is applied directly to the release layer.
19 . The process of claim 1 , wherein the heating is applied directly to the component, and the components heats the release layer to the decomposition temperature.
20 . The process of claim 1 , wherein the heating is applied directly to the substrate, and the substrate heats the release layer to the decomposition temperature.
21 . The process of claim 1 , wherein the assembly further comprises a conductive heating source.
22 . The process of claim 21 , wherein the conductive heating source comprises a transparent conductive heating source.
23 . The process of claim 22 , wherein the transparent conductive heating source is selected from the group consisting of ITO, β-Ga 2 O 3 , gold, silver, La-doped SrSnO 3 , and combinations thereof.
24 . The process of claim 1 , wherein a thermal decomposition temperature of the photo enhanced decomposition compound decreases to at most the decomposition temperature when exposed to the actinic wavelength of light.
25 . The process of claim 1 , wherein the photo enhanced decomposition compound comprises a linkage and a core unit comprising a tetralin core, a cyclohexene core, copolymers thereof, and combinations thereof.
26 . The process of claim 1 , wherein the release layer further comprises a photoactive sensitizer.
27 . A process for transferring a component, comprising:
providing an assembly comprising a substrate, a release layer and a component, wherein the release layer is disposed over the substrate and the component is adhered to the release layer;
heating the release layer from a heating source to at least a decomposition temperature, wherein the heating is selected from the group consisting of a conductive heating, a radiative heating and combinations thereof, and wherein the decomposition temperature is about 180° C. to about 220° C.; and
exposing the release layer to an actinic wavelength of light from an actinic irradiation source, wherein the actinic wavelength of light is a wavelength of about 230 nm to about 360 nm;
wherein the release layer comprises a photo enhanced decomposition compound selected from at least one of a polymer and an oligomer, wherein the photo enhanced decomposition compound comprises a linkage and a core unit comprising a tetralin core, a cyclohexene core, copolymers thereof, and combinations thereof, and wherein the photo enhanced decomposition compound is configured to decompose when heated and exposed to the actinic wavelength of light;
wherein the heating and exposing steps degrade the release layer and transfer the component from the substrate to a target substrate;
wherein the heating source and the actinic irradiation source are different sources; and
wherein at least one of the heating and exposing steps are performed within a pulse period of about 10 ns to about 10 μs.
28 . An assembly for transferring a component, comprising:
a substrate;
a plurality of heating sources disposed over the substrate; and
a release layer disposed over the plurality of heating sources.
29 . The assembly of claim 28 , further comprising a nanoporous material disposed between the substrate and the plurality of heating sources.
30 . An assembly for transferring a component, comprising:
a substrate;
a light absorbing layer disposed over the substrate;
a first cladding layer disposed over the light absorbing layer; and
a release layer disposed over the first cladding layer.
31 . The assembly of claim 30 , further comprising a second cladding layer disposed between the substrate and the light absorbing layer.
32 . The assembly of claim 30 , wherein the light absorbing layer is a graded light absorbing layer.