Heat dissipation device
A heat dissipation device includes an aluminum base seat and any or both of at least one copper two-phase fluid component and a copper heat conduction component. The aluminum base seat has an upper face and a lower face. A connection section is formed on the lower face and a copper embedding layer is disposed on the connection section. Any or both of the copper two-phase fluid component and the copper heat conduction component are disposed on the connection section and connected with the copper embedding layer. By means of the copper embedding layer disposed on the connection section, the aluminum base seat can be directly welded and connected with the copper two-phase fluid component and/or the copper heat conduction component made of heterogeneous metal materials without chemical nickel treatment procedure.
1 . A heat dissipation device comprising:
an aluminum base seat having an upper face and a lower face, a connection section being defined on the lower face;
a copper embedding layer being disposed on the connection section with a direct copper-to-aluminum metallurgical bond, the copper embedding layer having an embedding face and a surface contact face, the surface contact face facing outward from the connection section, and the embedding face being inlaid in the connection section, wherein the copper embedding layer is formed by mechanical processing, surface treatment, or chemical processing to ensure structural integrity with the aluminum base seat; and
a copper two-phase fluid component disposed in the connection section, where, by means of the copper embedding layer disposed on the connection section, the copper two-phase fluid component is directly welded and connected with the aluminum base seat without chemical nickel treatment.
2 . The heat dissipation device as claimed in claim 1 , wherein the lower face has at least one receiving channel and the connection section is disposed in the receiving channel, the copper two-phase fluid component being a heat pipe embedded in the receiving channel, the copper two-phase fluid component being connected with the copper embedding layer in the receiving channel.
3 . The heat dissipation device as claimed in claim 2 , further comprising a copper heat conduction component, the copper heat conduction component having a heat conduction face connected with the copper embedding layer of the lower face and one face of the copper two-phase fluid component.
4 . The heat dissipation device as claimed in claim 1 , wherein the copper embedding layer is connected and formed on the connection section by means of mechanical processing, surface treatment or chemical processing.
5 . The heat dissipation device as claimed in claim 1 , wherein multiple radiating fins are disposed on the upper face of the aluminum base seat.