IP Library Granted Patent US 12,347,624
Granted Patent B2
US 12,347,624 · App. 18/071,205 · Granted Jul 1, 2025

Multilayer capacitor having internal electrodes including an alloy

Inventors: Soo Jeong Jo (Suwon-si, KR); Dae Hee Lee (Suwon-si, KR); Hyo Jin Kim (Suwon-si, KR); Jong Ho Lee (Suwon-si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01G4/30H01G4/008H01G4/012H01G4/12H01G4/2325
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Quick Facts
Patent No.
US 12,347,624
App. No.
18/071,205
Granted
Jul 1, 2025
Kind
B2
Abstract

A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and including a first conductive metal and external electrodes disposed on an external surface of the body and including a second conductive metal, wherein the ratio of internal electrodes including an alloy region of the first and second conductive metals to the plurality of internal electrodes is 40 to 80%.

Claims (19)

1. A multilayer capacitor comprising:

a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and including a first conductive metal; and

external electrodes disposed on an external surface of the body and including a second conductive metal,

wherein a ratio of internal electrodes including an alloy region of the first and second conductive metals to the plurality of internal electrodes is 40 to 80%,

wherein a detection intensity of the second conductive metal of the alloy region by electron probe micro analysis (EPMA) is 40% or more of a detection intensity of the second conductive metal of the external electrodes by EPMA, and

wherein the plurality of internal electrodes includes 400 or more layers of internal electrodes.

2. The multilayer capacitor of claim 1 , wherein the alloy region is disposed at an end portion of the internal electrodes connected to one of the external electrodes.

3. The multilayer capacitor of claim 1 , wherein the detection intensity of the second conductive metal of the alloy region is measured in a region within 3 μm from an interface between the internal electrodes and one of the external electrodes toward the internal electrodes.

4. The multilayer capacitor of claim 1 , wherein the alloy region is a region in which the second conductive metal is diffused toward the internal electrodes.

5. The multilayer capacitor of claim 1 , wherein one end of the alloy region connected to one of the external electrodes has a proportion of the second conductive metal higher than a proportion of the other end of the alloy region.

6. The multilayer capacitor of claim 1 , wherein lengths of the alloy regions of at least two of the plurality of internal electrodes are different from each other.

7. The multilayer capacitor of claim 1 , wherein the first conductive metal includes nickel (Ni).

8. The multilayer capacitor of claim 1 , wherein the second conductive metal includes copper (Cu).

9. The multilayer capacitor of claim 1 , wherein the alloy region includes an Ni—Cu alloy.

10. The multilayer capacitor of claim 1 , further comprising a plating layer disposed on at least one of the external electrodes.

11. The multilayer capacitor of claim 10 , wherein the plating layer includes a nickel (Ni) plating layer and a tin (Sn) plating layer sequentially stacked on the at least one of the external electrodes.

12. The multilayer capacitor of claim 1 , wherein a thickness of the plurality of internal electrodes is in a range of 0.2 to 1.0 μm.

13. The multilayer capacitor of claim 1 , wherein the alloy region directly contacts the external electrode.

14. The multilayer capacitor of claim 1 , wherein the multilayer capacitor is formed at a firing temperature of 600 to less than 700° C.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2022
From: JO, SOO JEONG; LEE, DAE HEE; KIM, HYO JIN; LEE, JONG HO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 061914/0055 →
Priority Claims (1)
KR 10-2021-0188006 · Dec 27, 2021 · national
Continuity (1)
Related Publication 20230207217A1 · Jun 29, 2023
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