IP Library Granted Patent US 12,476,027
Granted Patent B2
US 12,476,027 · App. 18/071,866 · Granted Nov 18, 2025

Resistor and its manufacturing method

Inventor: Keisuke Fukuchi (Tokyo, JP)
Assignee: Proterial Ltd.
H01C1/028H01C1/08H01C1/148H01C17/00
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Quick Facts
Patent No.
US 12,476,027
App. No.
18/071,866
Granted
Nov 18, 2025
Kind
B2
Abstract

A resistor is composed of a resistor body part and a molded resin in which the resistor body part is embedded. The molded resin includes a base resin and a filler that is higher in thermal conductivity than the base resin.

Claims (15)

1 . A resistor, comprising:

a resistor body part; and

a molded resin in which the resistor body part is embedded,

wherein the molded resin comprises a base resin and a filler having a higher thermal conductivity than the base resin,

wherein the resistor body part comprises a resistive element and a pair of plate terminals electrically connected to the resistive element, and at least a portion of each of the pair of plate terminals is exposed from the molded resin, and

wherein at least one of the pair of plate terminals comprises a facing portion inside the molded resin, which faces the resistive element through a portion of the molded resin.

2 . The resistor, according to claim 1 , wherein the thermal conductivity of the molded resin is 3 W/(m·K) or more and 10 W/(m·K) or less.

3 . The resistor, according to claim 1 , at least one of the pair of plate terminals is bent in a thickness direction in the molded resin.

4 . A method for manufacturing a resistor having a resistor body part and a molded resin in which the resistor body part is embedded, wherein the molded resin comprises a base resin and a filler having a higher thermal conductivity than the base resin, the method comprising:

manufacturing the resistor body part;

placing the resistor body part inside a mold; and

injecting a raw material for the molded resin in a molten state inside the mold and curing the raw material to form the molded resin,

wherein the resistor body part comprises a resistive element and a pair of plate terminals electrically connected to the resistive element, and at least a portion of each of the pair of plate terminals is exposed from the molded resin,

wherein the resistor body part is placed in the mold while gripping the portion to be exposed from the molded resin at the pair of plate terminals at the mold, and

wherein at least one of the pair of plate terminals comprises a facing portion inside the molded resin, which faces the resistive element through a portion of the molded resin.

Assignments (2)
CHANGE OF NAME Recorded Feb 21, 2023
From: HITACHI METALS, LTD.
To: PROTERIAL, LTD.
Reel/Frame 062815/0564 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2022
From: FUKUCHI, KEISUKE
To: HITACHI METALS, LTD.
Reel/Frame 061921/0219 →
Priority Claims (1)
JP 2021-196800 · Dec 3, 2021 · national
Continuity (1)
Related Publication 20230178272A1 · Jun 8, 2023
References Cited (23)
US 2405449A · Robinson · 1946 [cited by examiner]
US 2535808A · Mucher · 1950 [cited by examiner]
US 2538977A · Mucher · 1951 [cited by examiner]
US 2660653A · Berkelhamer · 1953 [cited by examiner]
US 3063100A · Kohring · 1962 [cited by examiner]
US 3238489A · Hay · 1966 [cited by examiner]
US 3440589A · Minks · 1969 [cited by examiner]
US 20180047539A1 · Kang · 2018 [cited by examiner]
CN 109300638 · 2019 [cited by examiner]
JP H385601U1 · 1991 [cited by applicant]
JP H04153264A · 1992 [cited by applicant]
JP H05047443Y2 · 1993 [cited by applicant]
JP H09035923A · 1997 [cited by applicant]
JP 2007173594A · 2007 [cited by applicant]
JP 2009038275A · 2009 [cited by applicant]
JP 2009038275 · 2009 [cited by examiner]
JP 2014157891 · 2014 [cited by examiner]
JP 2018050018A · 2018 [cited by applicant]
JP 2020170742A · 2020 [cited by applicant]
JP-2009038275 translation (Year: 2009). [cited by examiner]
JP-2014157891 translation (Year: 2014). [cited by examiner]
CN-109300638 translation (Year: 2019). [cited by examiner]
Notice of Reasons for Refusal dated May 20, 2025 received from the Japanese Patent Office in related JP 2021-196800 together with English language translation. [cited by applicant]