Methods of producing a photovoltaic junction including ligand exchange of quantum dots of a film
The present disclosure is directed to methods for producing a photovoltaic junction that can include coating a bare junction with a composition. In one embodiment, the composition includes a plurality of quantum dots to create a film; exposing the film to a ligand to create a first layer; coating the first layer with the composition to form a film on the first layer; and exposing the film on the first layer to the ligand to create a second layer.
1. A method for producing a photovoltaic junction, the method comprising:
applying a metallic contact to a first surface area of a semiconductor layer to form a first physical junction between a first surface area of the metallic contact and the first surface area of the semiconductor layer, the first physical junction forming a Schottky diode;
coating a second surface area of the semiconductor layer and a second surface area of the metallic contact with a composition including a plurality of ligand-protected quantum dots;
carrying out a ligand-exchange with the ligand-protected quantum dots to form a light absorbing layer, wherein a second physical junction exists between a first surface area of the light absorbing layer and the second surface area of the semiconductor layer and a third physical junction exists between a second surface area of the light absorbing layer and the second surface area of the metallic contact, the second physical junction forming a diode that exhibits Shockley-Read Hall trap-assisted recombination, and the third physical junction forming an ohmic contact; wherein
the photovoltaic junction exhibits absorption across one or more wavelengths in the range from about 200 nm to about 2000 nm.
2. The method of claim 1 , wherein the composition is spin coated on the second surface area of the semiconductor layer and the second surface area of the metallic contact.
3. The method of claim 1 , wherein the composition is painted on the second surface area of the semiconductor layer and the second surface area of the metallic contact.
4. The method of claim 1 , wherein the semiconductor layer comprises a nitride or a carbide.
5. The method of claim 1 , wherein the semiconductor layer comprises a semiconductor that has a bandgap greater than a bandgap of the light absorbing layer.
6. The method of claim 1 , wherein the ligand exchange comprises exchanging a 1,2-ethane dithiol with a ligand of the ligand-protected quantum dots.
7. The method of claim 1 , wherein the ligand-protected quantum dots comprise lead sulfide quantum dots.
8. The method of claim 1 , wherein the light absorbing layer has thickness from about 8 nm to about 400 nm.
9. The method of claim 1 , wherein the light absorbing layer has a thickness of from about 10 nm to about 300 nm.
10. The method of claim 1 , wherein the semiconductor layer has a thickness that is greater than the thickness of the light absorbing layer.
11. The method of claim 1 , wherein the semiconductor layer has a thickness that is from about 5 micrometers to about 200 micrometers.
12. The method of claim 1 , wherein the metallic contact comprises graphene, graphite, or a metal.
13. The method of claim 1 , further comprising:
coating the light absorbing layer with a further amount of the composition including the plurality of ligand-protected quantum dots; and
carrying out a ligand-exchange with the ligand-protected quantum dots and thereby increasing the thickness of the light absorbing layer.
14. The method of claim 13 , further comprising repeating the coating and ligand-exchange steps one or more additional times.
15. The method of claim 1 , wherein the metallic contact includes multiple monolayers of graphene.
16. The method of claim 1 , wherein the ligand-protected quantum dots comprise alkyl carboxylate coated quantum dots.