Encapsulation of polarized light emitters
The present invention provides systems, and methods for manufacturing polarized light emitting semiconductor packages, comprising the disposition of a first bonding solution about (a) a first light emitting element and (b) a first polarizing element, wherein the first polarizing element transmits linearly polarized light in a first directionality. A first energy is applied to polymerize the first bonding solution, thereby encapsulating the first polarizing element and a first light emitting element in a first semiconductor package. A second bonding solution is disposed about (a) a second light emitting element and (b) a second polarizing element, wherein the second polarizing element transmits polarized light in a second directionality different from the first directionality, and a second energy is applied to polymerize the second bonding solution, thereby encapsulating the second polarizing element and the second light emitting element in a second semiconductor package.
1. A method of manufacturing polarized light emitting semiconductor packages, comprising:
disposing a first bonding solution about (a) a first light emitting element and (b) a first polarizing element, wherein the first polarizing element transmits polarized light in a first directionality, and;
disposing a second bonding solution about (a) a second light emitting element and (b) a second polarizing element, wherein the second polarizing element transmits polarized light in a second directionality different from the first directionality;
applying a first energy to polymerize the first and second bonding solution, thereby encapsulating the first and second polarizing element and a first and second light emitting element in a first semiconductor package.
2. The method of claim 1 , further comprising disposing a third bonding solution about (a) a third light emitting element and (b) a third polarizing element, wherein the third polarizing element transmits polarized light in a third directionality, and;
applying a second energy to polymerize the third bonding solution, thereby encapsulating third light emitting element and the third polarizing element in a second semiconductor package.
3. The method of claim 1 , further comprising disposing a diffuser between the first light emitting element and the first polarizing element.
4. The method of claim 1 , wherein the first light emitting element is configured to emit a first color, and the second light emitting element is configured to emit a second color within the first semiconductor package.
5. The method of claim 4 , wherein the first color is different than the second color.
6. The method of claim 4 , further comprising further including within the first semiconductor package, another light emitting element that emits a white light.
7. The method of claim 1 , further comprising providing at least one of the first polarizing elements with a downward facing abraded surface.
8. The method of claim 1 , further comprising mounting the first light emitting element and the first polarizing element on a substrate before the step of disposing a first bonding solution.
9. The method of claim 1 , further comprising mounting at least one of the first semiconductor packages and the second semiconductor packages onto a substrate.
10. The method of claim 1 , wherein at least one of the first light emitting elements and second light emitting elements is an infrared emitting semi-conductor.
11. The method of claim 1 , wherein first directionality is linear.
12. The method of claim 1 , wherein first directionality is circular.
13. The method of claim 2 , wherein the first energy is different than the second energy.
14. The method of claim 1 , wherein the first bonding solution is different than the second bonding solution.
15. The method of claim 1 , wherein the first bonding solution is the same as the second bonding solution.