Chip packaged battery

1. An apparatus for mounting on a circuit board, the apparatus comprising: a circuit board mount packaging comprising a cavity, a first internal lead, and a second internal lead, the first internal lead connected to a first external pin and the second internal lead connected to a second external pin; and a battery disposed within the cavity of the circuit board mount packaging, the battery comprising an anode and a cathode, the anode being wire bond connected to the first internal lead and the cathode being wire bond connected to the second internal lead, wherein at least one of the anode or the cathode is formed as a coating disposed on a metal foil, the coating being formed via a slurry comprising a binder and a conductive additive that is applied to the metal foil.

2. The apparatus of claim 1 , wherein the circuit board mount packaging comprises a chip carrier; and

wherein the circuit board mount packaging further comprises:

a lid configured to cover the cavity;

a spacer that physically contacts the battery; and

a spring disposed between the lid and the spacer.

3. The apparatus of claim 1 , wherein at least one of the anode or the cathode is formed as a pressed pellet.

4. The apparatus of claim 1 , wherein the battery further comprises a connection shim connected to either the anode or the cathode; and

wherein the anode is wire bond connected to the first internal lead through the connection shim or the cathode is wire bond connected to the second internal lead through the connection shim.

5. The apparatus of claim 1 , wherein the battery is constructed as a battery stack, wherein the anode comprises an anode layer of the battery stack and the cathode comprises a cathode layer of the battery stack.

6. The apparatus of claim 5 , wherein the battery comprises a gel polymer electrolyte that has been cured between the anode layer and the cathode layer.

7. The apparatus of claim 1 , wherein a separator is disposed between the anode and the cathode, and wherein the anode, the cathode, and the separator are coiled.

8. The apparatus of claim 7 , wherein the battery is disposed with a pouch.

9. The apparatus of claim 1 , wherein a surface of the circuit board mount packaging comprises an emissivity layer configured to limit penetration of heat into the cavity.

10. The apparatus of claim 1 , further comprising a phase change fill material disposed within the cavity to absorb heat and limit peak temperatures within the cavity.

11. The apparatus of claim 1 , wherein the circuit board mount packaging is through-hole packaging or surface mount packaging.

12. An apparatus for mounting on a circuit board, the apparatus comprising: a circuit board mount packaging comprising a plurality of external pins, a first internal lead, and a second internal lead; the first internal lead connected to a first external pin of the plurality of external pins and the second internal lead connected to a second external pin of the plurality of external pins; the plurality of external pins being configured to be soldered to a circuit board; and a battery disposed within the circuit board mount packaging; wherein the battery comprises: an anode electrically connected to the first internal lead; a cathode connected to the second internal lead; a separator disposed between the anode and the cathode; and an electrolyte, wherein at least one of the anode or the cathode is formed as a coating disposed on a metal foil, the coating being formed via a slurry comprising a binder and a conductive additive that is applied to the metal foil.

13. The apparatus of claim 12 , wherein at least one of the anode or the cathode is formed as a pressed pellet electrode comprising a binder and a conductive additive.

14. The apparatus of claim 12 , wherein the battery is constructed as a battery stack, wherein the anode comprises an anode layer of the battery stack and the cathode comprises a cathode layer of the battery stack.

15. The apparatus of claim 12 , wherein the anode, the cathode, and the separator are coiled.

16. A method for constructing a circuit board mount battery, the method comprising: assembling a battery comprising an anode, a cathode, and an electrolyte; disposing the battery within a circuit board mount packaging, the circuit board mount packaging comprising a plurality of external pins, a first internal lead, and a second internal lead, the first internal lead being connected to a first external pin of the plurality of external pins and the second internal lead being connected to a second external pin of the plurality of external pins, the plurality of external pins being configured to be soldered to a circuit board; electrically connecting the anode to the first internal lead; and electrically connecting the cathode to the second internal lead, wherein the anode comprises an anode layer and the cathode comprises a cathode layer; wherein assembling the battery comprises: curing a gel polymer electrolyte between the anode layer and the cathode layer prior to disposing the battery within the circuit board mount packaging; or curing the gel polymer electrolyte between the anode layer and the cathode layer after disposing the battery within the circuit board mount packaging.

17. The method of claim 16 , wherein assembling the battery comprises:

coating a metal foil with a slurry comprising a binder and a conductive additive to form the anode or the cathode; or

pressing the binder and the conductive additive to form a pellet electrode as the anode or the cathode.