Terahertz band waveguide module and mounting method of IC chip
View Patent ↗Disclosed are a terahertz band waveguide module and a mounting method of an IC chip. The terahertz band waveguide module includes: a waveguide having a channel having a first size based on an E-plane; and an IC chip having a width of a second size and disposed at a preset position inside the waveguide, wherein the IC chip is disposed inside the waveguide with an air gap on at least two surfaces of the IC chip.
1. A waveguide module comprising:
a waveguide channel having a channel size of a first size based on an E-plane; and
an integrated circuit (IC) chip having a width of a second size and disposed at a predetermined position inside the waveguide channel,
wherein the IC chip is disposed inside the waveguide channel with air gaps outside the IC chip;
wherein the air gaps are set to 30 μm or less; and
wherein the IC chip includes a dipole antenna.
2. The waveguide module of claim 1 , wherein the waveguide channel is a rectangular waveguide channel, and
the first size is greater than the second size.
3. The waveguide module of claim 1 , wherein the air gaps are formed at the top and bottom of the IC chip, respectively.
4. The waveguide module of claim 1 , wherein the IC chip is formed with a via for suppressing dielectric resonance inside the IC chip, and
the via is formed at a distance spaced apart from an outermost portion of the IC chip by 355 μm.
5. The waveguide module of claim 1 , wherein the IC chip is formed with an amplifier circuit or an array circuit including a plurality of amplifier circuit units.
6. The waveguide module of claim 5 , wherein two amplifier circuit units positioned outside the array circuit among the plurality of amplifier circuit units included in the array circuit have an antenna structure designed differently from the plurality of amplifier circuit units positioned inside the array circuit due to the air gap.
7. A method of mounting an integrated circuit (IC) chip in a waveguide channel, the method comprising:
a first process of providing the IC chip having a dipole antenna; and
a second process of mounting the IC chip in a predetermined area inside the waveguide channel, the IC chip being mounted inside the waveguide channel so as to have air gaps outside the IC chip without a bonding wire,
wherein the waveguide channel has a channel size of a first size based on an E-plane, and the IC chip has a width of a second size, and
wherein the air gaps are set to 30 μm or less.