Wireless communication technology, apparatuses, and methods
Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
1. A transceiver comprising:
a plurality of patch antennas, the plurality of patch antennas disposed on a first surface of a substrate;
a radio frequency integrated circuit (RFIC) coupled to the plurality of patch antennas, the RFIC disposed on a second surface of the substrate and configured to process RF signals received via the plurality of patch antennas; and
a shield, the shield disposed on the second surface and insulating the RFIC from radio frequency interference (RFI) and electromagnetic interference (EMI).
2. The transceiver of claim 1 , further comprising:
a plurality of redistribution layers within the substrate, the plurality of redistribution layers coupling the RFIC to the plurality of patch antennas.
3. The transceiver of claim 2 , further comprising:
a plurality of solder balls, the plurality of solder balls disposed between the plurality of redistribution layers and the plurality of patch antennas.
4. The transceiver of claim 1 , further comprising:
a plurality of surface-mount devices (SMDs), the plurality of SMDs disposed on the second surface of the substrate.
5. The transceiver of claim 4 , wherein the RFIC is configured to process the RF signals based on one or more of the plurality of SMDs.
6. The transceiver of claim 4 , further comprising:
mold compound, the mold compound disposed within a cavity formed between the shield and the substrate.
7. The transceiver of claim 1 , wherein each patch antenna of the plurality of patch antennas is configured as a dual-polarized antenna structure with ±45° tilted excitation.
8. The transceiver of claim 1 , wherein each patch antenna of the plurality of patch antennas is configured as parasitically stacked dual patches.
9. The transceiver of claim 8 , wherein the parasitically stacked dual patches comprise:
a driven element coupled to a feedline; and
a parasitic element.
10. The transceiver of claim 1 , further comprising:
a horizontal surface-mount device (SMD) element.
11. The transceiver of claim 10 , wherein the horizontal SMD element comprises at least one patch antenna of the plurality of patch antennas.
12. The transceiver of claim 11 , wherein the at least one patch antenna comprises:
a parasitic patch element; and
a driven capacitive patch antenna element coupled to dual feed lines.
13. The transceiver of claim 1 , further comprising:
baseband circuitry, the baseband circuitry configured to generate baseband signals based on digital output signals,
wherein the RFIC is configured to generate output signals for transmission via the plurality of patch antennas, the output signals based on the baseband signals.
14. The transceiver of claim 13 , further comprising:
a touchscreen display; and
a signal processor, the signal processor coupled to the touchscreen display via an interconnect, the signal processor configured to:
detect signal input received from the touchscreen display via the interconnect; and
generate the digital output signals based on the signal input.
15. A method for processing radio frequency (RF) signals, the method comprising:
receiving RF signals via a plurality of patch antennas disposed on a first surface of a substrate;
downconverting the RF signals to baseband signals using a radio frequency integrated circuit (RFIC), the RFIC disposed on a second surface of the substrate, and the RFIC coupled to the plurality of patch antennas via a plurality of redistribution layers within the substrate; and
during the downconverting, insulating the RFIC from radio frequency interference (RFI) and electromagnetic interference (EMI) using a shield, the shield being separate from the plurality of patch antennas and the shield being disposed on the second surface of the substrate.
16. The method of claim 15 , further comprising:
disposing a plurality of solder balls between the plurality of redistribution layers and the plurality of patch antennas; and
coupling the RFIC to the plurality of patch antennas via the plurality of redistribution layers and the plurality of solder balls.
17. The method of claim 15 , further comprising:
processing the RF signals based on one or more of a plurality of surface-mount devices (SMDs), the plurality of SMDs disposed on the substrate.
18. The method of claim 15 , further comprising:
generating using baseband circuitry, baseband signals based on digital output signals; and
generating output signals based on the baseband signals; and
causing transmission of the output signals via the plurality of patch antennas.
19. The method of claim 18 , further comprising:
detecting signal input received from a touchscreen display via an interconnect; and
generating the digital output signals based on the signal input.
20. A system for processing radio frequency (RF) signals, the system comprising:
means for receiving RF signals, the means for receiving comprising a plurality of patch antennas disposed on a first surface of a substrate;
means for downconverting the RF signals to baseband signals, the means for downconverting comprising a radio frequency integrated circuit (RFIC) disposed on a second surface of the substrate, the RFIC coupled to the plurality of patch antennas via a plurality of redistribution layers within the substrate; and
means for insulating the RFIC from radio frequency interference (RFI) and electromagnetic interference (EMI) during the receiving, the means for insulating being separate from the plurality of patch antennas and the means for insulating being disposed on the second surface of the substrate.
21. The system of claim 20 , further comprising:
means for processing the RF signals based on one or more of a plurality of surface-mount devices (SMDs), the plurality of SMDs disposed on the substrate.
22. The system of claim 20 , further comprising:
means for generating baseband signals based on digital output signals; and
means for generating output signals based on the baseband signals; and
means for transmitting the output signals via the plurality of patch antennas.
23. The system of claim 22 , further comprising:
means for detecting signal input; and
means for generating the digital output signals based on the signal input.