Sensor node thermal management and illumination
Example embodiments include an apparatus comprising a first printed circuit board (PCB) having an AC-DC power supply thereon and a second PCB having a processor thereon. The first and second BPBs are substantially parallel to one another. A first thermal barrier extends between the first and second PCB. The processor and the power supply are both on a first side of the first thermal barrier. A chamber on a second side of the first thermal barrier opposite the first side. The chamber is at least partly enclosed by a second thermal barrier and has at least one opening for fluid communication with an ambient environment. A temperature sensor is provided in the chamber. In some embodiments, an LED is provided on one of the PCBs, and a light-reflecting silkscreened pattern is provided on the PCB near the LED to increase light output of the apparatus.
1 . An apparatus comprising:
a first printed circuit board having an AC-DC power supply thereon;
a second printed circuit board having a processor thereon, the first and second printed circuit boards being substantially parallel to one another;
a first thermal barrier extending between the first and second printed circuit boards, the processor and the power supply both being on a first side of the first thermal barrier;
a chamber on a second side of the first thermal barrier, the chamber being at least partly enclosed by a second thermal barrier and having at least one opening allowing air flow with an ambient environment; and
a first temperature sensor in the chamber.
2 . The apparatus of claim 1 , further comprising:
a first heat spreader coupled to the AC-DC power supply with a first thermal gap filler, the first heat spreader being applied to a first housing surface; and
a second heat spreader coupled to the processor with a second thermal gap filler, the second heat spreader being applied to a second housing surface substantially opposite the first housing surface.
3 . The apparatus of claim 1 , wherein the first thermal barrier comprises a first insulation layer and the second thermal barrier comprises a second insulation layer.
4 . The apparatus of claim 1 , wherein the first thermal barrier comprises a first ePTFE insulation layer and the second thermal barrier comprises a second ePTFE insulation layer.
5 . The apparatus of claim 1 , wherein the second thermal barrier is at least 20 mm from the first thermal barrier.
6 . The apparatus of claim 1 , wherein the second thermal barrier is at least 30 mm from the processor and from the AC-DC power supply.
7 . The apparatus of claim 1 , further comprising a second temperature sensor, the second temperature sensor being on an opposite side of at least the second thermal barrier from the first temperature sensor.
8 . The apparatus of claim 1 , wherein at least one of the printed circuit boards has a light-emitting component mounted thereon, and a light-reflecting silkscreen pattern is provided on the printed circuit board around the light-emitting component.
9 . The apparatus of claim 1 , further comprising:
a housing having a set of power plug prongs extending from a rear surface thereof, the set of power plug prongs including a ground prong;
wherein the chamber is positioned in the housing such that ground prong is the nearest power plug prong to the chamber.
10 . The apparatus of claim 9 , wherein the first temperature sensor is at least 60 mm from the ground prong.
11 . The apparatus of claim 9 , wherein the AC-DC power supply is between the chamber and the ground prong.
12 . The apparatus of claim 9 , wherein the processor is between the sensor chamber and the ground prong.
13 . An apparatus comprising:
a first printed circuit board having an AC-DC power supply thereon;
a second printed circuit board having a processor thereon, the first and second printed circuit boards being substantially parallel to one another;
a first thermal barrier formed by a wall extending across a gap between the first and second printed circuit boards, the processor and the power supply both being on a first side of the wall forming the first thermal barrier;
a chamber on a second side of the wall forming the first thermal barrier, the chamber being at least partly enclosed by a second thermal barrier and having at least one opening allowing air flow with an ambient environment; and
a first temperature sensor in the chamber.
14 . The apparatus of claim 13 , further comprising:
a first heat spreader coupled to the AC-DC power supply with a first thermal gap filler, the first heat spreader being applied to a first housing surface; and
a second heat spreader coupled to the processor with a second thermal gap filler, the second heat spreader being applied to a second housing surface substantially opposite the first housing surface.
15 . The apparatus of claim 13 , wherein the second thermal barrier is at least 20 mm from the first thermal barrier.
16 . The apparatus of claim 13 , wherein the second thermal barrier is at least 30 mm from the processor and from the AC-DC power supply.
17 . The apparatus of claim 13 , further comprising a second temperature sensor, the second temperature sensor being on an opposite side of at least the second thermal barrier from the first temperature sensor.
18 . The apparatus of claim 13 , further comprising:
a housing having a set of power plug prongs extending from a rear surface thereof, the set of power plug prongs including a ground prong;
wherein the chamber is positioned in the housing such that ground prong is the nearest power plug prong to the chamber.
19 . The apparatus of claim 18 , wherein the first temperature sensor is at least 60 mm from the ground prong.
20 . The apparatus of claim 18 , wherein the processor is between the sensor chamber and the ground prong.