Thermal imaging sensors that connect to each other using a wired daisy chain connection
A new innovative way for connecting multiple thermal imaging sensors to a base unit while only using one port of the base unit when connected to such a base unit; this by using a daisy chained connection between the sensors themselves. The thermal imaging sensor(s) connect to each other using a wired connectivity with or without being connected directly or indirectly to a base unit. The thermal imaging sensor in this invention is not a single standalone unit but consists of at least 2 physical different devices that are connected to each other using a wired connection.
1. A plurality of thermal imaging sensors that connect to each other using a wired daisy chain connection, the device comprising:
a plurality of thermal imaging camera sensors;
a base unit;
a pair of ports on each of the thermal imaging camera sensors and the base unit; and
a daisy chain connection between a plurality of thermal image sensors and a base unit.
2. The device of claim 1 , wherein multiple thermal imaging sensors are connected to a base unit in a daisy chained wiring type of connection.
3. The device of claim 1 , wherein the thermal imaging sensor consists of one or more thermal imaging cameras.
4. The device of claim 1 , wherein
a thermal imaging sensor connects to another thermal imaging sensor using a sequential wired connection creating a daisy chain of sensors until a base unit is reached.
5. The device of claim 4 , wherein
the sequence of wiring loops back at the end of the string to form a ring from the base unit to the first thermal image sensor in the chain.
6. The device of claim 1 , wherein
the daisy chained sensors are all thermal imaging sensors.
7. The device of claim 1 , wherein
the daisy chained sensors are thermal imaging sensors mixed with sensors of another type in a daisy chain.
8. The device of claim 1 , wherein
the daisy chained sensors are thermal imaging sensors mixed with one or more other non-sensor type of devices connected on the same daisy chain connection string.
9. The device of claim 7 , wherein
the wired connection transmits data only, power only, or may transmit data and power across its cable to which the different sensors are connected to each other.
10. The device of claim 1 , wherein
the base unit is a device acting as the logical unit and that in turns connects to other systems directly or indirectly.
11. The device of claim 1 , wherein
the base unit has one or more ports to which one or more sensors can connect to.
12. The device of claim 10 , wherein
sensors may first connect to one or more devices which in turn are then directly or indirectly connected to a base unit.
13. The device of claim 1 , wherein
the sensors use more than one port to connect to.
14. The device of claim 1 , wherein
the role of a base unit is as a separate physical device.
15. The device of claim 1 , wherein
the role of a base unit is combined with the features of a thermal imaging sensor within one and the same physical device.
16. The device of claim 1 , wherein
a first sensor device connects to another sensor device of the same type of sensor or another type, which in turn then connects to a base unit.
17. The device of claim 1 , wherein
on a daisy chain wiring string there are multiple sensors of the same or different types, as well as other non-sensor type of devices; and
the devices are signal control and routing devices.
18. The device of claim 1 , wherein
the base (logical) unit connects to an IP network and makes the data available via IP network or serial protocols to applications and other systems.
19. The device of claim 1 , wherein
a thermal imaging sensor connects to one or more thermal imaging sensors using a daisy chained wired connection; and
in turn the thermal imaging sensor is then connected to one or more base units.
20. The device of claim 1 , wherein
by using a daisy chained wiring connection from one thermal imaging sensor to the other, multiple sensors are connected to just one sensor port on a base unit or port on a device in between the sensors and a base unit.
21. The device of claim 17 , wherein
at least one the device is a sensor hub.
22. The device of claim 1 , wherein
the thermal imaging sensors are all directly or indirectly connected to each other without connecting to a base unit.
23. The device of claim 19 , wherein
the wiring cable connecting all units together in sequence transmits power across all connected sensors and devices with each having its own IP or non-IP based connectivity to other systems.