Granted Patent B2

US 12,004,318 · App. 18/114,114 · Granted Jun 4, 2024

Inventors: Peter Johannes Winzer (Aberdeen, NJ); Brett Michael Dunn Sawyer (Pasadena, CA); Ron Zhang (Sunnyvale, CA); Peter James Pupalaikis (Ramsey, NJ); Clinton Randy Giles (Watchung, NJ); Guilhem de Valicourt (Jersey City, NJ); Jonathan Proesel (Mount Vernon, NY)

Assignee: Nubis Communications, Inc.

H05K7/1487G02B6/4206G02B6/43H04B10/27H05K1/141

Abstract

Claims (128)

1. A system comprising:

a housing comprising a bottom surface;

a first circuit board or a first substrate comprising a first surface at a first angle relative to the bottom surface of the housing, in which the first angle is in a range from 30° to 150°;

at least one data processor mounted directly or indirectly on the first circuit board or the first substrate; and

at least one optical interconnect module mounted directly or indirectly on the first surface of the first circuit board or the first substrate, wherein each optical interconnect module comprises a first optical connector configured to connect to an external optical link, each optical interconnect module comprises a photonic integrated circuit configured to generate a first electrical signal based on an optical signal received from the first optical connector;

wherein the at least one data processor is configured to process data carried in the first electrical signal;

wherein the at least one optical interconnect module comprises:

a second circuit board or a second substrate having a length, a width, and a thickness, in which the length is at least twice the thickness, and the width is at least twice the thickness, the second circuit board or the second substrate has a first surface defined by the length and the width;

an optical input port configured to receive a plurality of channels of optical signals;

a photonic integrated circuit mounted on the second circuit board or the second substrate and configured to generate a plurality of first electrical signals based on the received optical signals; and

an array of first electrical terminals arranged on the first surface of the second circuit board or the second substrate, in which the array of first electrical terminals comprises at least two electrical terminals distributed along the length direction and at least two electrical terminals distributed along the width direction, the first electrical terminals are configured to output the first electrical signals.

2. The system of claim 1 wherein the first angle is in a range from 80° to 100°.

3. The system of claim 1 wherein the optical input port comprises an optical connector part configured to be coupled to a two-dimensional array of optical fibers, and the two-dimensional array of optical fibers comprises at least two rows and at least two columns of optical fibers.

4. The system of claim 1 wherein at least one of the at least one optical interconnect module comprises:

a first optical input/output port configured to at least one of (i) receive a plurality of channels of first optical signals from a first plurality of optical fibers, or (ii) transmit a plurality of channels of second optical signals to the first plurality of optical fibers;

a first photonic integrated circuit configured to at least one of (i) generate a plurality of first serial electrical signals based on the first optical signals, or (ii) generate the second optical signals based on a plurality of second serial electrical signals;

a plurality of first serializer/deserializers configured to at least one of (i) generate a plurality of sets of third parallel electrical signals based on the plurality of first serial electrical signals, and condition the electrical signals, in which each set of third parallel electrical signals is generated based on a corresponding first serial electrical signal, or (ii) generate the plurality of second serial electrical signals based on a plurality of sets of fourth parallel electrical signals, in which each second serial electrical signal is generated based on a corresponding set of fourth parallel electrical signals;

a plurality of second serializer/deserializers configured to at least one of (i) generate a plurality of fifth serial electrical signals based on the plurality of sets of third parallel electrical signals, in which each fifth serial electrical signal is generated based on a corresponding set of third parallel electrical signals, or (ii) generate the plurality of sets of fourth parallel electrical signals based on a plurality of sixth serial electrical signals, in which each set of fourth parallel electrical signals is generated based on a corresponding sixth serial signal;

a plurality of third serializer/deserializers configured to at least one of (i) generate a plurality of sets of seventh parallel electrical signals based on the plurality of fifth serial electrical signals, and condition the electrical signals, in which each set of seventh parallel electrical signals is generated based on a corresponding fifth serial electrical signal, or (ii) generate the plurality of sixth serial electrical signals based on a plurality of sets of eighth parallel electrical signals, in which each sixth serial electrical signal is generated based on a corresponding set of eighth parallel electrical signals; and

a data processor configured to at least one of (i) process the plurality of sets of seventh parallel electrical signals, or (ii) output the plurality of sets of eighth parallel electrical signals.

5. The system of claim 4 wherein the plurality of third serializer/deserializers and the data processor are integrated in a monolithic integrated circuit.

6. The system of claim 1 wherein the first circuit board or the first substrate has a first main surface and a second main surface;

wherein the at least one optical interconnect module comprises a second substrate comprising:

a first main surface and a second main surface;

a first array of electrical contacts arranged on the first main surface and having a first minimum spacing between the contacts;

a second array of electrical contacts arranged on the second main surface and having a second minimum spacing between the contacts, in which the first minimum spacing is larger than the second minimum spacing; and

electrical connections between the first array of electrical contacts and the second array of electrical contacts;

wherein the first main surface of the second substrate is configured to be removably connectable to the second main surface of the first circuit board or the first substrate;

wherein the at least one optical interconnect module further comprises:

a photonic integrated circuit having a second main surface;

a first optical connector part that is optically coupled to the second main surface of the photonic integrated circuit; and

a second electronic integrated circuit that is electrically coupled to the second main surface of the photonic integrated circuit and the second array of electrical contacts arranged on the second main surface of the second substrate.

7. The system of claim 1 wherein the first circuit board or the first substrate has a first main surface and a second main surface;

wherein the at least one optical interconnect module comprises a second substrate comprising:

a first main surface and a second main surface;

a first array of electrical contacts arranged on the first main surface and having a first minimum spacing between the contacts;

a second array of electrical contacts arranged on the second main surface and having a second minimum spacing between the contacts, in which the first minimum spacing is larger than the second minimum spacing;

a third array of electrical contacts arranged on the first main surface;

first electrical connections between the first array of electrical contacts and a first subset of the second array of electrical contacts; and

second electrical connections between the third array of electrical contacts and a second subset of the second array of electrical contacts;

wherein the first main surface of the second substrate is configured to be removably connectable to the second main surface of the first circuit board or the first substrate;

wherein the at least one optical interconnect module further comprises:

a second electronic integrated circuit that is electrically coupled to the second array of electrical contacts arranged on the second main surface of the second substrate;

a photonic integrated circuit having a second main surface and electrical contacts arranged on the second main surface that are electrically coupled to the third array of electrical contacts arranged on the first main surface of the second substrate; and

a first optical connector part that is optically coupled to the photonic integrated circuit.

8. The system of claim 1 , comprising a first structure attached to the first circuit board or the first substrate,

wherein the first structure is configured to enable the at least one optical interconnect module to be removably coupled to the first structure, and the at least one optical interconnect module is configured to enable an optical fiber connector to be removably coupled to the at least one optical interconnect module.

9. The system of claim 8 wherein the at least one optical interconnect module comprises an optical module with connector that is configured to hold the photonic integrated circuit in place when the optical module with connector is coupled to the first structure and to enable electronic signals from the photonic integrated circuit to be transmitted to the circuit board;

wherein the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector, in which the optical module with connector is configured to enable optical signals from the optical fiber connector to be transmitted to the photonic integrated circuit.

10. The system of claim 1 , comprising a second circuit board that has a length, a width, and a thickness, wherein the length is at least twice the thickness, the width is at least twice the thickness, and the second circuit board has a first surface defined by the length and the width,

wherein the first surface of the second circuit board is substantially parallel to the bottom surface of the housing or at a second angle relative to the bottom surface, the second angle is less than 20°, and the second circuit board is electrically coupled to the first circuit board or the first substrate;

wherein the second circuit board comprises a motherboard, the first circuit board or the first substrate comprises a daughter card, and the motherboard is configured to provide electrical power to the daughter card.

11. The system of claim 1 , comprising a rackmount server configured to be placed on a rack during operation, wherein the housing comprises an enclosure for the rackmount server, and the rackmount server has an n rack unit form factor, and n is an integer in a range from 1 to 8.

12. The system of claim 11 wherein the at least one data processing module comprises a network switch, and the rackmount server comprises an Ethernet switch box.

13. A system comprising:

a housing comprising a front panel;

a first circuit board or a first substrate oriented at a first angle relative to the front panel, in which the first angle is in a range from −60° to 60°;

at least one data processing module electrically coupled to the first circuit board or the first substrate; and

at least one optical/electrical communication interface module electrically coupled to the first circuit board or the first substrate;

wherein the first circuit board or the first substrate comprises signal paths configured to transmit signals between the at least one data processing module and the at least one optical/electrical communication interface module;

wherein the at least one data processing module is capable of processing data from the at least one optical/electrical communication interface module at a rate of at least 100 gigabits per second, and each of the at least one optical/electrical communication interface module has a bandwidth of at least 10 gigabits per second;

a rackmount server configured to be placed on a rack during operation, wherein the housing comprises an enclosure for the rackmount server, and the rackmount server has an n rack unit form factor, and n is an integer in a range from 1 to 8;

a plurality of optical/electrical communication interfaces electrically coupled to a first surface of the first circuit board or the first substrate,

wherein each of the optical/electrical communication interfaces is configured to receive first optical signals, convert the first optical signals to first electrical signals, and transmit the first electrical signals directly or indirectly to the data processing module; and

wherein each of the optical/electrical communication interfaces is configured to receive second electrical signals directly or indirectly from the at least one data processor, convert the second electrical signals to second optical signals, and output the second optical signals;

wherein the first surface of the first circuit board or the first substrate is oriented to face towards the front panel to allow the optical/electrical communication interface modules to be accessed without removing the rackmount server from the rack, in which accessing one of the optical/electrical communication interface modules includes at least one of attaching the optical/electrical communication interface module to the first circuit board or the first substrate, or removing the optical/electrical communication interface module from the first circuit board or the first substrate.

14. The system of claim 13 wherein the first angle is in a range from −10° to 10°.

15. The system of claim 13 wherein the at least one data processing module comprises an integrated circuit or a system on a chip (SoC) that includes at least one million transistors.

16. The system of claim 13 wherein the at least one data processing module comprises at least one of a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, a microcontroller, an application specific integrated circuit (ASIC), or a data storage device.

17. The system of claim 13 wherein the first circuit board or the first substrate has a first side and a second side;

wherein the at least one data processor is directly or indirectly coupled to the first side of the first circuit board or the first substrate;

wherein the at least one optical/electrical communication interface is directly or indirectly coupled to the second side of the first circuit board or the first substrate;

wherein the at least one optical/electrical communication interface comprises:

an optical port configured to receive optical signals, and

a photonic integrated circuit configured to generate electrical signals based on the received optical signals, and transmit the electrical signals directly or indirectly to the at least one data processor.

18. The system of claim 13 wherein the first circuit board or the first substrate has a first side and a second side;

wherein the at least one data processor is directly or indirectly coupled to the first side of the first substrate;

wherein the at least one optical/electrical communication interface comprises:

an optical port configured to receive optical signals from a first optical fiber cable, and

a photonic integrated circuit configured to generate electrical signals based on the received optical signals, and transmit the electrical signals directly or indirectly to the at least one data processor;

wherein at least one of (i) at least one of the at least one optical/electrical communication interface, (ii) the first optical fiber cable, (iii) a portion of at least one of the at least one optical/electrical communication interface, or (iv) a portion of the first optical fiber cable extends through an opening in the first circuit board or the first substrate.

19. The system of claim 13 wherein the at least one optical/electrical communication interface comprises a co-packaged optical module comprising:

a photonic integrated circuit;

an optical connector coupled to a first surface of the photonic integrated circuit; and

a first set of at least two electrical integrated circuits that are coupled to the first surface of the photonic integrated circuit.

20. The system of claim 13 wherein the at least one data processing module comprises a network switch, and the rackmount server comprises an Ethernet switch box.

21. A system comprising:

a housing comprising a bottom panel and a front panel, the front panel comprising a plurality of optical connector parts, each optical connector part is configured to be optically coupled to an external optical fiber cable and an internal optical fiber cable;

a first circuit board or a first substrate positioned in the housing, wherein the first circuit board or the first substrate is oriented at an angle relative to the bottom panel in which the angle is in a range from 30° to 150°;

wherein the first circuit board or the first substrate is substantially parallel to the front panel or at an angle relative to the front panel in which the angle is less than 60°;

a plurality of optical interconnect modules electrically coupled to the first circuit board; and

a plurality of internal optical fiber cables, wherein each internal optical fiber cable is optically coupled to one of the optical interconnect modules and a corresponding optical connector part on the front panel;

wherein at least one of the optical interconnect modules comprises a co-packaged optical module comprising:

a photonic integrated circuit;

an optical connector coupled to a first surface of the photonic integrated circuit; and

a first set of at least two electrical integrated circuits that are coupled to the first surface of the photonic integrated circuit;

wherein the first set of at least two electrical integrated circuits comprise two electrical integrated circuits that are positioned on opposite sides of the optical connector along a plane parallel to the first surface of the photonic integrated circuit.

22. The system of claim 21 wherein the first set of at least one electrical integrated circuit comprises three electrical integrated circuits that surround three sides of the optical connector along a plane parallel to the first surface of the photonic integrated circuit.

23. The system of claim 21 wherein the co-packaged optical module comprises:

a substrate, wherein the photonic integrated circuit is mounted on the substrate, and

a second set of at least one electrical integrated circuit mounted on the substrate and electrically coupled to the photonic integrated circuit through one or more signal conductors and/or traces.

24. The system of claim 21 wherein the photonic integrated circuit comprises at least one of a photodetector or an optical modulator, and the first set of at least one integrated circuit comprises at least one of a transimpedance amplifier configured to amplify a current generated by the photodetector or a driver configured to drive the optical modulator.

25. The system of claim 21 wherein the photonic integrated circuit comprises a silicon substrate and an active layer at a second surface that is opposite to the first surface relative to the photonic integrated circuit,

wherein the active layer comprises grating couplers, and at least one of photodetectors or optical modulators,

wherein the optical connector is optically coupled to the grating couplers using backside illumination; and

wherein the first set of at least one electrical integrated circuits is coupled to the at least one of photodetectors or optical modulators using through silicon vias.

26. The system of claim 21 wherein at least one of the optical interconnect modules comprises a co-packaged optical module comprising:

a photonic integrated circuit;

an optical connector coupled to a first surface of the photonic integrated circuit; and

a first set of at least one electrical integrated circuit that is coupled to a second surface of the photonic integrated circuit, wherein the second surface is opposite to the first surface relative to the photonic integrated circuit.

27. The system of claim 21 , comprising a rackmount server configured to be placed on a rack during operation, wherein the housing comprises an enclosure for the rackmount server, and the rackmount server has an n rack unit form factor, and n is an integer in a range from 1 to 8.

28. The system of claim 27 wherein the rackmount server comprises an Ethernet switch box.

29. A system comprising:

a housing comprising a bottom surface;

a first circuit board or a first substrate comprising a first surface at a first angle relative to the bottom surface of the housing, in which the first angle is in a range from 30° to 150°;

at least one data processor mounted directly or indirectly on the first circuit board or the first substrate;

at least one optical interconnect module mounted directly or indirectly on the first surface of the first circuit board or the first substrate, wherein each optical interconnect module comprises a first optical connector configured to connect to an external optical link, each optical interconnect module comprises a photonic integrated circuit configured to generate a first electrical signal based on an optical signal received from the first optical connector;

wherein the at least one data processor is configured to process data carried in the first electrical signal; and

a first structure attached to the first circuit board or the first substrate, wherein the first structure is configured to enable the at least one optical interconnect module to be removably coupled to the first structure, and the at least one optical interconnect module is configured to enable an optical fiber connector to be removably coupled to the at least one optical interconnect module;

wherein the at least one optical interconnect module comprises an optical module with connector that is configured to hold the photonic integrated circuit in place when the optical module with connector is coupled to the first structure and to enable electronic signals from the photonic integrated circuit to be transmitted to the circuit board; and

wherein the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector, in which the optical module with connector is configured to enable optical signals from the optical fiber connector to be transmitted to the photonic integrated circuit.

30. The system of claim 29 wherein at least one of the at least one optical interconnect module comprises:

a first optical input/output port configured to at least one of (i) receive a plurality of channels of first optical signals from a first plurality of optical fibers, or (ii) transmit a plurality of channels of second optical signals to the first plurality of optical fibers;

a first photonic integrated circuit configured to at least one of (i) generate a plurality of first serial electrical signals based on the first optical signals, or (ii) generate the second optical signals based on a plurality of second serial electrical signals;

a plurality of first serializer/deserializers configured to at least one of (i) generate a plurality of sets of third parallel electrical signals based on the plurality of first serial electrical signals, and condition the electrical signals, in which each set of third parallel electrical signals is generated based on a corresponding first serial electrical signal, or (ii) generate the plurality of second serial electrical signals based on a plurality of sets of fourth parallel electrical signals, in which each second serial electrical signal is generated based on a corresponding set of fourth parallel electrical signals;

a plurality of second serializer/deserializers configured to at least one of (i) generate a plurality of fifth serial electrical signals based on the plurality of sets of third parallel electrical signals, in which each fifth serial electrical signal is generated based on a corresponding set of third parallel electrical signals, or (ii) generate the plurality of sets of fourth parallel electrical signals based on a plurality of sixth serial electrical signals, in which each set of fourth parallel electrical signals is generated based on a corresponding sixth serial signal;

a plurality of third serializer/deserializers configured to at least one of (i) generate a plurality of sets of seventh parallel electrical signals based on the plurality of fifth serial electrical signals, and condition the electrical signals, in which each set of seventh parallel electrical signals is generated based on a corresponding fifth serial electrical signal, or (ii) generate the plurality of sixth serial electrical signals based on a plurality of sets of eighth parallel electrical signals, in which each sixth serial electrical signal is generated based on a corresponding set of eighth parallel electrical signals; and

a data processor configured to at least one of (i) process the plurality of sets of seventh parallel electrical signals, or (ii) output the plurality of sets of eighth parallel electrical signals.

Assignments (2)

Continuity (20)

Cited By (6)

US 12,250,024 US 12,313,886 US 12,405,433 US 12,461,322 US 12,490,401 US 12,520,448