Granted Patent B2

US 12,713,739 · App. 18/115,460 · Granted Aug 18, 2026

Inventors: Hyungjin Lee (Suwon-si, KR); Jinhee Kang (Suwon-si, KR)

Assignee: SAMSUNG ELECTRONICS CO., LTD.

H10H20/8506H10H20/857H10W74/10H10W90/00

Abstract

Claims (45)

1 . A light-emitting diode package, comprising:

a transparent layer;

a plurality of light-emitting diodes disposed on a surface of the transparent layer, wherein each of the plurality of light-emitting diodes comprise a light-emitting surface that faces the transparent layer;

a spacer disposed on the surface of the transparent layer;

a protection member configured to cover the plurality of light-emitting diodes; and

a plurality of light-emitting diode electrode pads comprising an electrode pad on each of the plurality of light-emitting diodes;

wherein a first height from the surface of the transparent layer to an upper end of the spacer is larger than a second height from the surface of the transparent layer to the plurality of light-emitting diode electrode pads,

wherein the spacer includes a space that is defined by at least a first side surface of the spacer and a second side surface of the spacer that faces the first side surface, and

wherein the plurality of light-emitting diodes are in the space of the spacer.

2 . The light-emitting diode package of claim 1 , wherein the spacer comprises an organic matter.

3 . The light-emitting diode package of claim 1 , wherein the spacer comprises a closed loop shape that surrounds the plurality of light-emitting diodes.

4 . The light-emitting diode package of claim 3 , wherein the spacer is formed along an outer edge of the transparent layer.

5 . The light-emitting diode package of claim 3 , further comprising a plurality of package electrode pads disposed at the upper end of the spacer; and

wherein the plurality of package electrode pads are electrically connected with the plurality of light-emitting diode electrode pads through a plurality of wirings.

6 . The light-emitting diode package of claim 5 , wherein the plurality of wirings are disposed at a surface of the plurality of light-emitting diodes, at the surface of the transparent layer, and along a surface of the spacer.

7 . The light-emitting diode package of claim 1 , wherein the protection member comprises a film that covers the plurality of light-emitting diodes and wherein the protection member is spaced apart from an upper end of the plurality of light-emitting diodes.

8 . The light-emitting diode package of claim 7 , further comprising a plurality of package electrode pads disposed at the upper end of the spacer;

wherein the protection member comprises an anisotropic conductive film, and

wherein the plurality of package electrode pads are covered by the protection member.

9 . The light-emitting diode package of claim 7 , further comprising a plurality of package electrode pads disposed at the upper end of the spacer;

wherein the protection member comprises a non-conductive film, and

wherein the plurality of package electrode pads are not covered by the protection member.

10 . The light-emitting diode package of claim 1 , further comprising an insulating member;

wherein the insulating member is disposed in a space formed by the spacer and wherein the insulating member covers the plurality of light-emitting diodes.

11 . The light-emitting diode package of claim 1 , further comprising an adhesive layer formed on the surface of the transparent layer, and

wherein the adhesive layer attaches the plurality of light-emitting diodes to the transparent layer.

12 . The light-emitting diode package of claim 1 , wherein the plurality of light-emitting diodes comprise a flip chip structure in which the plurality of light-emitting diode electrode pads comprises a pair of electrode pads on each of the plurality of light-emitting diodes on a surface opposite of the light-emitting surface.

13 . The light-emitting diode package of claim 1 , wherein the spacer further comprises a third side surface that corresponds to an outer edge of the transparent layer, and

wherein the first side surface faces in a direction opposite of a facing direction of the third side surface.

14 . The light-emitting diode package of claim 1 , wherein the first side surface or the second side surface is in contact with one of the plurality of light-emitting diodes.

15 . The light-emitting diode package of claim 1 , wherein the spacer is configured to cover the plurality of light-emitting diodes.

16 . The light-emitting diode package of claim 1 , wherein the spacer comprises an insulating material, and

wherein the light-emitting diode package further comprises a plurality of package electrode pads on an upper end of the spacer.

17 . A light-emitting diode package, comprising:

a transparent layer;

a plurality of light-emitting diodes disposed on a surface of the transparent layer, wherein each of the plurality of light-emitting diodes comprise a light-emitting surface that faces the transparent layer and an electrode pad on a surface opposite the light-emitting surface;

a protection member configured to cover the plurality of light-emitting diodes; and

a spacer disposed on the surface of the transparent layer and configured to space the protection member apart from the transparent layer,

wherein the spacer surrounds the plurality of light-emitting diodes,

wherein the spacer includes a space that is defined by at least a first side surface of the spacer and a second side surface of the spacer that faces the first side surface, and

wherein the plurality of light-emitting diodes are in the space of the spacer.

18 . The light-emitting diode package of claim 17 , further comprising an insulating member disposed in a space between the transparent layer and the protection member.

19 . The light-emitting diode package of claim 18 , wherein the spacer comprises an organic matter;

wherein the spacer is formed along an outer edge of the transparent layer, and

wherein the spacer comprises a closed loop.

Assignments (1)

Priority Claims (1)

Continuity (2)

References Cited (67)