Multilayer ceramic capacitor and mounting structure of multilayer ceramic capacitor
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers, first and second main surfaces facing each other in a stacking direction, first and second side surfaces facing each other in a width direction perpendicular or substantially perpendicular to the stacking direction, and first and second end surfaces facing each other in a length direction perpendicular or substantially perpendicular to the stacking and width directions, a first external electrode on the first end surface, a second external electrode on the second end surface, a third external electrode on the first side surface, and a fourth external electrode on the second side surface. A first internal electrode layer is exposed at the first and second end surfaces, and a second internal electrode layer is exposed at the first and second side surfaces and is within a range from the second main surface to ⅓ of the multilayer body in the stacking direction.
1 . A multilayer ceramic capacitor comprising:
a multilayer body including a plurality of dielectric layers stacked on one another and a plurality of internal electrode layers respectively stacked on the dielectric layers, the multilayer body including:
a first main surface and a second main surface that face each other in a stacking direction;
a first side surface and a second side surface that face each other in a width direction perpendicular or substantially perpendicular to the stacking direction; and
a first end surface and a second end surface that face each other in a length direction perpendicular or substantially perpendicular to the stacking direction and the width direction;
a first external electrode on the first end surface;
a second external electrode on the second end surface;
a third external electrode on the first side surface; and
a fourth external electrode on the second side surface; wherein
the internal electrode layers include:
at least one first internal electrode layer exposed at the first end surface and the second end surface; and
at least two second internal electrode layers exposed at the first side surface and the second side surface;
the at least one first internal electrode layer is located only within a range from the second main surface to about one third of the multilayer body in the stacking direction;
at least one of the at least one first internal electrode layer is sandwiched between the at least two second internal electrode layers in the stacking direction; and
all internal electrode layers exposed at the first and second side surfaces are located only within the range from the second main surface to about one third of the multilayer body in the stacking direction.
2 . The multilayer ceramic capacitor according to claim 1 , further comprising:
a plurality of first internal electrode layers including the at least one first internal electrode layer;
a first region in which the dielectric layers and the plurality of first internal electrode layers are alternately stacked; and
a second region in which the at least one first internal electrode layer and the at least two second internal electrode layers are alternately stacked with the dielectric layer interposed therebetween; wherein
the second region is located closer to the second main surface than the first region.
3 . The multilayer ceramic capacitor according to claim 1 , wherein
the third external electrode includes a first bent portion on the second main surface to be in parallel or substantially in parallel with the at least two second internal electrode layers; and
the fourth external electrode includes a second bent portion on the second main surface to be in parallel or substantially in parallel with the at least two second internal electrode layers.
4 . The multilayer ceramic capacitor according to claim 1 , wherein the third external electrode and the fourth external electrode are contiguously provided on the second main surface.
5 . The multilayer ceramic capacitor according to claim 1 , further comprising:
a plurality of first internal electrode layers including the at least one first internal electrode layer; wherein
the plurality of first internal electrode layers are greater in number than the at least two second internal electrode layers.
6 . The multilayer ceramic capacitor according to claim 1 , wherein an end portion of each of the third external electrode and the fourth external electrode in the length direction of the multilayer body is located at a distance of about 5 μm or more and about 100 μm or less from an end portion of the at least two second internal electrode layers in the length direction of the multilayer body, the end portion of the at least two second internal electrode layers being exposed at a corresponding one of the first side surface and the second side surface.
7 . The multilayer ceramic capacitor according to claim 1 , wherein an end portion of each of the third external electrode and the fourth external electrode in the stacking direction of the multilayer body is located at a distance of about 5 μm or more and about 100 μm or less from one of the at least two second internal electrode layers located closest to the first main surface and exposed at a corresponding one of the first side surface and the second side surface.
8 . A mounting structure of a multilayer ceramic capacitor, the mounting structure comprising:
a mounting substrate; and
a multilayer ceramic capacitor mounted on the mounting substrate; wherein
the multilayer ceramic capacitor is the multilayer ceramic capacitor according to claim 1 ;
the mounting substrate includes:
a core of a substrate;
a first connection conductor on the core and connected to the first external electrode;
a second connection conductor on the core and connected to the second external electrode;
a third connection conductor on the core and connected to the third external electrode; and
a fourth connection conductor on the core and connected to the fourth external electrode; and
the multilayer ceramic capacitor is mounted such that the second main surface faces the mounting substrate.
9 . The mounting structure according to claim 8 , further comprising:
a plurality of first internal electrode layers including the at least one first internal electrode layer;
a first region in which the dielectric layers and the plurality of first internal electrode layers are alternately stacked; and
a second region in which the at least one first internal electrode layer and the at least two second internal electrode layers are alternately stacked with the dielectric layer interposed therebetween; wherein
the second region is located closer to the second main surface than the first region.
10 . The mounting structure according to claim 8 , wherein
the third external electrode includes a first bent portion on the second main surface to be in parallel or substantially in parallel with the at least two second internal electrode layers; and
the fourth external electrode includes a second bent portion on the second main surface to be in parallel or substantially in parallel with the at least two second internal electrode layers.
11 . The mounting structure according to claim 8 , wherein the third external electrode and the fourth external electrode are contiguously provided on the second main surface.
12 . The mounting structure according to claim 8 , further comprising:
a plurality of first internal electrode layers including the at least one first internal electrode layer; wherein
the plurality of first internal electrode layers are greater in number than the at least two second internal electrode layers.
13 . The mounting structure according to claim 8 , wherein an end portion of each of the third external electrode and the fourth external electrode in the length direction of the multilayer body is located at a distance of about 5 μm or more and about 100 μm or less from an end portion of the at least two second internal electrode layers in the length direction of the multilayer body, the end portion of the at least two second internal electrode layers being exposed at a corresponding one of the first side surface and the second side surface.
14 . The mounting structure according to claim 8 , wherein an end portion of each of the third external electrode and the fourth external electrode in the stacking direction of the multilayer body is located at a distance of about 5 μm or more and about 100 μm or less from one of the at least two second internal electrode layers located closest to the first main surface and exposed at a corresponding one of the first side surface and the second side surface.