Slurry arm and chemical mechanical polishing apparatus including the same
A slurry arm is provided. The slurry arm includes: an arm body; a slurry line that extends through the arm body; an oxygen removal chamber provided in the arm body and configured to receive slurry from the slurry line; a purge gas supplier configured to supply a purge gas to the slurry in the oxygen removal chamber; and a main valve configured to selectively discharge gas from the oxygen removal chamber.
1 . A slurry arm comprising:
an arm body;
a slurry line that extends through the arm body;
an oxygen removal chamber provided in the arm body and configured to receive slurry from the slurry line;
a purge gas supplier configured to supply a purge gas to the slurry in the oxygen removal chamber, wherein the purge gas supplier comprises a bubble diffuser provided in the oxygen removal chamber and configured to generate bubbles from the purge gas, and the bubbles float oxygen from the slurry to a region of the oxygen removal chamber; and
a main valve configured to selectively discharge the purge gas and the oxygen from the oxygen removal chamber.
2 . The slurry arm of claim 1 , wherein the arm body comprises:
a slurry inlet configured to introduce the slurry into the slurry line; and
a slurry outlet configured to inject the slurry to a polishing pad of a chemical mechanical polishing (CMP) apparatus from the slurry line.
3 . The slurry arm of claim 1 , wherein the purge gas supplier comprises:
a purge gas line connected to the oxygen removal chamber and configured to supply the purge gas to the oxygen removal chamber.
4 . The slurry arm of claim 3 , wherein the bubble diffuser comprises a main diffusing block provided on a bottom surface of the oxygen removal chamber, and configured to apply a microwave to the purge gas to generate the bubbles, and
wherein a plurality of main diffusing holes are formed through the main diffusing block to provide the slurry with the bubbles.
5 . The slurry arm of claim 4 , wherein the main diffusing block has a rectangular parallelepiped shape that extends parallel to the slurry line.
6 . The slurry arm of claim 4 , wherein the plurality of main diffusing holes are formed through a side surface of the main diffusing block.
7 . The slurry arm of claim 4 , wherein the bubble diffuser further comprises an auxiliary diffusing block provided on an upper surface of the main diffusing block, and configured to apply the microwave to the purge gas to generate the bubbles, and
wherein a plurality of auxiliary diffusing holes are formed through the auxiliary diffusing block to provide the slurry with the bubbles.
8 . The slurry arm of claim 7 , wherein the auxiliary diffusing block has a cylindrical shape.
9 . The slurry arm of claim 7 , wherein the plurality of auxiliary diffusing holes are formed through a side surface of the auxiliary diffusing block.
10 . The slurry arm of claim 1 , wherein the main valve comprises a relief valve.
11 . The slurry arm of claim 1 , further comprising a pressure gauge configured to measure an internal pressure of the oxygen removal chamber.
12 . The slurry arm of claim 1 , further comprising an auxiliary valve configured to discharge the purge gas and the oxygen.
13 . The slurry arm of claim 12 , wherein the auxiliary valve comprises a check valve.
14 . A slurry arm comprising:
an arm body;
a slurry line that extends through the arm body;
an oxygen removal chamber provided in the arm body and configured to receive slurry from the slurry line;
a purge gas supplier configured to supply a purge gas to the slurry in the oxygen removal chamber, wherein the purge gas supplier comprises a bubble diffuser provided in the oxygen removal chamber and configured to generate bubbles from the purge gas, and the bubbles float oxygen from the slurry to a region of the oxygen removal chamber;
a pressure gauge configured to measure an internal pressure of the oxygen removal chamber; and
a relief valve configured to selectively discharge the purge gas and the oxygen from the oxygen removal chamber based on the internal pressure of the oxygen removal chamber measured by the pressure gauge.
15 . The slurry arm of claim 14 , wherein the purge gas supplier comprises:
a purge gas line connected to the oxygen removal chamber and configured to supply the purge gas to the oxygen removal chamber.
16 . The slurry arm of claim 15 , wherein the bubble diffuser comprises a main diffusing block provided on a bottom surface of the oxygen removal chamber, and configured to apply a microwave to the purge gas to generate the bubbles, and
wherein a plurality of main diffusing holes are formed through the main diffusing block to provide the slurry with the bubbles.
17 . The slurry arm of claim 16 , wherein the bubble diffuser further comprises an auxiliary diffusing block provided on an upper surface of the main diffusing block, and configured to apply the microwave to the purge gas to generate the bubbles, and
wherein a plurality of auxiliary diffusing holes are formed through the auxiliary diffusing block to provide the slurry with the bubbles.
18 . The slurry arm of claim 14 , further comprising a check valve configured to discharge the purge gas and the oxygen.
19 . A chemical mechanical polishing (CMP) apparatus comprising:
a polishing head configured to hold a substrate;
a platen provided under the polishing head;
a polishing pad provided on an upper surface of the platen and configured to polish the substrate; and
a slurry arm configured to supply slurry to the polishing pad,
wherein the slurry arm comprises:
an arm body;
a slurry line that extends through the arm body;
an oxygen removal chamber provided in the arm body and configured to receive the slurry from the slurry line;
a purge gas supplier configured to supply a purge gas to the slurry in the oxygen removal chamber, wherein the purge gas supplier comprises a bubble diffuser provided in the oxygen removal chamber and configured to generate bubbles from the purge gas, and the bubbles float oxygen from the slurry to a region of the oxygen removal chamber; and
a main valve configured to selectively discharge the purge gas and the oxygen from the oxygen removal chamber.
20 . The CMP apparatus of claim 19 , further comprising a conditioner configured to condition the polishing pad.