Waterproof pressure sensor including waterproof gel with covering portions and method for manufacturing the same
A pressure sensor includes a housing with an opening, a pressure sensitive body inside the housing, a waterproof gel to seal the pressure sensitive body inside the housing, and cover portions on a surface of the gel. The cover portions are non-adhesive and do not couple to each other.
1 . A pressure sensor comprising:
a housing with an opening;
a pressure sensitive body inside the housing;
a waterproof gel to seal the pressure sensitive body inside the housing; and
a plurality of cover portions disposed on a surface of the gel; wherein
the plurality of cover portions are non-adhesive and do not couple to each other;
the surface of the gel is covered by the plurality of cover portions; and
the plurality of cover portions are adhered to the surface of the gel.
2 . The pressure sensor according to claim 1 , wherein the plurality of cover portions include particles with a spherical shape or a substantially spherical shape.
3 . The pressure sensor according to claim 2 , wherein the plurality of cover portions include two or more types of particles with sphere radii different from each other.
4 . The pressure sensor according to claim 3 , wherein the plurality of cover portions satisfy a formula:
Rb <(√{square root over (2)}−1) Ra
where Ra is a sphere radius of an n-th largest particle, and Rb is a sphere radius of an (n+1)-th largest particle.
5 . The pressure sensor according to claim 2 , wherein each of the plurality of cover portions includes at least one of a silicone particle, a silica particle, and an acrylic based particle.
6 . The pressure sensor according to claim 1 , wherein the housing includes a substrate and a tubular body.
7 . The pressure sensor according to claim 6 , wherein the pressure sensitive body is on the substrate inside the tubular body and the waterproof gel is provided in the tubular body.
8 . The pressure sensor according to claim 6 , wherein the substrate is a PCB substrate, a ceramic substrate, or a lead frame.
9 . The pressure sensor according to claim 6 , wherein the tubular body has a circular cross section, a rectangular cross section, or a polygonal cross section.
10 . The pressure sensor according to claim 6 , wherein the tubular body includes a larger diameter portion and a smaller diameter portion.
11 . The pressure sensor according to claim 6 , wherein the tubular body is made of a metal or a ceramic.
12 . The pressure sensor according to claim 6 , further comprising an integrated circuit chip joined to the substrate in the tubular body.
13 . The pressure sensor according to claim 12 , wherein the pressure sensitive body and the integrated circuit chip are sealed by the waterproof gel.
14 . The pressure sensor according to claim 1 , wherein the waterproof gel is a fluorocarbon based gel, a fluorosilicone based gel, or a silicone gel.
15 . The pressure sensor according to claim 1 , wherein the waterproof gel has adhesiveness.
16 . A method for manufacturing a pressure sensor, the method comprising:
preparing an assembly including a housing with an opening, a pressure sensitive body inside the housing, and a waterproof gel to seal the pressure sensitive body inside the housing; and
providing a plurality of cover portions to be disposed on a surface of the gel; wherein
the surface of the gel is covered by the plurality of cover portions; and
the plurality of cover portions are adhered to the surface of the gel.
17 . The method for manufacturing a pressure sensor according to claim 16 , further comprising discharging, from the opening, a cover portion not adhering to the surface of the gel.
18 . The method for manufacturing a pressure sensor according to claim 16 , wherein the plurality of cover portions include two or more types of particles with a spherical shape or a substantially spherical shape and sphere radii different from each other.
19 . The method for manufacturing a pressure sensor according to claim 16 , further comprising laying a plurality of additional cover portions smaller than the cover portions on the surface of the gel.
20 . The method for manufacturing a pressure sensor according to claim 19 , further comprising discharging, from the opening, a cover portion not adhering to the surface of the gel after the laying.