Sensor module having an intermediate pedestal on which one or more die are mounted
A sensor module includes a container. The container has a closed wall extending between a first end of the container and a second end of the container. An exterior of the closed wall at least partly defines a seal-receiving channel. The seal-receiving channel extends around a circumference of the closed wall. The sensor module also includes a pedestal positioned between the first end and the second end and at least partly defining a first compartment and a second compartment surrounded by the closed wall. The sensor module further includes a sensor die positioned within the first compartment and mounted on the pedestal.
1 . A sensor module, comprising:
a container having a closed wall, the closed wall extending between a first end of the container and a second end of the container, an exterior of the closed wall at least partly defining a seal-receiving channel, the seal-receiving channel extending around a circumference of the closed wall;
a protrusion extending inward from an interior of the closed wall;
a pedestal positioned between the first end and the second end and at least partly defining a first compartment and a second compartment surrounded by the closed wall, the pedestal attached to the protrusion; and
a sensor die positioned within the first compartment and mounted on the pedestal.
2 . The sensor module of claim 1 , wherein:
the sensor die is a first sensor die; and
the sensor module further comprises a second sensor die positioned within the second compartment.
3 . The sensor module of claim 2 , wherein:
one of the first sensor die or the second sensor die includes a MEMS microphone; and
the other of the first sensor die or the second sensor die includes a MEMS pressure sensor.
4 . The sensor module of claim 2 , further comprising:
a waterproof membrane defining at least part of the first end of the container; and
a substrate defining at least part of the second end of the container.
5 . The sensor module of claim 1 , wherein the pedestal has a through-hole, the through-hole defining at least part of a conduit between the first compartment and the second compartment.
6 . The sensor module of claim 1 , wherein the pedestal comprises at least one of: a printed circuit board (PCB), a molded interconnect device (MID), a ceramic substrate, or a flexible circuit substrate.
7 . A module, comprising:
a container having a first end and a second end;
a pedestal positioned within the container and defining,
at least part of a first end of a first compartment, the first compartment disposed at least partly within the container;
at least part of a first end of a second compartment, the second compartment disposed at least partly within the container; and
at least part of a conduit extending from the first compartment to the second compartment;
a first die positioned within the first compartment and mounted on the pedestal; and
a second die positioned within the second compartment.
8 . The module of claim 7 , further comprising:
a third die positioned within the container and mounted on the pedestal; wherein, the first die is mounted on a first side of the pedestal;
the third die is mounted on a second side of the pedestal and is positioned within the second compartment, the second side of the pedestal opposite the first side of the pedestal; and
the first die is electrically coupled to the third die.
9 . The module of claim 8 , wherein:
the container includes,
a waterproof cover defining,
at least part of the first end of the container; and
at least part of a second end of the first compartment;
a substrate defining,
at least part of the second end of the container; and
at least part of a second end of the second compartment; and
the second die is mounted on the substrate.
10 . The module of claim 7 , wherein:
the first die includes a MEMS microphone; and
the conduit is aligned with a diaphragm of the MEMS microphone.
11 . The module of claim 7 , wherein:
the first die is mounted on a first side of the pedestal; 3 and
the second die is mounted on a second side of the pedestal, the second side of the pedestal opposite the first side of the pedestal.
12 . The module of claim 11 , wherein:
the container includes a substrate defining,
at least part of the second end of the container; and
at least part of a second end of the second compartment; and
the module further comprises:
a third die mounted on the substrate and positioned within the second compartment;
a fourth die mounted on the pedestal, between the first die and the pedestal, and positioned within the first compartment;
a first conductor, electrically coupled to the second die and the substrate; and
a second conductor, electrically coupled to the fourth die and the substrate, the second conductor extending through the conduit.
13 . The module of claim 11 , wherein:
the conduit has a first end opening into the first compartment, the first end having a first axis;
the conduit has a second end opening into the second compartment, the second end having a second axis; and
the second axis is offset from the first axis.
14 . The module of claim 13 , further comprising:
a spacer defining a second part of the conduit, the spacer defining at least part of the offset between the second axis of the second end of the conduit and the first axis of the first end of the conduit.
15 . A module, comprising:
a sleeve having,
a first end and a second end; and
an exterior defining a snout sealing surface;
a pedestal held within the sleeve, the pedestal at least partly separating a first compartment surrounded by the sleeve from a second compartment surrounded by the sleeve;
a waterproof cover attached to the first end of the sleeve and defining at least part of the first compartment; and
a set of two or more dies, each die of the set of two or more dies positioned at least partly in the first compartment or the second compartment, at a different position along an axis of the sleeve.
16 . The module of claim 15 , further comprising:
a second cover attached to the second end of the sleeve and defining at least part of the second compartment.
17 . The module of claim 16 , further comprising:
a wire bond; wherein,
the second cover includes,
a substrate attached to the second end of the sleeve, the substrate defining a through-hole; and
a lid covering the through-hole and defining a cavity; and
a portion of the wire bond extends into the cavity.
18 . The module of claim 17 , wherein:
at least a first die of the set of two or more dies is mounted to the pedestal; and
at least a second die of the set of two or more dies is mounted to the substrate.