IP Library › Granted Patent US 10,890,502
Granted Patent B2
US 10,890,502 · App. 16/114,156 · Granted Jan 12, 2021

Pressure sensor device

Inventors: Shuntaro Miyake (Matsumoto, JP); Shojiro Kurimata (Matsumoto, JP)
Assignee: FUJI ELECTRIC CO., LTD.
G01L19/147G01L9/0051G01L9/0055G01L19/0084G01L19/0627G01L19/142G01L19/148
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,890,502
App. No.
16/114,156
Granted
Jan 12, 2021
Kind
B2
Abstract

A pressure sensor device including: an absolute pressure sensor unit; a sensor case to accommodate the absolute pressure sensor unit; and an adhesive provided between the absolute pressure sensor unit and the sensor case to fix the absolute pressure sensor unit and the sensor case together, is provided. The sensor case has protrusions on the bottom surface, the absolute pressure sensor unit is provided above the protrusions, and there is space free of the adhesive at a part of a region between the absolute pressure sensor unit and the sensor case, and under the absolute pressure sensor unit.

Claims (67)

1. A pressure sensor device comprising:

an absolute pressure sensor unit;

a sensor case to accommodate the absolute pressure sensor unit; and

an adhesive provided between the absolute pressure sensor unit and the sensor case to fix the absolute pressure sensor unit and the sensor case, wherein:

the sensor case has at least one protrusion on a bottom surface;

the protrusion is under the absolute pressure sensor unit;

there is space free of the adhesive at a part of a region between the absolute pressure sensor unit and the sensor case, and under the absolute pressure sensor unit; and

a lower portion of the absolute pressure sensor unit and the bottom surface of the sensor case are fixed via the adhesive.

2. A pressure sensor device comprising:

an absolute pressure sensor unit;

a sensor case to accommodate the absolute pressure sensor unit; and

an adhesive provided between the absolute pressure sensor unit and the sensor case to fix the absolute pressure sensor unit and the sensor case, wherein:

the sensor case has at least one protrusion on a bottom surface;

the absolute pressure sensor unit is provided above the protrusion; and

there is space free of the adhesive at a part of a region between the absolute pressure sensor unit and the sensor case, and under the absolute pressure sensor unit, and

the sensor case is provided with at least three protrusions, each of which is the protrusion.

3. The pressure sensor device according to claim 1 , wherein the adhesive is provided outside the space when seen from above, under the absolute pressure sensor unit.

4. A pressure sensor device comprising:

an absolute pressure sensor unit;

a sensor case to accommodate the absolute pressure sensor unit; and

an adhesive provided between the absolute pressure sensor unit and the sensor case to fix the absolute pressure sensor unit and the sensor case, wherein:

the sensor case has at least one protrusion on a bottom surface;

the absolute pressure sensor unit is provided above the protrusion; and

there is space free of the adhesive at a part of a region between the absolute pressure sensor unit and the sensor case, and under the absolute pressure sensor unit,

the adhesive is provided outside the space when seen from above, under the absolute pressure sensor unit, and

the space is provided inside a region surrounded by a plurality of protrusions, each of which is the protrusion.

5. The pressure sensor device according to claim 1 , wherein

the adhesive is provided inside the space when seen from above, under the absolute pressure sensor unit.

6. The pressure sensor device according to claim 5 , wherein the space is provided outside a region surrounded by a plurality of protrusions, each of which is the protrusion.

7. The pressure sensor device according to claim 4 , wherein the plurality of protrusions contacts the space.

8. The pressure sensor device according to claim 1 , wherein a bottom surface of the sensor case has an aperture at a position overlapping the absolute pressure sensor unit, when seen from above the sensor case, wherein

the adhesive does not exist above the aperture.

9. The pressure sensor device according to claim 8 , wherein

the protrusion has a notch portion, when seen from above the sensor case, wherein

an edge of the notch portion and an edge of the aperture overlap, when seen from above the sensor case.

10. The pressure sensor device according to claim 9 , wherein the edge of the notch portion passes through a top of the protrusion.

11. The pressure sensor device according to claim 1 , wherein

the adhesive is provided above the protrusion so as to contact the protrusion, and

the absolute pressure sensor unit is provided above the adhesive so as to contact the adhesive.

12. The pressure sensor device according to claim 1 , further comprising a protectant composed of a same kind of material as a composing material of the adhesive, wherein

the sensor case is filled with the protectant such that the absolute pressure sensor unit is covered with the protectant.

13. A pressure sensor device comprising

an absolute pressure sensor unit,

a sensor case, wherein the sensor case is to

accommodate the absolute pressure sensor unit;

have a pressure receiving aperture portion on an upper surface;

have at least one bottom surface aperture portion smaller than the pressure receiving aperture portion on a bottom surface; and

a protrusion under the absolute pressure sensor unit, wherein

a lower portion of the absolute pressure sensor unit and a bottom surface of the sensor case are fixed via an adhesive.

14. The pressure sensor device according to claim 13 , wherein the sensor case has a concave portion to accommodate the absolute pressure sensor unit, wherein

the sensor case has the bottom surface aperture portion on a bottom surface of the concave portion.

15. The pressure sensor device according to claim 13 , wherein the sensor case has a plurality of bottom surface aperture portions, each of which is the bottom surface aperture portion.

16. The pressure sensor device according to claim 13 , wherein

the adhesive is provided above the bottom surface aperture portion.

17. The pressure sensor device according to claim 13 , wherein

the adhesive is not provided above the bottom surface aperture portion.

18. The pressure sensor device according to claim 13 , wherein

the protrusion is provided in a region that is different from a region of the bottom surface aperture portion when seen from above.

19. The pressure sensor device according to claim 1 , wherein

a groove is provided to an end of a bottom surface of the sensor case, and

the groove is provided so as to surround the absolute pressure sensor unit when seen from above the sensor case.

20. The pressure sensor device according to claim 19 , wherein

the groove is provided to a position not overlapping the absolute pressure sensor unit when seen from above the sensor case.

21. The pressure sensor device according to claim 1 , wherein

the absolute pressure sensor unit includes a support substrate, and a semiconductor substrate fixed to the support substrate;

a diaphragm is provided to an upper surface side of the semiconductor substrate; and

an enclosed space is provided between the diaphragm and the support substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2018
From: MIYAKE, SHUNTARO; KURIMATA, SHOJIRO
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 046731/0516 →
Priority Claims (3)
JP 2017-173571 · Sep 8, 2017 · national
JP 2018-082944 · Apr 24, 2018 · national
JP 2018-135613 · Jul 19, 2018 · national
Continuity (1)
Related Publication 20190078957A1 · Mar 14, 2019
Cited By (3)
US 12,207,905 US 12,467,802 US 12,656,202