Stacked filter assembly for optical integrated circuit package with an optical filter mounted to an optical integrated circuit device by a discrete semiconductor spacer block
A device includes an optical integrated circuit device mounted over an upper surface of a support substrate. The optical integrated circuit device includes an optical sensor array supported by a semiconductor substrate made of a first semiconductor material. A discrete semiconductor block, made of a second semiconductor material, is mounted over an upper surface of the optical integrated circuit device adjacent the optical sensor array. The first and second semiconductor materials have substantially matched coefficients of thermal expansion. A parallelpipedal-shaped optical filter is mounted over an upper surface of the discrete semiconductor block and extends over the optical sensor array. One or more edges/corners of the parallelpipedal-shaped optical filter cantilever over the optical sensor array without any provided support.
1. A device, comprising:
a support substrate;
an optical integrated circuit device mounted over an upper surface of the support substrate;
wherein said optical integrated circuit device includes an optical sensor array supported by a semiconductor substrate made of a first semiconductor material;
a first discrete semiconductor block made of a second semiconductor material;
wherein the first and second semiconductor materials have substantially matched coefficients of thermal expansion;
wherein the first discrete semiconductor block is mounted over an upper surface of the optical integrated circuit device adjacent the optical sensor array; and
a parallelpipedal-shaped optical filter mounted over an upper surface of the first discrete semiconductor block and extending over the optical sensor array;
wherein a first edge of the parallelpipedal-shaped optical filter is supported by the first discrete semiconductor block and a second edge of the parallelpipedal-shaped optical filter opposite the first edge is not supported at all.
2. The device of claim 1 , wherein the first and second semiconductor materials are a same semiconductor material.
3. The device of claim 2 , wherein said same semiconductor material is silicon.
4. The device of claim 1 , wherein the parallelpipedal-shaped optical filter is supported solely by said first discrete semiconductor block.
5. The device of claim 1 , further comprising:
a first adhesive layer between the first discrete semiconductor block and the upper surface of the optical integrated circuit device; and
a second adhesive layer between the parallelpipedal-shaped optical filter and the upper surface of the first discrete semiconductor block.
6. The device of claim 5 , wherein at least one of the first and second adhesive layers is formed by a die attach film (DAF) layer.
7. The device of claim 1 , further comprising a cap mounted over the upper surface of the support substrate, said cap including walls delimiting a cavity within which the optical sensor array and at least part of said optical integrated circuit device is located, said cap including a wall opening aligned with the optical sensor array.
8. The device of claim 7 , further comprising a diffractive optical element mounted at said wall opening.
9. The device of claim 1 , wherein said support substrate comprises a printed circuit board (PCB) including circuit connection pads that are electrically connected to electrical connection pads of the optical integrated circuit device.
10. A device, comprising:
a support substrate;
an optical integrated circuit device mounted over an upper surface of the support substrate;
wherein said optical integrated circuit device includes an optical sensor array supported by a semiconductor substrate made of a first semiconductor material;
a first discrete semiconductor block made of a second semiconductor material;
wherein the first and second semiconductor materials have substantially matched coefficients of thermal expansion;
wherein the first discrete semiconductor block is mounted over an upper surface of the optical integrated circuit device adjacent the optical sensor array; and
a parallelpipedal-shaped optical filter mounted over an upper surface of the first discrete semiconductor block and extending over the optical sensor array;
wherein a first corner of the parallelpipedal-shaped optical filter is supported by the first discrete semiconductor block and a second corner of the parallelpipedal-shaped optical filter opposite the first corner is not supported at all.
11. The device of claim 10 , wherein the first and second semiconductor materials are a same semiconductor material.
12. The device of claim 11 , wherein said same semiconductor material is silicon.
13. The device of claim 10 , wherein the parallelpipedal-shaped optical filter is supported solely by said first discrete semiconductor block.
14. The device of claim 10 , further comprising:
a first adhesive layer between the first discrete semiconductor block and the upper surface of the optical integrated circuit device; and
a second adhesive layer between the parallelpipedal-shaped optical filter and the upper surface of the first discrete semiconductor block.
15. The device of claim 14 , wherein at least one of the first and second adhesive layers is formed by a die attach film (DAF) layer.
16. The device of claim 10 , further comprising a cap mounted over the upper surface of the support substrate, said cap including walls delimiting a cavity within which the optical sensor array and at least part of said optical integrated circuit device is located, said cap including a wall opening aligned with the optical sensor array.
17. The device of claim 16 , further comprising a diffractive optical element mounted at said wall opening.
18. The device of claim 10 , wherein said support substrate comprises a printed circuit board (PCB) including circuit connection pads that are electrically connected to electrical connection pads of the optical integrated circuit device.
19. A device, comprising:
a support substrate;
an optical integrated circuit device mounted over an upper surface of the support substrate;
wherein said optical integrated circuit device includes an optical sensor array supported by a semiconductor substrate made of a first semiconductor material;
a first discrete semiconductor block made of a second semiconductor material;
wherein the first and second semiconductor materials have substantially matched coefficients of thermal expansion;
wherein the first discrete semiconductor block is mounted over an upper surface of the optical integrated circuit device adjacent the optical sensor array; and
a parallelpipedal-shaped optical filter mounted over an upper surface of the first discrete semiconductor block and extending over the optical sensor array;
wherein the parallelpipedal-shaped optical filter includes a first edge and a second edge opposite the first edge of the parallelpipedal-shaped optical filter, and wherein the first discrete semiconductor block is positioned between the first and second edges, and wherein neither of the first and second edges of the parallelpipedal-shaped optical filter is supported at all.
20. The device of claim 19 , wherein said optical integrated circuit device further includes a further optical sensor array, and wherein said first discrete semiconductor block is positioned between the optical sensor array and the further optical sensor array.
21. The device of claim 20 , wherein the parallelpipedal-shaped optical filter at said first edge extends over the optical sensor array, and wherein the parallelpipedal-shaped optical filter at said second edge extends over the further optical sensor array.
22. The device of claim 19 , wherein the first and second semiconductor materials are a same semiconductor material.
23. The device of claim 22 , wherein said same semiconductor material is silicon.
24. The device of claim 19 , wherein the parallelpipedal-shaped optical filter is supported solely by said first discrete semiconductor block.
25. The device of claim 19 , further comprising:
a first adhesive layer between the first discrete semiconductor block and the upper surface of the optical integrated circuit device; and
a second adhesive layer between the parallelpipedal-shaped optical filter and the upper surface of the first discrete semiconductor block.
26. The device of claim 25 , wherein at least one of the first and second adhesive layers is formed by a die attach film (DAF) layer.
27. The device of claim 19 , further comprising a cap mounted over the upper surface of the support substrate, said cap including walls delimiting a cavity within which the optical sensor array and at least part of said optical integrated circuit device is located, said cap including a wall opening aligned with the optical sensor array.
28. The device of claim 27 , further comprising a diffractive optical element mounted at said wall opening.
29. The device of claim 19 , wherein said support substrate comprises a printed circuit board (PCB) including circuit connection pads that are electrically connected to electrical connection pads of the optical integrated circuit device.
30. A device, comprising:
a support substrate;
an optical integrated circuit device mounted over an upper surface of the support substrate;
wherein said optical integrated circuit device includes an optical sensor array supported by a semiconductor substrate made of a first semiconductor material;
a first discrete semiconductor block made of a second semiconductor material;
wherein the first and second semiconductor materials have substantially matched coefficients of thermal expansion;
wherein the first discrete semiconductor block is mounted over an upper surface of the optical integrated circuit device adjacent the optical sensor array; and
a parallelpipedal-shaped optical filter mounted over an upper surface of the first discrete semiconductor block and extending over the optical sensor array;
wherein the parallelpipedal-shaped optical filter is supported solely by said first discrete semiconductor block; and
wherein a first edge of the parallelpipedal-shaped optical filter is supported by the first discrete semiconductor block and a second edge of the parallelpipedal-shaped optical filter opposite the first edge is not supported at all.
31. The device of claim 30 , wherein the first and second semiconductor materials are a same semiconductor material.
32. The device of claim 31 , wherein said same semiconductor material is silicon.
33. The device of claim 30 , further comprising:
a first adhesive layer between the first discrete semiconductor block and the upper surface of the optical integrated circuit device; and
a second adhesive layer between the parallelpipedal-shaped optical filter and the upper surface of the first discrete semiconductor block.
34. The device of claim 33 , wherein at least one of the first and second adhesive layers is formed by a die attach film (DAF) layer.
35. The device of claim 30 , further comprising a cap mounted over the upper surface of the support substrate, said cap including walls delimiting a cavity within which the optical sensor array and at least part of said optical integrated circuit device is located, said cap including a wall opening aligned with the optical sensor array.
36. The device of claim 35 , further comprising a diffractive optical element mounted at said wall opening.
37. The device of claim 30 , wherein said support substrate comprises a printed circuit board (PCB) including circuit connection pads that are electrically connected to electrical connection pads of the optical integrated circuit device.