IP Library Granted Patent US 10,312,884
Granted Patent B2
US 10,312,884 · App. 15/388,364 · Granted Jun 4, 2019

Oscillation module, electronic apparatus, and moving object

Inventors: Masataka Nomura (Minowa, JP); Shigeki Sasayama (Fujimi, JP); Akira Nakada (Chino, JP)
Assignee: Seiko Epson Corporation
H03H9/19H01F5/00H01F5/04H01L23/52H01L23/535H03B5/30H03B5/326H01L2224/48091H01L2224/48227H03H7/06H03H9/0547H03H9/6436
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Quick Facts
Patent No.
US 10,312,884
App. No.
15/388,364
Granted
Jun 4, 2019
Kind
B2
Abstract

An oscillation module includes a loop interconnection, a high-frequency output interconnection, a differential amplifier, and an output terminal, the differential amplifier is connected to the output terminal with the high-frequency output interconnection, the high-frequency output interconnection crosses the loop interconnection in a grade-separated manner, and the loop interconnection is different in thickness between a crossing part and a non-crossing part with the high-frequency interconnection.

Claims (59)

1. An oscillation module comprising:

a loop interconnection;

a first interconnection;

a first circuit; and

a first terminal,

wherein the first circuit is connected to the first terminal with the first interconnection,

the first interconnection crosses the loop interconnection in a grade-separated manner, and

the loop interconnection at least partially encircles one or more circuits of an integrated circuit including the first circuit to define a loop around a perimeter of the integrated circuit, the first interconnection crosses the loop defined by the loop interconnection to connect the first terminal outside of the defined loop to the first circuit within the defined loop, and the loop interconnection is different in thickness between a crossing part and a non-crossing part with the first interconnection.

2. The oscillation module according to claim 1 , wherein

the crossing part of the loop interconnection includes a multilayer interconnection part disposed in a plurality of wiring layers stacked on one another.

3. The oscillation module according to claim 1 , wherein

the first interconnection is different in thickness from the crossing part of the loop interconnection.

4. The oscillation module according to claim 2 , wherein

the first interconnection is different in thickness from the crossing part of the loop interconnection.

5. The oscillation module according to claim 1 , wherein

the loop interconnection and the first interconnection are disposed in a plurality of wiring layers stacked on one another, and

the first interconnection is disposed in the wiring layer, which is the same as the wiring layer of the non-crossing part of the loop interconnection.

6. The oscillation module according to claim 2 , wherein

the loop interconnection and the first interconnection are disposed in a plurality of wiring layers stacked on one another, and

the first interconnection is disposed in the wiring layer, which is the same as the wiring layer of the non-crossing part of the loop interconnection.

7. The oscillation module according to claim 1 , wherein

defining the thickness of the crossing part of the loop interconnection as A, and the thickness of the non-crossing part as B,

A<B is fulfilled.

8. The oscillation module according to claim 1 , wherein

the loop interconnection is disposed so as to straddle a plurality of wiring layers stacked on one another, and the non-crossing part is disposed in the wiring layer, which is an upper layer of the wiring layer where the crossing part is disposed.

9. The oscillation module according to claim 1 , wherein

the loop interconnection is a power supply line.

10. The oscillation module according to claim 1 , wherein

the first interconnection is a high-frequency signal line.

11. An oscillation module comprising:

a loop interconnection corresponding to a first interconnection;

a first circuit block; and

a second interconnection and a third interconnection adapted to electrically connect the loop interconnection and the first circuit block to each other,

wherein the second interconnection is disposed along a first direction of the first circuit block in a planar view,

the third interconnection is disposed along a second direction different from the first direction of the first circuit block in the planar view, and

the loop interconnection at least partially encircles one or more circuits of an integrated circuit including the first circuit block to define a loop around a perimeter of the integrated circuit, and the second and third interconnections cross the loop defined by the loop interconnection to connect respective terminals outside of the defined loop to the first circuit block within the defined loop.

12. The oscillation module according to claim 11 , further comprising:

a second circuit block,

wherein at least one of the second interconnection and the third interconnection electrically connects the loop interconnection and the first circuit block to each other via the second circuit block.

13. The oscillation module according to claim 11 , further comprising:

at least one of a fourth interconnection and a fifth interconnection adapted to electrically connect the loop interconnection and the first circuit block to each other,

wherein the fourth interconnection is disposed along a third direction different from the first direction and the second direction of the first circuit block in the planar view, and

the fifth interconnection is disposed along a fourth direction different from the first direction, the second direction, the third direction, and the third direction of the first circuit block in the planar view.

14. The oscillation module according to claim 12 , further comprising:

at least one of a fourth interconnection and a fifth interconnection adapted to electrically connect the loop interconnection and the first circuit block to each other,

wherein the fourth interconnection is disposed along a third direction different from the first direction and the second direction of the first circuit block in the planar view, and

the fifth interconnection is disposed along a fourth direction different from the first direction, the second direction, the third direction, and the third direction of the first circuit block in the planar view.

15. The oscillation module according to claim 11 , wherein

the loop interconnection has a predetermined electrical potential.

16. The oscillation module according to claim 12 , wherein

the loop interconnection has a predetermined electrical potential.

17. An electronic apparatus comprising:

the oscillation module according to claim 1 .

18. An electronic apparatus comprising:

the oscillation module according to claim 11 .

19. A moving object comprising:

the oscillation module according to claim 1 .

20. A moving object comprising:

the oscillation module according to claim 11 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2016
From: NOMURA, MASATAKA; SASAYAMA, SHIGEKI; NAKADA, AKIRA
To: SEIKO EPSON CORPORATION
Reel/Frame 041177/0707 →
Priority Claims (1)
JP 2016-002309 · Jan 8, 2016 · national
Continuity (1)
Related Publication 20170201230A1 · Jul 13, 2017