Solar cell with cell architecture designed for reduced carrier recombination
A solar cell is disclosed. The solar cell incudes a substrate, a dielectric layer formed on a backside of the substrate, and a plurality of non-contiguous deposited emitter regions having a first polarity on the dielectric layer. The solar cell also includes at least one deposited emitter region having a second polarity on the dielectric layer, laterally disposed to the plurality of non-contiguous deposited emitter regions.
1. A method of forming a solar cell, comprising:
forming a plurality of openings in a top layer of a multilayered stack of materials;
forming a plurality of non-contiguous surface doped regions in portions of a polysilicon layer of the multilayered stack of materials that correspond to at least a portion of areas circumscribed by the plurality of openings in the top layer of the multilayered stack of materials;
forming a plurality of trenches around the plurality of non-contiguous surface doped regions, wherein the non-contiguous surface doped regions act as etch resist; and
forming a plurality of doped regions in portions of a substrate located under the plurality of trenches.
2. The method of claim 1 , wherein the forming the plurality of openings in the top layer of the multilayered stack of materials includes performing a laser ablation process.
3. The method of claim 1 , wherein the forming the plurality of non-contiguous surface doped regions in the portions of the polysilicon layer includes performing a non-ablating laser process.
4. The method of claim 1 , wherein the forming the plurality of non-contiguous surface doped regions in the portions of the polysilicon layer includes performing a laser ablation process.
5. The method of claim 1 , wherein the forming the plurality of non-contiguous surface doped regions in the portions of the polysilicon layer includes causing dopant from a doped insulating layer that is part of the multilayered stack of materials to be transferred into surface portions of the polysilicon layer.
6. The method of claim 1 , wherein the forming the plurality of trenches around the plurality of non-contiguous surface doped regions includes forming a plurality of non-contiguous surface doped polysilicon islands.
7. The method of claim 6 , further comprising:
forming a doped insulating layer in the plurality of trenches and on the plurality of non-contiguous surface doped polysilicon islands; and
executing a thermal process, wherein the thermal process causes dopant to be diffused from the doped insulating layer throughout the plurality of non-contiguous surface doped polysilicon islands.
8. The method of claim 7 , wherein the thermal process causes the forming of the plurality of doped regions in the substrate by causing dopant to be diffused from the doped insulating layer.
9. The method of claim 1 , wherein the multilayered stack of materials includes a plurality of layers of dielectrics.
10. A method of forming a solar cell, comprising:
in a single laser process, forming a plurality of openings in a top layer of a multilayered stack of materials and forming a plurality of non-contiguous surface doped regions in portions of a polysilicon layer of the multilayered stack of materials corresponding to the openings;
forming a plurality of trenches around the plurality of non-contiguous surface doped regions wherein the non-contiguous surface doped regions act as etch resist; and
forming a plurality of doped regions in a substrate under the trenches around the plurality of non-contiguous surface doped regions.
11. The method of claim 10 , wherein the single laser process uses one of a single laser pulse and multiple laser pulses.
12. The method of claim 10 , wherein the forming the plurality of non-contiguous surface doped regions in the portions of the polysilicon layer is caused by laser ablation.
13. The method of claim 10 , wherein an ablating laser pulse and a non-ablating laser pulse respectively cause the forming of the plurality of openings in the top layer of the multilayered stack of materials and the forming of the plurality of non-contiguous surface doped regions in the portions of the polysilicon layer of the multilayered stack of materials.
14. The method of claim 10 , wherein the forming of the plurality of non-contiguous surface doped regions in the portions of the polysilicon layer includes causing dopant from a doped insulating layer to be transferred into surface portions of the polysilicon layer.
15. The method of claim 10 , wherein the forming of the plurality of trenches around the plurality of non-contiguous surface doped regions includes forming a plurality of non-contiguous surface doped polysilicon islands.
16. The method of claim 15 , further comprising:
forming a doped insulating layer in the plurality of trenches and on the plurality of non-contiguous surface doped polysilicon islands; and
executing a thermal process, wherein the thermal process causes dopant to be diffused from the doped insulating layer throughout the plurality of non-contiguous surface doped polysilicon islands.
17. The method of claim 16 , wherein the thermal process causes the forming of the plurality of doped regions in the substrate by causing dopant to be diffused from the doped insulating layer.
18. The method of claim 10 , wherein the multilayered stack of materials includes a plurality of layers of dielectrics.