Wire module and manufacturing method thereof
A wire module is disclosed, which includes a wire group and a wire-distributing device. The wire group has a plurality of wires. The wire-distributing device includes a first wire-distributing module and a second wire-distributing module. The first wire-distributing module has a first wire-distributing member and a first sectional surface. The first sectional surface is located on the surface of one end of the first wire-distributing member, and the first part of the plurality of wires is positioned side by side on the first wire-distributing member. The second wire-distributing module has similar structures and configurations to the first wire-distributing module, wherein the first wire-distributing module is stacked on the second wire-distributing module, and the first sectional surface and the second sectional surface are correspondingly located on the same side.
1. A wire module, comprising:
a wire group having a plurality of wires; and
a wire-distributing device, comprising:
a first wire-distributing module having a first wire-distributing member and at least one first aligning-coupling portion connected to one end of the first wire-distributing member, wherein a first part of the plurality of wires is positioned side by side on the first wire-distributing member; and
a second wire-distributing module having a second wire-distributing member and at least one second aligning-coupling portion connected to one end of the second wire-distributing member, wherein a second part of the plurality of wires is positioned side by side on the second wire-distributing member,
wherein the first wire-distributing module is stacked on the second wire-distributing module, and the first wire distribution member and the second wire distribution member are relatively positioned by correspondingly combining the first aligning-coupling portion and the second aligning-coupling portion.
2. The wire module of claim 1 , wherein a pre-cut groove is disposed between the first wire-distributing member and the connected first aligning-coupling member, and a pre-cut groove is disposed between the second wire-distributing member and the connected second aligning-coupling member.
3. The wire module of claim 1 , wherein the first wire-distributing member comprises a plurality of first wire-distributing grooves, and the second wire-distributing member comprises a plurality of second wire-distributing grooves; wherein the plurality of first wire-distributing grooves and the plurality of second wire-distributing grooves are respectively disposed on opposite surfaces of the first wire-distributing member and the second wire-distributing member.
4. The wire module of claim 3 , wherein when the first wire-distributing module and the second wire-distributing module form the wire-distributing device, the plurality of the first wire-distributing grooves and the plurality of second wire-distributing grooves comprise a configuration that is not aligned with each other.
5. The wire module of claim 1 , wherein the first wire-distributing member comprises at least one first wire-distributing tube for at least one wire to pass therethrough, and the first wire-distributing tube has an adhesive injection hole and an adhesive connecting the wire via the adhesive injection hole.
6. The wire module of claim 5 , wherein the first wire-distributing member comprises at least one first wire-distributing groove, and the first wire-distributing tube is located between at least one first wire-distributing groove and the first aligning-coupling portion.
7. The wire module of claim 6 , wherein the plurality of wires comprises an electronic cable and a data cable, the electronic cable is positioned in the first wire-distributing groove, and the data cable is positioned in the first wire-distributing tube.
8. The wire module of claim 6 , further comprising:
a circuit board partially located between the first part and the second part of the plurality of wires, wherein the circuit board has a connecting end toward the wire-distributing device, and the connecting portion protrudes to form at least one positioning portion, wherein a surface of the first wire-distributing member has a positioning groove toward the second wire-distributing member, and the positioning groove has an opening toward the circuit board, and the positioning portion extends from the opening into the positioning groove.
9. A wire module, comprising:
a wire group having a plurality of wires; and
a wire-distributing device, comprising:
a first wire-distributing module having a first wire-distributing member and a first sectional surface located on a surface of one end of the first wire-distributing member, wherein a first part of the plurality of wires is positioned side by side on the first wire-distributing member; and
a second wire-distributing module having a second wire-distributing member and a second sectional surface located on a surface of one end of the second wire-distributing member, wherein a second part of the plurality of wires is positioned side by side on the second wire-distributing member;
wherein the first wire-distributing module is stacked on the second wire-distributing module, and the first sectional surface and the second sectional surface are correspondingly located on the same side.
10. The wire module of claim 9 , wherein the first wire-distributing member comprises a plurality of first wire-distributing grooves, and the second wire-distributing member comprises a plurality of second wire-distributing grooves; wherein the plurality of first wire-distributing grooves and the plurality of second wire-distributing grooves are respectively disposed on opposite surfaces of the first wire-distributing member and the second wire-distributing member.
11. The wire module of claim 9 , wherein the first wire-distributing member comprises at least one first wire-distributing tube for at least one wire to pass therethrough, and the first wire-distributing tube has an adhesive injection hole and an adhesive connecting the wire via the adhesive injection hole.
12. The wire module of claim 11 , wherein the first wire-distributing member comprises at least one first wire-distributing groove, and the first wire-distributing tube is located between at least one first wire-distributing groove and the first sectional surface.
13. The wire module of claim 11 , wherein the plurality of wires comprises an electronic cable and a data cable, the electronic cable is positioned in the first wire-distributing groove, and the data cable is positioned in the first wire-distributing tube.
14. A manufacturing method of a wire module, comprising:
sorting a plurality of wires into a first part and a second part;
fixing the first part of the plurality of wires to a first wire-distributing module, and fixing the second part of the plurality of wires to a second wire-distributing module, wherein one end of the first wire-distributing module has at least one first aligning-coupling portion, and one end of the second wire-distributing module has at least one second aligning-coupling portion; and
forming the wire module with the first wire-distributing module and the second wire-distributing module, wherein the first aligning-coupling portion is correspondingly combined with the second aligning-coupling portion to position a relative location of the first wire-distributing module and the second wire-distributing module.
15. The manufacturing method of claim 14 , wherein fixing the first part of the plurality of wires comprises:
fixing at least one of the first part of the plurality of wires to a first wire-distributing tube of the first wire-distributing module by an adhesive.
16. The manufacturing method of claim 14 , wherein fixing the first part of the plurality of wires comprises:
fixing at least one of the first part of the plurality of wires to a first wire-distributing groove of the first wire-distributing module.
17. The manufacturing method of claim 14 , wherein forming the wire module with the first wire-distributing module and the second wire-distributing module comprises:
respectively fixing at least one first aligning-coupling portion of the first wire-distributing module with the at least one second aligning-coupling portion of the second wire-distributing module by an adhesive.
18. The manufacturing method of claim 14 , wherein forming the wire module with the first wire-distributing module and the second wire-distributing module comprises:
disposing of a coupling portion on the first aligning-coupling portion; and
disposing of an aligning hole on the second aligning-coupling portion, and the coupling portion is correspondingly assembled with the aligning hole.
19. The manufacturing method of claim 14 , further comprising:
soldering the first part and the second part of the plurality of wires to a circuit board.
20. The manufacturing method of claim 19 , wherein after soldering the first part and the second part of the plurality of wires to the circuit board, the first aligning-coupling portion and the second aligning-coupling portion are selectively removed to expose a corresponding sectional surface.