IP Library Granted Patent US 11,778,730
Granted Patent B1
US 11,778,730 · App. 18/143,752 · Granted Oct 3, 2023

Printed circuit board and wireless communication terminal

Inventors: Takahiro Shinojima (Yamato, JP); Hirofumi Sakamoto (Yamato, JP); Yohei Koga (Yamato, JP); Manabu Yoshikawa (Yamato, JP); Fuyuki Hikita (Yamato, JP)
Assignee: FCNT LIMITED
H05K1/0218H05K1/0243H05K1/115H05K3/18H05K2201/10098
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Quick Facts
Patent No.
US 11,778,730
App. No.
18/143,752
Granted
Oct 3, 2023
Kind
B1
Abstract

A printed circuit board includes a dielectric substrate which is formed in a plate-like shape, ground conductor layers which are respectively provided on a top surface and a back surface of the dielectric substrate, a signal line which is provided on a side surface of the dielectric substrate, and transmits a high frequency signal, and a plurality of connection conductors which are provided in the dielectric substrate, connects the ground conductor layer provided on the top surface and the ground conductor layer provided on the back surface, and are aligned and disposed along the signal line.

Claims (28)

1. A printed circuit board comprising:

a dielectric substrate which is formed in a plate-like shape;

ground conductor layers which are respectively provided on a top surface and a back surface of the dielectric substrate;

a signal line which is provided on a side surface of the dielectric substrate, and transmits a high frequency signal; and

a plurality of connection conductors which are provided in the dielectric substrate, connects the ground conductor layer provided on the top surface and the ground conductor layer provided on the back surface, and are aligned and disposed along the signal line.

2. The printed circuit board according to claim 1 , wherein an interval between the neighboring connection conductors of the plurality of connection conductors is 0.5 mm or less.

3. The printed circuit board according to claim 1 , wherein the signal line includes

a first wall part which is disposed on the side surface of the dielectric substrate,

an upper wall part which is disposed on the top surface of the dielectric substrate and is connected to one end part of the first wall part, and

a lower wall part which is disposed on the back surface of the dielectric substrate and is connected to another end part of the first wall part.

4. The printed circuit board according to claim 3 , wherein the signal line includes a plurality of protrusion parts which are disposed between the upper wall part and the lower wall part and protrude from the first wall part to the dielectric substrate.

5. The printed circuit board according to claim 3 , wherein an interval between the neighboring connection conductors of the plurality of connection conductors is 2.5 mm or less.

6. The printed circuit board according to claim 1 , wherein the connection conductors each are formed of a via or a through-hole formed in a thickness direction of the dielectric substrate.

7. The printed circuit board according to claim 1 , wherein the signal line is formed by plating.

8. The printed circuit board according to claim 1 , wherein the signal line connects an antenna contact which is connected to an antenna used to transmit and receive the high frequency signal, and a processing circuit which performs signal processing on the high frequency signal transmitted and received via the antenna.

9. A wireless communication terminal comprising the printed circuit board according to claim 1 .

10. The wireless communication terminal according to claim 9 , further comprising:

a plate-like conductor plate; and

a connection member which electrically connects the ground conductor layer provided on the back surface, and the conductor plate.

11. The wireless communication terminal according to claim 10 , further comprising a housing which is formed of a conductor,

wherein the signal line is formed of a part of the housing disposed adjacent to the side surface.

12. A wireless communication terminal comprising the printed circuit board according to claim 2 .

13. A wireless communication terminal comprising the printed circuit board according to claim 3 .

14. A wireless communication terminal comprising the printed circuit board according to claim 4 .

15. A wireless communication terminal comprising the printed circuit board according to claim 5 .

16. A wireless communication terminal comprising the printed circuit board according to claim 6 .

17. A wireless communication terminal comprising the printed circuit board according to claim 7 .

18. A wireless communication terminal comprising the printed circuit board according to claim 8 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2024
From: YAMATO KANZAI LIMITED
To: FCNT LLC
Reel/Frame 066856/0115 →
CHANGE OF NAME Recorded Mar 19, 2024
From: FCNT LIMITED
To: YAMATO KANZAI LIMITED
Reel/Frame 066823/0300 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2023
From: SHINOJIMA, TAKAHIRO; SAKAMOTO, HIROFUMI; KOGA, YOHEI; YOSHIKAWA, MANABU; HIKITA, FUYUKI
To: FCNT LIMITED
Reel/Frame 063550/0928 →
Priority Claims (1)
JP 2022-129376 · Aug 15, 2022 · national