IP Library Granted Patent US 12,459,676
Granted Patent B1
US 12,459,676 · App. 18/144,698 · Granted Nov 4, 2025

Thermal radiator for heat rejection

Inventors: Kevin Eugene Weed (Boulder, CO); David M. Waller (Westminster, CO)
Assignee: BAE Systems Space & Mission Systems Inc.
B64G1/503B33Y80/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,459,676
App. No.
18/144,698
Granted
Nov 4, 2025
Kind
B1
Abstract

Radiator structures and methods are provided. The radiator includes conductor bar and radiating surface portions that are integral to one another. An interior surface of the conductor bar and an interior surface of the radiating surface form a continuous internal surface, and an exterior surface of the conductor bar and an exterior surface of the radiating surface form a continuous external surface. The overall form of the radiating surface can be similar to that of a flared bell, such that an interior surface of the conductor bar is exposed at a base of the flared radiating surface. Surface features can be formed on one for both of the exterior and interior surfaces of the radiator. The radiating surface can also include voids. Aspects of surface features and voids can vary with distance from a thermal interface with a heat source. The radiator structures can be formed using additive manufacturing processes.

Claims (39)

1 . A radiator, comprising:

a conductor bar, including:

a contact area;

an interior surface; and

an exterior surface; and

a radiating surface, including:

an interior surface; and

an exterior surface,

wherein the conductor bar and the radiating surface are integral to one another,

wherein the interior surface of the conductor bar and the interior surface of the radiating surface form a continuous interior surface of the radiator, and

wherein the exterior surface of the conductor bar and the exterior surface of the radiating surface form a continuous exterior surface of the radiator.

2 . The radiator of claim 1 , further comprising:

a lattice structure, wherein the lattice structure is disposed on at least portions of the exterior surface of the radiator.

3 . The radiator of claim 1 , further comprising:

a plurality of voids formed in the radiating surface.

4 . The radiator of claim 1 , further comprising:

a carbon nanotube structure on at least one of the interior surface of the radiator and the exterior surface of the radiator.

5 . A method for forming a radiator, comprising:

forming a conductor bar using an additive manufacturing process, wherein the conductor bar includes a contact area, an interior surface, and an exterior surface; and

forming a radiating surface using the additive manufacturing process, wherein the radiating surface includes an interior surface and an exterior surface,

wherein the conductor bar and the radiating surface are integral to one another,

wherein the interior surface of the conductor bar and the interior surface of the radiating surface form a continuous interior surface, and

wherein the exterior surface of the conductor bar and the exterior surface of the radiating surface form a continuous exterior surface.

6 . The method of claim 5 , further comprising:

thermally connecting the contact area of the conductor bar to a heat source.

7 . The radiator of claim 1 , wherein the radiating surface forms a tubular structure.

8 . The radiator of claim 1 , wherein at least portions of the radiating surface include surface features.

9 . The radiator of claim 1 , wherein an area of the radiating surface increases with distance from the conductor bar.

10 . The radiator of claim 1 , wherein the interior surface of the radiating surface includes a convex surface portion.

11 . The radiator of claim 1 , wherein the exterior surface of the radiating surface includes a concave surface portion.

12 . The radiator of claim 1 , wherein the interior surface of the radiating surface includes a convex surface portion, and wherein the exterior surface of the radiating surface includes a concave surface portion.

13 . The radiator of claim 1 , wherein the radiating surface is generally bell-shaped.

14 . The radiator of claim 1 , wherein the radiating surface defines a generally tubular portion proximate to the conductor bar, and wherein the radiating surface defines a flared surface distal from the conductor bar.

15 . The radiator of claim 1 , wherein the radiating surface is a solid surface in at least an area proximate to the conductor bar, and wherein the radiating surface includes voids that extend between the interior surface of the radiating surface and the exterior surface of the radiating surface in at least an area distal from the conductor bar.

16 . The radiator of claim 15 , wherein a proportion of the voids to solid surface of the radiating surface increases with distance from the conductor bar.

17 . The radiator of claim 1 , wherein the radiator includes macroscopic radiating features and microscopic radiating features.

18 . The radiator of claim 17 , wherein the microscopic radiating features are carbon nanotubes.

19 . The radiator of claim 1 , wherein at least portions of the radiating surface include triply periodic minimal surface features.

20 . The radiator of claim 1 , wherein the conductor bar and the radiating surface of the radiator are both formed from a first material.

Assignments (2)
CHANGE OF NAME Recorded Apr 4, 2024
From: BALL AEROSPACE & TECHNOLOGIES CORP.
To: BAE SYSTEMS SPACE & MISSION SYSTEMS INC.
Reel/Frame 067006/0411 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2023
From: WEED, KEVIN EUGENE; WALLER, DAVID M.
To: BALL AEROSPACE & TECHNOLOGIES CORP.
Reel/Frame 064288/0290 →
References Cited (14)
US 5310141A · Homer et al. · 1994 [cited by applicant]
US 6432344B1 · Eckman et al. · 2002 [cited by applicant]
US 8820684B2 · McKinnon et al. · 2014 [cited by applicant]
US 8910701B2 · Sepulveda et al. · 2014 [cited by applicant]
US 9411102B2 · Gidon · 2016 [cited by applicant]
US 9976815B1 · Roper · 2018 [cited by examiner]
US 10782189B2 · Wei et al. · 2020 [cited by applicant]
US 11053029B1 · Goodzeit et al. · 2021 [cited by applicant]
US 11204283B2 · Wei et al. · 2021 [cited by applicant]
US 11204284B2 · Wei et al. · 2021 [cited by applicant]
US 11226238B2 · Wei et al. · 2022 [cited by applicant]
CN 101018462A · 2007 [cited by examiner]
CN 101201154A · 2008 [cited by examiner]
CN 109233282A · 2019 [cited by examiner]