Lift pin assembly and substrate treating apparatus
Disclosed is a lift pin assembly, including: a lift pin inserted into a pin hole; a moving plate moving up and down by a driving unit; a bellows module including a lower flange supported by the moving plate and a bellows shaft supporting the lift pins; and a pressurizing member provided between the lower flange and the moving plate to apply constant pressure in a lifting direction of the bellows module.
1 . A substrate treating apparatus, comprising:
a support formed in which pin holes are formed in a vertical direction; and
a lift pin unit for loading and unloading a substrate onto and from the support,
wherein the lift pin unit includes:
a lift pin provided to move up and down along the pin hole;
a moving plate moving up and down by a driving unit;
a bellows module including a lower flange supported by the moving plate and a bellows shaft supporting the lift pins;
a pressurizing member provided between the lower flange and the moving plate to apply constant pressure in a lifting direction of the bellows module; and
a sagging prevention member configured to prevent sagging of the lift pin.
2 . The substrate treating apparatus of claim 1 , wherein the pressurizing member is provided in the form in which disc springs are stacked and disposed.
3 . The substrate treating apparatus of claim 2 , wherein the disc springs are inserted between the lower flange and the moving plate in a constant preload state.
4 . The substrate treating apparatus of claim 2 , wherein the moving plate has a concave groove, into which the lower flange is inserted, on an upper surface, and
a height adjustment bolt which penetrates from a bottom surface of the moving plate and is coupled to the lower flange located in the concave groove is included.
5 . The substrate treating apparatus of claim 4 , wherein the height adjustment bolt passes through a central hole of the disc springs and is coupled to the lower flange.
6 . The substrate treating apparatus of claim 4 , wherein according to a rotation of the height adjustment bolt, a height of the lower flange is varied in the concave groove.
7 . The substrate treating apparatus of claim 4 , wherein the number of disc springs increases or decreases according to a height adjustment of the height adjustment bolt.
8 . The substrate treating apparatus of claim 1 , wherein the bellows shaft includes an insertion groove, into which the lift pin is inserted, at an upper end.
9 . A lift pin unit for loading and unloading a substrate, the lift pin unit comprising:
a lift pin inserted into a pin hole;
a moving plate moving up and down by a driving unit;
a bellows module including a lower flange supported by the moving plate and a bellows shaft supporting the lift pins;
a pressurizing member provided between the lower flange and the moving plate to apply constant pressure in a lifting direction of the bellows module; and
a sagging prevention member configured to prevent sagging of the lift pin.
10 . The lift pin unit of claim 9 , wherein the pressurizing member is provided in the form in which disc springs are stacked and disposed.
11 . The lift pin unit of claim 10 , wherein the disc springs are inserted between the lower flange and the moving plate in a constant preload state.
12 . The lift pin unit of claim 10 , wherein the moving plate has a concave groove, into which the lower flange is inserted, on an upper surface, and
a height adjustment bolt which penetrates from a bottom surface of the moving plate and is coupled to the lower flange located in the concave groove is included.
13 . The lift pin unit of claim 12 , wherein the height adjustment bolt passes through a central hole of the disc springs and is coupled to the lower flange.
14 . The lift pin unit of claim 12 , wherein according to a rotation of the height adjustment bolt, a height of the lower flange is varied on the concave groove.
15 . The lift pin unit of claim 12 , wherein the number of disc springs increases or decreases according to a height adjustment of the height adjustment bolt.
16 . A substrate treating apparatus, comprising:
a process chamber for forming a process space;
a gas supply unit for supplying process gas into the process chamber;
a plasma generating unit for generating plasma from the process gas introduced into the process chamber; and
a substrate support unit provided in the process space and supporting a substrate,
wherein the substrate support unit includes:
a susceptor including an electrostatic electrode adsorbing a substrate with electrostatic force; and
a lift pin unit for loading and unloading the substrate onto and from the substrate support, and
the lift pin unit includes:
a lift pin inserted into a pin hole of the susceptor;
a moving plate moving up and down by a driving unit and having a concave groove on an upper surface;
a bellows module including a lower flange positioned in the concave groove and a bellows shaft supporting the lift pin;
a height adjustment bolt which passes through a through hole formed on a bottom surface of the moving plate and is coupled to the lower flange located in the concave groove, and moves the bellows module in a vertical direction according to a rotation direction;
a pressurizing member provided between the lower flange and a bottom of the concave groove to apply constant pressure in a lifting direction of the bellows module; and
a sagging prevention member configured to prevent sagging of the lift pin.
17 . The substrate treating apparatus of claim 16 , wherein the pressurizing member is provided in the form in which disc springs are stacked and disposed.
18 . The substrate treating apparatus of claim 17 , wherein the disc springs are inserted between the lower flange and the moving plate in a constant preload state.
19 . The substrate treating apparatus of claim 16 , wherein the height adjustment bolt passes through a central hole of the disc springs and is coupled to the lower flange.
20 . The substrate treating apparatus of claim 16 , wherein the bellows shaft includes an insertion groove, into which the lift pin is inserted, at an upper end.