IP Library › Granted Patent US 12,120,845
Granted Patent B2
US 12,120,845 · App. 18/147,672 · Granted Oct 15, 2024

Liquid-cooling heat dissipation plate with unequal height pin-fins and enclosed liquid-cooling cooler having the same

Inventors: Yi-Hsin Huang (New Taipei, TW); Chun-Lung Wu (New Taipei, TW); Kuo-Wei Lee (New Taipei, TW); Tze-Yang Yeh (New Taipei, TW)
Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
H05K7/20263H05K7/20409
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Quick Facts
Patent No.
US 12,120,845
App. No.
18/147,672
Granted
Oct 15, 2024
Kind
B2
Abstract

A liquid-cooling heat dissipation plate with unequal height pin-fins and an enclosed liquid-cooling cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of full-height pin-fins, and a plurality of non-full-height pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that face away from each other, the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid. The full-height and non-full-height pin-fins are formed at the second heat dissipation surface of the heat dissipation plate body. A first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid.

Claims (10)

1. A liquid-cooling heat dissipation plate with unequal height pin-fins, comprising:

a heat dissipation plate body having a first heat dissipation surface and a second heat dissipation surface that face away from each other, wherein the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid;

a plurality of full-height pin-fins formed at the second heat dissipation surface of the heat dissipation plate body; and

a plurality of non-full-height pin-fins formed at the second heat dissipation surface of the heat dissipation plate body;

wherein a first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid, N is an integer greater than or equal to two, and the plurality of heat sources correspond in position to the first heat dissipation region to the Nth heat dissipation region, respectively;

wherein a ratio of the plurality of full-height pin-fins to pin-fins in a first fifty percent of heat dissipation regions from the first heat dissipation region to the Nth heat dissipation region is less than a ratio of the plurality of full-height pin-fins to pin-fins in a second fifty percent of the heat dissipation regions from the first heat dissipation region to the Nth heat dissipation region.

2. The liquid-cooling heat dissipation plate according to claim 1 , wherein the plurality of full-height pin-fins, the plurality of non-full-height pin-fins, and the heat dissipation plate body are made of copper, copper alloy, aluminum, or aluminum alloy.

3. The liquid-cooling heat dissipation plate according to claim 1 , wherein cross-sections of the plurality of full-height pin-fins and the plurality of non-full-height pin-fins can respectively be round-shaped, ellipse-shaped, rhombus-shaped, rectangle-shaped, drop-shaped, or wing-shaped.

4. The liquid-cooling heat dissipation plate according to claim 1 , wherein a ratio of the plurality of full-height pin-fins to pin-fins in the first heat dissipation region is at least 35%, and a ratio of the plurality of full-height pin-fins to pin-fins in the Nth heat dissipation region is at least 95%.

5. An enclosed liquid-cooling cooler, comprising the liquid-cooling heat dissipation plate as claimed in claim 1 , and a heat dissipation base, wherein a groove is recessed in the heat dissipation base, the heat dissipation base is combined with the heat dissipation plate body so that a chamber is formed between the groove of the heat dissipation base and the second heat dissipation surface of the heat dissipation plate body, such that the plurality of full-height pin-fins and the plurality of non-full-height pin-fins are located in the chamber.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 28, 2022
From: HUANG, YI-HSIN; WU, CHUN-LUNG; LEE, KUO-WEI; YEH, TZE-YANG
To: AMULAIRE THERMAL TECHNOLOGY, INC.
Reel/Frame 062229/0366 →
Continuity (1)
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