Substrate fixing device
A substrate fixing device includes a base plate having a first through-hole penetrating through the base plate in a thickness direction of the base plate, a ceramic plate adhering to the base plate, having an electrode embedded in the ceramic plate and a second through-hole formed to communicate with the first through-hole, and configured to adsorb an adsorption target object by an electrostatic force that is generated when a voltage is applied to the electrode, an insulating plug arranged at a connection portion in the first through-hole connecting to the second through-hole, and a sealing member attached to the insulating plug and configured to seal a periphery of the connection portion.
1 . A substrate fixing device comprising:
a base plate having a first through-hole penetrating through the base plate in a thickness direction of the base plate;
a ceramic plate adhering to the base plate, having an electrode embedded in the ceramic plate and a second through-hole formed to communicate with the first through-hole, and configured to adsorb an adsorption target object by an electrostatic force that is generated when a voltage is applied to the electrode;
an insulating plug arranged at a connection portion in the first through-hole connecting to the second through-hole;
a sealing member attached to the insulating plug and configured to seal a periphery of the connection portion; and
an adhesive material configured to bond the base plate and the ceramic plate, the adhesive material being provided between the base plate and the ceramic plate,
wherein
the first through-hole has an opening portion connecting to the second through-hole at the connection portion, and a spot facing portion provided in the opening portion,
the insulating plug is arranged in the spot facing portion,
the sealing member is disposed to separate a space in which the insulating plug is arranged from a space in which the adhesive material is arranged, with the sealing member in contact with an entirety of a side surface of the adhesive material facing the first through-hole, and
the sealing member has one end surface in a vertical direction in contact with a surface of the ceramic plate and the other end surface in the vertical direction in press contact with the insulating plug.
2 . The substrate fixing device according to claim 1 ,
wherein the insulating plug is fixed to the base plate without using an adhesive material in a state where the insulating plug is located in the spot facing portion of the first through-hole of the base plate.
3 . The substrate fixing device according to claim 1 , wherein the insulating plug has:
a large-diameter portion having substantially the same diameter as that of the spot facing portion of the first through-hole, and
a small-diameter portion overlapping the large-diameter portion and having a diameter smaller than the large-diameter portion, and
wherein the sealing member has a through-hole through which the small-diameter portion is inserted.
4 . The substrate fixing device according to claim 3 ,
wherein the large-diameter portion has a cylindrical shape and is entirely accommodated in the spot facing portion.
5 . The substrate fixing device according to claim 4 , wherein the small-diameter portion has a cylindrical portion having a diameter smaller than the large-diameter portion.
6 . The substrate fixing device according to claim 4 , wherein the small-diameter portion has a truncated conical portion extending from the large-diameter portion in a tapered shape.
7 . The substrate fixing device according to claim 4 , wherein the small-diameter portion has a truncated conical portion extending from the large-diameter portion in a tapered shape, and a cylindrical portion overlapping the truncated conical portion.
8 . The substrate fixing device according to claim 4 , wherein the small-diameter portion has:
a first cylindrical portion overlapping the large-diameter portion and having a diameter smaller than the large-diameter portion, and
a second cylindrical portion overlapping the first cylindrical portion and having a diameter smaller than the first cylindrical portion.
9 . The substrate fixing device according to claim 4 , wherein the small-diameter portion has:
a first cylindrical portion overlapping the large-diameter portion and having a diameter smaller than the large-diameter portion, and
a second cylindrical portion overlapping the first cylindrical portion and having a diameter smaller than the large-diameter portion and larger than the first cylindrical portion.
10 . The substrate fixing device according to claim 1 , further comprising a porous plug arranged in the second through-hole and having a plurality of holes through which a gas passes.
11 . The substrate fixing device according to claim 1 , wherein the insulating plug is a porous body having a plurality of holes.
12 . The substrate fixing device according to claim 1 , wherein the insulating plug is an insulating sleeve having a through-hole formed to communicate with the first through-hole.
13 . The substrate fixing device according to claim 1 , wherein a gap is provided between the insulating plug and the ceramic plate in the thickness direction of the base plate.