IP Library Patent Application 18157866
Patent Application
App. No. 18/157,866

Polyurethane Reactive Hot Melt With Long Pot-Life Under Heat

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Quick Facts
Patent No.
US None
App. No.
18/157,866
Abstract

Disclosed is a moisture reactive hot melt adhesive composition prepared from a combination comprising a polyisocyanate; a polyol; a MA-SCA acid; one or both of an inorganic filler or an organosilane; optionally a thermoplastic polymer; and optionally one or more additives. Useful polyols include poly(hexanediol adipate), a polyester diol having a structure of Formula 1 or of Formula 2 and combinations thereof. Formula 1 is: H—[O(CH 2 ) m OOC(CH 2 ) n CO] k —O(CH 2 ) m —OH; m and n are each an even integer; m+n =8; m and n are each independently selected from 2, 4 or 6; k is an integer from 9 to 55; and the polyol of Formula 1 has a number average molecular weight of about 2,000 to about 11,000. Formula 2, a polycaprolactone polyol, is: HO—[(CH 2 ) 5 COO] p —R 1 —[OOC(CH 2 ) 5 ] 1 —OH; R 1 is an initiator such as 1,4′-butanediol, 1,6′-hexanediol, or ethylene glycol; p is an integer from 0 to 96; q is an integer from 0 to 96; p+q=16 to 96; and the polyol has a number average molecular weight of about 2,000 to about 11,000 or less.

Claims (29)

1 . A moisture reactive hot melt adhesive polyurethane composition that is the product of a mixture comprising a polyisocyanate; a polyol; a MA-SCA acid; one or both of an inorganic filler or an organosilane; optionally a thermoplastic polymer; and optionally one or more additives.

2 . A moisture reactive hot melt adhesive composition as recited in claim 1 wherein the polyol is selected from the group consisting of poly(alkyldiol adipate) or a polyester diol having a structure of Formula 1 or of Formula 2;

wherein Formula 1 is:

H—[O(CH 2 ) m OOC(CH 2 ) n CO] k —O(CH 2 ) m —OH;

m and n are each an even integer; m+n=8; m and n are each independently selected from 2, 4 or 6; k is an integer from 9 to 55; and the polyol of Formula 1 has a number average molecular weight of about 2,000 to about 11,000; and

Formula 2 is:

HO—[(CH 2 ) 5 COO] p —R 1 —[OOC(CH 2 ) 5 ] q —OH;

R 1 is an initiator; p s an integer from 0 to 96; q is an integer from 0 to 96; p+q=16 to 96; and the polyol has a number average molecular weight of about 2,000 to about 11,000.

3 . A moisture reactive hot melt adhesive composition as recited in claim 2 comprising both poly(alkyldiol adipate) and the polyester diol having a structure of Formula 1 or of Formula 2.

4 . A moisture reactive hot melt adhesive composition as recited in claim 2 wherein the poly(alkyldiol adipate) is selected from poly(alkyldiol adipate), poly(butanediol adipate) or both.

5 . A moisture reactive hot melt adhesive composition as recited in claim 2 wherein R 1 is a residue of a glycol initiator selected from 1,4′-butanediol, 1,6′-hexanediol, ethylene glycol and combinations thereof.

6 . A moisture reactive hot melt adhesive composition as recited in claim 2 , wherein the polyester diol has a number average molecular weight of from 2,000 to 10,000 and is present in an amount of from 10 to 35% by weight based on the total adhesive weight.

7 . A moisture reactive hot melt adhesive composition as recited in claim 1 wherein said polyol is a polyether polyol having a number average molecular weight of from 1,500 to 6,000 and being present in an amount of from 15 to 40% by weight based on the total adhesive weight.

8 . A moisture reactive hot melt adhesive composition as recited in claim 1 wherein the polyol comprises at least one polypropylene glycol.

9 . A moisture reactive hot melt adhesive composition as recited in claim 1 , wherein the thermoplastic polymer is an acrylic polymer having a weight average molecular weight of from 30,000 to 80,000 and is present in an amount of from 10 to 40% by weight based on the total adhesive weight.

10 . A moisture reactive hot melt adhesive composition as recited in claim 1 , wherein the thermoplastic polymer is an acrylic polymer having a glass transition temperature of from 35 to 85° C. and a hydroxyl number of less than 8.

11 . A moisture reactive hot melt adhesive composition as recited in claim 1 , wherein said polyisocyanate is present in an amount of from 5 to 40% by weight based on the total adhesive weight; and/or the polyisocyanate comprises 4,4′-methylenebisphenyldiisocyanate (MDI).

12 . A moisture reactive hot melt adhesive composition as recited in claim 1 , wherein said inorganic filler is present in an amount of from about 10 to 70% by weight based on the total adhesive weight; and/or wherein said inorganic filler is present and comprises calcium carbonate.

13 . A moisture reactive hot melt adhesive composition as recited in claim 1 , further comprising the additive selected from additional filler, plasticizer, catalyst, colorant, rheology modifier, flame retardant, UV pigment, nanofiber, defoamer, tackifier, curing catalyst, anti-oxidant, adhesion promoter, stabilizer, a thixotropic agent and mixtures thereof.

14 . A moisture reactive hot melt adhesive composition as recited in claim 1 , further comprising 2,2′-dimorpholinildiethylether (DMDEE).

15 . An article of manufacture comprising the moisture reactive hot melt adhesive composition according to claim 1 .

16 . A method of bonding two substrates together comprising:

providing a first substrate and a second substrate;

providing the hot melt adhesive according to claim 1 ;

heating the provided adhesive to molten form;

applying the adhesive in molten form to the first substrate;

bringing a second substrate into contact with the adhesive on the first substrate; and

allowing the adhesive to cool and cure to an irreversible solid form.

17 . Cured reaction products of the hot melt adhesive composition according to claim 1 .

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2025
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 070414/0351 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2025
From: FRANKEN, UWE
To: HENKEL AG & CO. KGAA
Reel/Frame 070315/0670 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2025
From: LI, YINGJIE
To: HENKEL IP & HOLDING GMBH
Reel/Frame 070315/0814 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2025
From: QIN, SHUHUI
To: HENKEL IP & HOLDING GMBH
Reel/Frame 070316/0051 →