IP Library › Granted Patent US 12,581,726
Granted Patent B2
US 12,581,726 · App. 18/160,914 · Granted Mar 17, 2026

Electronic component and electronic circuit comprising a capacitor and an inductor

Inventors: Yoshimasa Yoshioka (Nagaokakyo, JP); Hiroshi Nakagawa (Nagaokakyo, JP)
Assignee: Murata Manufacturing Co., Ltd.
H10D84/201H10D1/20H10D1/716H10D84/038
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,581,726
App. No.
18/160,914
Granted
Mar 17, 2026
Kind
B2
Abstract

An electronic component, an electronic circuit, and a method for manufacturing an electronic component. An electronic component includes a substrate having first and second main surfaces facing each other and containing a silicon element; a capacitor element on the first main surface; and an inductor element on the first or second main surfaces in a direction orthogonal to the first main surface with respect to the capacitor element and electrically connected to the capacitor element. The capacitor element includes a first electrode portion extending in a direction intersecting the first main surface between the first and second main surfaces; a second electrode portion that extends in the direction intersecting the first main surface between the first and second main surfaces, and faces the first electrode portion in a direction parallel to the first main surface; and a dielectric portion between the first and second electrode portions.

Claims (80)

1 . An electronic component comprising:

a substrate having a first main surface and a second main surface facing each other and containing a silicon element;

at least one capacitor element on the first main surface of the substrate;

at least one inductor element on the first main surface or the second main surface of the substrate in a direction orthogonal to the first main surface with respect to the capacitor element and electrically connected to the capacitor element; and

a connection layer that connects the capacitor element and the inductor element between the capacitor element and the inductor element,

wherein the capacitor element includes:

a first electrode portion extending in a direction intersecting the first main surface between the first main surface and the second main surface, and located on a side facing the substrate;

a second electrode portion that extends in the direction intersecting the first main surface between the first main surface and the second main surface, and faces the first electrode portion in a direction parallel to the first main surface; and

a dielectric portion between the first electrode portion and the second electrode portion,

wherein the inductor element includes:

an element body having a third main surface on a side opposite to the substrate and containing a magnetic material;

an inductor wire in the element body and extending in the direction parallel to the first main surface; and

a vertical wire that is in the element body, is connected to an end of the inductor wire, and extends to the third main surface,

wherein a thickness of the inductor wire is larger than a thickness of the second electrode portion, and

wherein the connection layer includes a connection conductor layer, and the connection conductor layer does not go around more than one turn.

2 . The electronic component according to claim 1 , further comprising:

a shield layer between the capacitor element and the inductor element,

wherein the shield layer includes a shield conductor layer extending in the direction parallel to the first main surface.

3 . The electronic component according to claim 2 , wherein

the thickness of the inductor wire is larger than a thickness of the shield conductor layer.

4 . The electronic component according to claim 2 , wherein

the connection conductor layer extends in the direction parallel to the first main surface.

5 . The electronic component according to claim 1 , wherein

the connection conductor layer extends in the direction parallel to the first main surface.

6 . The electronic component according to claim 5 , wherein

the thickness of the inductor wire is larger than a thickness of the connection conductor layer.

7 . The electronic component according to claim 1 , wherein

the capacitor element includes a vertical wire that is connected to the first electrode portion or the second electrode portion, extends to the third main surface through the element body, and is not connected to the inductor wire.

8 . The electronic component according to claim 1 , wherein

the thickness of the inductor wire is 10 times or more the thickness of the second electrode portion.

9 . The electronic component according to claim 1 , wherein

a composition of the inductor wire is different from a composition of each of the first electrode portion and the second electrode portion.

10 . The electronic component according to claim 1 , wherein

the capacitor element has a thickness of 100 μm or less, the inductor element has a thickness of 200 μm or less, and the electronic component has a thickness of 300 μm or less.

11 . The electronic component according to claim 1 , further comprising:

at least one of the following:

the at least one capacitor element is a plurality of capacitor elements; and

the at least one inductor element is a plurality of inductor elements.

12 . The electronic component according to claim 1 , further comprising:

a connection layer that connects the capacitor element and the inductor element between the capacitor element and the inductor element,

wherein the connection layer includes a first end surface on a side facing the inductor element and a second end surface on a side facing the capacitor element, and includes a vertical wire extending in the direction orthogonal to the first main surface, and an area of the first end surface is larger than an area of the second end surface.

13 . The electronic component according to claim 1 , wherein

the substrate includes a groove portion on a side of the first main surface into which the second electrode portion is inserted, and

the inductor element is on a side opposite to an opening of the groove portion with respect to the substrate.

14 . The electronic component according to claim 1 , wherein

the substrate includes a groove portion on a side of the first main surface into which the second electrode portion extends, and

the inductor element is on an opening side of the groove portion with respect to the substrate.

15 . The electronic component according to claim 1 , wherein

the substrate includes a groove portion on a side of the first main surface into which the second electrode portion extends, and

when viewed from the direction orthogonal to the first main surface, a shape of the first main surface of the substrate excluding the groove portion includes a plurality of polygons, and a number of vertices of the polygon is six or more.

16 . The electronic component according to claim 1 , wherein

the first electrode portion is a porous metal layer on the first main surface or the second main surface,

the porous metal layer includes pores extending in the direction intersecting the first main surface,

the dielectric portion is on an inner surface of the pores, and

the second electrode portion is on the dielectric portion.

17 . The electronic component according to claim 1 , wherein

an electrical resistivity of the substrate is 1 Ω·cm or less.

18 . The electronic component according to claim 1 , wherein

in a cross section orthogonal to an extending direction of the inductor wire, the inductor wire has a top surface and a bottom surface parallel to the first main surface, and two side surfaces orthogonal to the first main surface, and

at least one of the top surface and the bottom surface and the two side surfaces orthogonal to the first main surface are in contact with the element body.

19 . An electronic circuit comprising:

the electronic component according to claim 1 ;

a switching element electrically connected to the inductor element;

a ground electrically connected to the capacitor element; and

a load element electrically connected to the inductor element and the capacitor element.

20 . An electronic component comprising:

a substrate having a first main surface and a second main surface facing each other and containing a silicon element;

at least one capacitor element on the first main surface of the substrate;

at least one inductor element on the first main surface or the second main surface of the substrate in a direction orthogonal to the first main surface with respect to the capacitor element and electrically connected to the capacitor element; and

a connection layer that connects the capacitor element and the inductor element between the capacitor element and the inductor element,

wherein the capacitor element includes:

a first electrode portion extending in a direction intersecting the first main surface between the first main surface and the second main surface, and located on a side facing the substrate;

a second electrode portion that extends in the direction intersecting the first main surface between the first main surface and the second main surface, and faces the first electrode portion in a direction parallel to the first main surface; and

a dielectric portion between the first electrode portion and the second electrode portion,

wherein the inductor element includes:

an element body having a third main surface on a side opposite to the substrate and containing a magnetic material;

an inductor wire in the element body and extending in the direction parallel to the first main surface; and

a vertical wire that is in the element body, is connected to an end of the inductor wire, and extends to the third main surface,

wherein a thickness of the inductor wire is larger than a thickness of the second electrode portion, and

wherein the connection layer includes a first end surface on a side facing the inductor element and a second end surface on a side facing the capacitor element, and includes a vertical wire extending in the direction orthogonal to the first main surface, and an area of the first end surface is larger than an area of the second end surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2023
From: YOSHIOKA, YOSHIMASA; NAKAGAWA, HIROSHI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 062707/0018 →
Priority Claims (1)
JP 2022-012142 · Jan 28, 2022 · national
Continuity (1)
Related Publication 20230246022A1 · Aug 3, 2023
References Cited (10)
US 20220310582A1 · Obata · 2022 [cited by examiner]
JP H09213894A · 1997 [cited by applicant]
JP 2001523050A · 2001 [cited by applicant]
JP 2002057037A · 2002 [cited by applicant]
JP 2002184945A · 2002 [cited by applicant]
JP 2002190426A · 2002 [cited by applicant]
JP 2008251972A · 2008 [cited by applicant]
JP 2020107880A · 2020 [cited by applicant]
JP 2020145475A · 2020 [cited by applicant]
JP 2021068825A · 2021 [cited by applicant]