IP Library Granted Patent US 12,467,153
Granted Patent B2
US 12,467,153 · App. 18/164,239 · Granted Nov 11, 2025

Electrochemical-additive manufacturing systems comprising membranes

Inventors: David Pain (San Diego, CA); Andrew Edmonds (San Diego, CA); Glenn Sklar (San Diego, CA); Kareemullah Shaik (San Diego, CA)
Assignee: Fabric8Labs, Inc.
C25D1/003B33Y10/00B33Y30/00
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Quick Facts
Patent No.
US 12,467,153
App. No.
18/164,239
Granted
Nov 11, 2025
Kind
B2
Abstract

Described herein are electrochemical-additive manufacturing (ECAM) systems comprising membranes and methods of operating thereof. An ECAM system comprises an electrode array with individually-addressable electrodes, a deposition electrode, and a membrane positioned between the deposition electrode and electrode array. In some examples, the membrane is configured to transmit protons while blocking gas bubbles, such as oxygen bubbles forming at the electrode array surface. Isolating these bubbles from the deposition electrode helps to preserve the desired component resolution of deposited materials. In some examples, the membrane is also configured to block other components (e.g., metal ions) to maintain different electrolyte compositions (e.g., anolyte and catholyte) on the opposite sides of the membrane. For example, the anolyte may comprise multivalent cations that are oxidized (e.g., Fe +2 →Fe +3 ) thereby decreasing the oxygen gas formation. Furthermore, the membrane allows flowing the anolyte and catholyte at different flow rates.

Claims (66)

1 . An electrochemical-additive manufacturing system comprising:

a system controller;

a deposition power supply;

deposition control circuits electrically coupled to the deposition power supply and communicatively coupled to and individually controlled by the system controller;

an electrode array comprises individually-addressable electrodes, each electrically coupled to one of the deposition control circuits;

a deposition electrode, electrically coupled to the deposition power supply and forming a gap with the electrode array;

a membrane positioned within the gap between the deposition electrode and electrode array, wherein the membrane is configured to transmit protons through the membrane and to block at least metal ions from being transmitted through the membrane; and

a membrane-support subsystem, positioned outside of the gap between the deposition electrode and electrode array, engaging and supporting the membrane in between the deposition electrode and electrode array, wherein the membrane-support subsystem is configured to move the membrane relative to the electrode array in at least one direction, parallel to a membrane-facing surface of the electrode array.

2 . The electrochemical-additive manufacturing system of claim 1 , wherein the membrane has a thickness of between 10 micrometers and 500 micrometers.

3 . The electrochemical-additive manufacturing system of claim 1 , further comprising a membrane support, positioned within the gap between the deposition electrode and electrode array, wherein the membrane support comprises support openings, each aligned with a different one of the individually-addressable electrodes.

4 . The electrochemical-additive manufacturing system of claim 3 , wherein the membrane comprises a plurality of disjoined structures, each positioned within a different one of the support openings.

5 . The electrochemical-additive manufacturing system of claim 3 , wherein:

the membrane support comprises a first membrane-support component and a second membrane-support component,

the first membrane-support component comprises a first subset of the support openings,

the second membrane-support component comprises a second subset of the support openings aligned with the first subset of the support openings, and

the membrane is positioned between the first membrane-support component and the second membrane-support component.

6 . The electrochemical-additive manufacturing system of claim 3 , wherein the support openings have a largest cross-sectional dimension (CSD O ) that is within 50% of a largest cross-sectional dimension (CSD P ) of each of the individually-addressable electrodes.

7 . The electrochemical-additive manufacturing system of claim 1 , wherein the membrane-support subsystem is configured to change an average distance between the membrane and the electrode array.

8 . The electrochemical-additive manufacturing system of claim 1 , further comprising a position actuator configured to adjust a gap between the deposition electrode and electrode array.

9 . The electrochemical-additive manufacturing system of claim 1 , further comprising a fluid-management subsystem configured to:

supply an anolyte between the membrane and the electrode array, and

supply a catholyte between the membrane and the deposition electrode such that the anolyte and the catholyte have different compositions.

10 . The electrochemical-additive manufacturing system of claim 9 , wherein the fluid-management subsystem is configured to:

flow the anolyte between the membrane and the electrode array at a first flow rate; and

flow the catholyte between the membrane and the deposition electrode at a second flow rate, different from the first flow rate.

11 . The electrochemical-additive manufacturing system of claim 9 , wherein the fluid-management subsystem is configured to:

receive, recondition, and resupply the anolyte between the membrane and the electrode array; and

receive, recondition, and resupply the catholyte between the membrane and the deposition electrode.

12 . An electrochemical-additive manufacturing system comprising:

a system controller;

a deposition power supply;

deposition control circuits electrically coupled to the deposition power supply and communicatively coupled to and individually controlled by the system controller;

an electrode array comprises individually-addressable electrodes, each electrically coupled to one of the deposition control circuits;

a deposition electrode, electrically coupled to the deposition power supply and forming a gap with the electrode array;

a membrane positioned within the gap between the deposition electrode and electrode array, wherein the membrane is configured to transmit protons through the membrane and to block at least metal ions from being transmitted through the membrane; and

a membrane support, positioned within the gap between the deposition electrode and electrode array, wherein:

the membrane support comprises support openings, each aligned with a different one of the individually-addressable electrodes, and

the membrane comprises a plurality of disjoined structures, each positioned within a different one of the support openings.

13 . The electrochemical-additive manufacturing system of claim 12 , wherein:

the membrane support comprises a first membrane-support component and a second membrane-support component,

the first membrane-support component comprises a first subset of the support openings,

the second membrane-support component comprises a second subset of the support openings aligned with the first subset of the support openings, and

the membrane is positioned between the first membrane-support component and the second membrane-support component.

14 . The electrochemical-additive manufacturing system of claim 12 , wherein the support openings have a largest cross-sectional dimension (CSD O ) that is within 50% of a largest cross-sectional dimension (CSD P ) of each of the individually-addressable electrodes.

15 . The electrochemical-additive manufacturing system of claim 12 , further comprising a position actuator configured to adjust a gap between the deposition electrode and electrode array.

16 . The electrochemical-additive manufacturing system of claim 12 , further comprising a fluid-management subsystem configured to:

supply an anolyte between the membrane and the electrode array, and

supply a catholyte between the membrane and the deposition electrode such that the anolyte and the catholyte have different compositions.

17 . An electrochemical-additive manufacturing system comprising:

a system controller;

a deposition power supply;

deposition control circuits electrically coupled to the deposition power supply and communicatively coupled to and individually controlled by the system controller;

an electrode array comprises individually-addressable electrodes, each electrically coupled to one of the deposition control circuits;

a deposition electrode, electrically coupled to the deposition power supply and forming a gap with the electrode array;

a membrane positioned within the gap between the deposition electrode and electrode array, wherein the membrane is configured to transmit protons through the membrane and to block at least metal ions from being transmitted through the membrane; and

a membrane support, positioned within the gap between the deposition electrode and electrode array, wherein:

the membrane support comprises support openings, each aligned with a different one of the individually-addressable electrodes,

the membrane support comprises a first membrane-support component and a second membrane-support component,

the first membrane-support component comprises a first subset of the support openings,

the second membrane-support component comprises a second subset of the support openings aligned with the first subset of the support openings, and

the membrane is positioned between the first membrane-support component and the second membrane-support component.

18 . The electrochemical-additive manufacturing system of claim 17 , wherein the support openings have a largest cross-sectional dimension (CSD O ) that is within 50% of a largest cross-sectional dimension (CSD P ) of each of the individually-addressable electrodes.

19 . The electrochemical-additive manufacturing system of claim 17 , further comprising a position actuator configured to adjust a gap between the deposition electrode and electrode array.

20 . The electrochemical-additive manufacturing system of claim 17 , further comprising a fluid-management subsystem configured to:

supply an anolyte between the membrane and the electrode array, and

supply a catholyte between the membrane and the deposition electrode such that the anolyte and the catholyte have different compositions.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2023
From: PAIN, DAVID; EDMONDS, ANDREW; SKLAR, GLENN; SHAIK, KAREEMULLAH
To: FABRIC8LABS, INC.
Reel/Frame 062588/0266 →
Continuity (2)
Provisional Application 63478637 · Jan 5, 2023
Related Publication 20240229273A1 · Jul 11, 2024
References Cited (54)
US 4575330A · Hull · 1986 [cited by applicant]
US 4678282A · Yaniv et al. · 1987 [cited by applicant]
US 5132820A · Someya et al. · 1992 [cited by applicant]
US 5403460A · Sala et al. · 1995 [cited by applicant]
US 5641391A · Hunter et al. · 1997 [cited by applicant]
US 5998805A · Shi et al. · 1999 [cited by applicant]
US 6036834A · Clerc · 2000 [cited by applicant]
US 7839831B2 · Vrcelj et al. · 2010 [cited by applicant]
US 7998323B1 · Chandra · 2011 [cited by examiner]
US 8147660B1 · Mayer · 2012 [cited by examiner]
US 8168540B1 · Reid et al. · 2012 [cited by applicant]
US 8681077B2 · Kimura · 2014 [cited by applicant]
US 9777385B2 · Wirth et al. · 2017 [cited by applicant]
US 10465307B2 · Pain et al. · 2019 [cited by applicant]
US 10724146B1 · Pain et al. · 2020 [cited by applicant]
US 10914000B1 · Pain et al. · 2021 [cited by applicant]
US 10947632B1 · Pain et al. · 2021 [cited by applicant]
US 11232956B2 · Pain et al. · 2022 [cited by applicant]
US 11313035B2 · Pain et al. · 2022 [cited by applicant]
US 11313036B2 · Pain et al. · 2022 [cited by applicant]
US 11401603B2 · Pain et al. · 2022 [cited by applicant]
US 20010014409A1 · Cohen · 2001 [cited by applicant]
US 20030006133A1 · Metzger · 2003 [cited by applicant]
US 20040129573A1 · Cohen · 2004 [cited by applicant]
US 20050045252A1 · Yamasaki et al. · 2005 [cited by applicant]
US 20050121326A1 · Klocke · 2005 [cited by examiner]
US 20050176238A1 · Cohen et al. · 2005 [cited by applicant]
US 20050183959A1 · Wilson et al. · 2005 [cited by applicant]
US 20050202660A1 · Cohen et al. · 2005 [cited by applicant]
US 20050223543A1 · Cohen et al. · 2005 [cited by applicant]
US 20060283539A1 · Slafer · 2006 [cited by applicant]
US 20070068819A1 · Singh et al. · 2007 [cited by applicant]
US 20070089993A1 · Schwartz et al. · 2007 [cited by applicant]
US 20070221504A1 · Luo · 2007 [cited by applicant]
US 20100300886A1 · Lin et al. · 2010 [cited by applicant]
US 20110210005A1 · Bossche et al. · 2011 [cited by applicant]
US 20130334052A1 · Chua · 2013 [cited by examiner]
US 20170145584A1 · Wirth et al. · 2017 [cited by applicant]
US 20190160594A1 · Flamm et al. · 2019 [cited by applicant]
US 20210047744A1 · Biton · 2021 [cited by applicant]
CN 104178782A · 2014 [cited by applicant]
CN 204097583U · 2015 [cited by applicant]
CN 104593830A · 2015 [cited by applicant]
WO 2017087884A1 · 2017 [cited by applicant]
WO 2019150362A1 · 2019 [cited by applicant]
WO 2021041265A1 · 2021 [cited by applicant]
Frey et al., “Switch-matrix-based High-Density Microelectrode Array in CMOS Technology”, IEEE Journal of Solid-State-Circuits, Feb. 2010, pp. 467-482, vol. 45, No. 2. [cited by applicant]
International Search Report and Written Opinion for PCT/US2020/047531 dated Sep. 29, 2020. [cited by applicant]
Nakamura et al., Incorporation of input function into displays using LTPS TFT technology, Journal of the SID, 2006, pp. 363-369, 14/4. [cited by applicant]
Stewart et al., “Polysilicon TFT Technology for Active Matrix OLEO Displays”, IEEE Transactions on Electron Devices, May 2001, pp. 845-851, vol. 48, No. 5. [cited by applicant]
Supplementary International Search Report for PCT/US2020/04753l dated Nov. 22, 2021. [cited by applicant]
U.S. Appl. No. 17/535,437, filed Nov. 24, 2021. [cited by applicant]
U.S. Appl. No. 17/566,546, filed Dec. 30, 2021. [cited by applicant]
“Study of the mass transport characteristics of K3[Fe(CN)6]/ K4[Fe(CN)6] oxidation and reduction reaction using Autolab RDE”, Metrohm Autolab B.V., Autolab Application Note EC01; Retrieved at http://www.autolabj.com/app… [cited by applicant]