IP Library › Granted Patent US 12,273,101
Granted Patent B2
US 12,273,101 · App. 18/167,301 · Granted Apr 8, 2025

Semiconductor device

Inventors: Toru Sugiyama (Tokyo, JP); Noriaki Yoshikawa (Tokyo, JP); Yasuhiko Kuriyama (Yokohama Kanagawa, JP); Akira Yoshioka (Yokohama Kanagawa, JP); Hitoshi Kobayashi (Yamato Kanagawa, JP); Hung Hung (Kawasaki Kanagawa, JP); Yasuhiro Isobe (Tokyo, JP); Tetsuya Ohno (Yokohama Kanagawa, JP); Hideki Sekiguchi (Yokohama Kanagawa, JP); Masaaki Onomura (Tokyo, JP)
Assignees: Kabusbiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
H03K17/162H03K2217/0081
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Quick Facts
Patent No.
US 12,273,101
App. No.
18/167,301
Granted
Apr 8, 2025
Kind
B2
Abstract

A semiconductor device includes a first transistor, a first drive circuit including a second transistor, and a second drive circuit including a third transistor. The second transistor and the third transistor are connected in series; and a connection node of the second and third transistors is connected to a gate electrode of the first transistor. The first transistor, the second transistor, and the third transistor are normally-off MOS HEMTs formed in a first substrate that includes GaN. The first drive circuit charges a parasitic capacitance of the first transistor. The second drive circuit discharges the parasitic capacitance of the first transistor.

Claims (124)

1. A semiconductor device, comprising:

a first transistor including

a first drain electrode connected to a drain electrode pad,

a first source electrode connected to a source electrode pad, and

a first gate electrode;

a first drive circuit connected to the source electrode pad and connected between a first electrode pad and a second electrode pad, a first voltage being input to the first electrode pad and used as a reference, a second voltage being input to the second electrode pad and being greater than the first voltage, the first drive circuit including a second transistor, the second transistor including

a second drain electrode electrically connected to the second electrode pad, and

a second source electrode connected to the first gate electrode of the first transistor; and

a second drive circuit connected between the second transistor and the first electrode pad, the second drive circuit including a third transistor, the third transistor including

a third drain electrode connected to the first gate electrode, and

a third source electrode connected to the source electrode pad,

the first transistor, the second transistor, and the third transistor being formed in a first substrate, the first substrate including GaN,

the first drive circuit charging a parasitic capacitance of the first transistor,

the second drive circuit discharging the parasitic capacitance of the first transistor, wherein

the second transistor further includes a second gate electrode,

the first drive circuit further includes a fourth transistor connected between the first electrode pad and the second gate electrode of the second transistor,

the second drive circuit further includes:

a fifth transistor included in a current mirror with the third transistor; and

a constant current source outputting a current to the fifth transistor, the current having a current value that is variably set.

2. The device according to claim 1 , wherein

the first drive circuit further includes:

a sixth transistor connected to the second drain electrode;

a seventh transistor included in a current mirror with the sixth transistor; and

a constant current circuit outputting a current to the seventh transistor, the current having a current value that is variably set.

3. The device according to claim 2 , wherein

the fifth transistor is formed in the first substrate,

the sixth transistor and the seventh transistor are formed in a second substrate, and

the second substrate includes Si.

4. The device according to claim 3 , wherein

the second transistor is connected to the sixth transistor via a first connection wire.

5. The device according to claim 1 , wherein

the first drive circuit outputs a first drive current to the first gate electrode,

a current value of the first drive current is settable,

the second drive circuit outputs a second drive current to the first gate electrode, and

a current value of the second drive current is settable.

6. The device according to claim 1 , wherein

the first transistor, the second transistor, and the third transistor are normally-off MOS HEMTS.

7. A semiconductor device, comprising:

a first transistor including

a first drain electrode connected to a drain electrode pad,

a first source electrode connected to a source electrode pad, and

a first gate electrode;

a first drive circuit connected to the source electrode pad and connected between a first electrode pad and a second electrode pad, a first voltage being input to the first electrode pad and used as a reference, a second voltage being input to the second electrode pad and being greater than the first voltage, the first drive circuit including a second transistor, the second transistor including

a second drain electrode electrically connected to the second electrode pad, and

a second source electrode connected to the first gate electrode of the first transistor; and

a second drive circuit connected between the second transistor and the first electrode pad, the second drive circuit including a third transistor, the third transistor including

a third drain electrode connected to the first gate electrode, and

a third source electrode connected to the source electrode pad,

the first transistor, the second transistor, and the third transistor being formed in a first substrate, the first substrate including GaN,

the first drive circuit charging a parasitic capacitance of the first transistor,

the second drive circuit discharging the parasitic capacitance of the first transistor, wherein

the first drive circuit includes a plurality of the second transistors connected in parallel, and

the device further comprises a first control circuit selectively driving at least one of the second transistors among the plurality of second transistors.

8. The device according to claim 7 , wherein

the first drive circuit further includes:

a fourth transistor connected to the second drain electrode;

a fifth transistor included in a current mirror with the fourth transistor; and

a constant current circuit outputting a current to the fifth transistor, the current having a current value that is variably set.

9. The device according to claim 8 , wherein

the fourth transistor and the fifth transistor are formed in a second substrate, and

the second substrate includes Si.

10. The device according to claim 9 , wherein

the second transistor is connected to the fourth transistor via a first connection wire.

11. The device according to claim 7 , wherein

the first drive circuit outputs a first drive current to the first gate electrode,

a current value of the first drive current is settable,

the second drive circuit outputs a second drive current to the first gate electrode, and

a current value of the second drive current is settable.

12. The device according to claim 7 , wherein

the first transistor, the second transistor, and the third transistor are normally-off MOS HEMTS.

13. A semiconductor device, comprising:

a first transistor including

a first drain electrode connected to a drain electrode pad,

a first source electrode connected to a source electrode pad, and

a first gate electrode;

a first drive circuit connected to the source electrode pad and connected between a first electrode pad and a second electrode pad, a first voltage being input to the first electrode pad and used as a reference, a second voltage being input to the second electrode pad and being greater than the first voltage, the first drive circuit including a second transistor, the second transistor including

a second drain electrode electrically connected to the second electrode pad, and

a second source electrode connected to the first gate electrode of the first transistor; and

a second drive circuit connected between the second transistor and the first electrode pad, the second drive circuit including a third transistor, the third transistor including

a third drain electrode connected to the first gate electrode, and

a third source electrode connected to the source electrode pad,

the first transistor, the second transistor, and the third transistor being formed in a first substrate, the first substrate including GaN,

the first drive circuit charging a parasitic capacitance of the first transistor,

the second drive circuit discharging the parasitic capacitance of the first transistor, wherein

the second drive circuit includes a plurality of the third transistors connected in parallel, and

the device further comprises a second control circuit selectively driving at least one of the third transistors among the plurality of third transistors.

14. The device according to claim 13 , wherein

the first drive circuit further includes:

a fourth transistor connected to the second drain electrode;

a fifth transistor included in a current mirror with the fourth transistor; and

a constant current circuit outputting a current to the fifth transistor, the current having a current value that is variably set.

15. The device according to claim 14 , wherein

the fourth transistor and the fifth transistor are formed in a second substrate, and

the second substrate includes Si.

16. The device according to claim 15 , wherein

the second transistor is connected to the fourth transistor via a first connection wire.

17. The device according to claim 13 , wherein

the first drive circuit outputs a first drive current to the first gate electrode,

a current value of the first drive current is settable,

the second drive circuit outputs a second drive current to the first gate electrode, and

a current value of the second drive current is settable.

18. The device according to claim 13 , wherein

the first transistor, the second transistor, and the third transistor are normally-off MOS HEMTS.

19. A semiconductor device, comprising:

a first transistor including

a first drain electrode connected to a drain electrode pad,

a first source electrode connected to a source electrode pad, a first voltage being applied to the source electrode pad and used as a reference, and

a first gate electrode;

a first drive circuit connected between a power supply electrode pad and the source electrode pad, a second voltage being input to the power supply electrode pad, the second voltage being greater than the first voltage, the first drive circuit including a second transistor, the second transistor including

a second drain electrode electrically connected to the power supply electrode pad, and

a second source electrode connected to the first gate electrode of the first transistor; and

a second drive circuit including a third transistor connected between the second transistor and the source electrode pad, the third transistor including

a third drain electrode connected to the first gate electrode, and

a third source electrode connected to the source electrode pad,

the first transistor, the second transistor, and the third transistor being normally-off MOS HEMTs,

the normally-off MOS HEMTs being formed in a first substrate,

the first substrate including GaN,

the first drive circuit charging a parasitic capacitance of the first transistor by outputting a first drive current to the first gate electrode,

the first drive current being variably set, wherein

the second transistor further includes a second gate electrode,

the first drive circuit further includes a fourth transistor connected between a first electrode pad and the second gate electrode of the second transistor,

the second drive circuit further includes:

a fifth transistor included in a current mirror with the third transistor; and

a constant current source outputting a current to the fifth transistor, the current having a current value that is variably set.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2023
From: SUGIYAMA, TORU; YOSHIKAWA, NORIAKI; KURIYAMA, YASUHIKO; YOSHIOKA, AKIRA; KOBAYASHI, HITOSHI; HUNG, HUNG; ISOBE, YASUHIRO; OHNO, TETSUYA; SEKIGUCHI, HIDEKI; ONOMURA, MASAAKI
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 063031/0565 →
Priority Claims (1)
JP 2022-147859 · Sep 16, 2022 · national
Continuity (1)
Related Publication 20240097671A1 · Mar 21, 2024
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