Method of manufacturing electronic component and electronic component
A method of manufacturing an electronic component capable of preventing entrance of a plating solution and a flux component at an interface to which an inner electrode of a ceramic element body is extended, and capable of forming an outer electrode of an arbitrary shape. A ceramic element body is made of a ceramic material containing a metal oxide, and part of an inner electrode is extended to extended surfaces of the ceramic element body. A base electrode is formed on each of the extended surfaces using a conductive paste to be connected to the inner electrode. Part of another surface of the ceramic element body adjacent to the extended surfaces is locally heated, and part of the metal oxide is reduced to form a reformed portion. A plating electrode is continuously formed over the base electrode and the reformed portion through a plating method to form outer electrodes.
1. An electronic component comprising:
a ceramic element body including a ceramic material containing a metal oxide, the ceramic element body having an inner electrode and having an extended surface to which part of the inner electrode is extended;
a base electrode on the extended surface of the ceramic element body and connected to the inner electrode, the base electrode being an electrode configured by a conductive paste;
a reformed portion at another surface of the ceramic element body adjacent to the extended surface and including a reduced metal element of the metal oxide which is a product of a reduction reaction of the metal oxide that is contained in the ceramic material of the ceramic element body, wherein the reformed portion has laser irradiation marks each having a V-shaped or U-shaped cross-section when viewed in a direction parallel to the another surface, and wherein the reformed portion includes a reduction layer in which the metal element of the metal oxide of the ceramic material of the ceramic element body is reduced, and a reoxidation layer with which the reduction layer is covered; and
a plating electrode on the base electrode and the reformed portion.
2. The electronic component according to claim 1 , wherein
the ceramic element body has a rectangular parallelepiped shape,
the extended surface is each end surface of the ceramic element body in a longitudinal direction,
the surface at which the reformed portion is present is a bottom surface of the ceramic element body, and
the reformed portion is present at each end portion of the bottom surface in the longitudinal direction.
3. The electronic component according to claim 1 , wherein
the base electrode and the reformed portion are at positions separated from one another by the ceramic element body.