Systems and methods for detecting mechanical strain on a circuit board
An information handling system may include a strain force fuse formed on a circuit board of the information handling system, the strain force fuse configured to experience an impedance discontinuity in response to a mechanical force applied to the circuit board at or proximate to the strain force fuse and a management controller electrically coupled to the strain force fuse and configured to provide out-of-band management facilities for management of the information handling system, the management controller further configured to detect whether the impedance discontinuity has occurred.
1. An information handling system comprising:
a strain force fuse formed on a circuit board of the information handling system, the strain force fuse configured to experience an impedance discontinuity in response to a mechanical force applied to the circuit board at or proximate to the strain force fuse, wherein the strain force fuse comprises:
a first pad formed in the circuit board;
a second pad formed in the circuit board;
a first solder ball deposited on the first pad;
a second solder ball deposited on the second pad;
a fragile substrate suspended between the first solder ball and the second solder ball; and
an electrically conductive layer formed on the fragile substrate electrically coupling the first solder ball to the second solder ball, such that the impedance discontinuity comprises a break in one or more of the fragile substrate, the first solder ball, and the second solder ball.
2. The information handling system of claim 1 , further comprising a management controller electrically coupled to the strain force fuse and configured to provide out-of-band management facilities for management of the information handling system, the management controller further configured to detect whether the impedance discontinuity has occurred.
3. The information handling system of claim 2 , wherein the management controller is further configured to log an event associated with the occurrence of the impedance discontinuity.
4. The information handling system of claim 2 , wherein the management controller is further configured to:
output a known signal on a first pin of the management controller electrically coupled to the strain force fuse;
receive an input signal on a second pin of the management controller electrically coupled to the strain force fuse; and
determine if the impedance discontinuity exists based on whether the input signal is equivalent to the known signal.
5. The information handling system of claim 4 , wherein:
the first pin is a general-purpose output pin of the management controller; and
the second pin is a general-purpose input pin of the management controller.
6. The information handling system of claim 1 ,
wherein the strain force fuse is one of a plurality of strain force fuses coupled electrically in a series configuration.
7. A method comprising:
outputting a known signal on a first pin of a management controller electrically coupled to a strain force fuse formed on a circuit board of an information handling system, the strain force fuse configured to experience an impedance discontinuity in response to a mechanical force applied to the circuit board at or proximate to the strain force fuse;
receiving an input signal on a second pin of the management controller electrically coupled to the strain force fuse; and
determining if the impedance discontinuity exists based on whether the input signal is equivalent to the known signal;
wherein the strain force fuse comprises:
a first pad formed in the circuit board;
a second pad formed in the circuit board;
a first solder ball deposited on the first pad;
a second solder ball deposited on the second pad;
a fragile substrate suspended between the first solder ball and the second solder ball; and
an electrically conductive layer formed on the fragile substrate electrically coupling the first solder ball to the second solder ball, such that the impedance discontinuity comprises a break in one or more of the fragile substrate, the first solder ball, and the second solder ball.
8. The method of claim 7 , wherein:
the first pin is a general-purpose output pin of the management controller; and
the second pin is a general-purpose input pin of the management controller.
9. The method of claim 7 ,
wherein the strain force fuse is one of a plurality of strain force fuses electrically coupled in a series configuration.
10. The method of claim 7 , further comprising the management controller logging an event associated with the occurrence of the impedance discontinuity.
11. An article of manufacture comprising:
a non-transitory computer readable medium; and
computer-executable instructions carried on the computer readable medium, the instructions readable by a processor, the instructions, when read and executed, for causing the processor to, in a management controller of an information handling system, wherein the management controller is configured to provide out-of-band management facilities for management of the information handling system:
output a known signal on a first pin of the management controller electrically coupled to a strain force fuse formed on a circuit board of the information handling system, the strain force fuse configured to experience an impedance discontinuity in response to a mechanical force applied to the circuit board at or proximate to the strain force fuse;
receive an input signal on a second pin of the management controller electrically coupled to the strain force fuse; and
determine if the impedance discontinuity exists based on whether the input signal is equivalent to the known signal;
wherein the strain force fuse comprises:
a first pad formed in the circuit board;
a second pad formed in the circuit board;
a first solder ball deposited on the first pad;
a second solder ball deposited on the second pad;
a fragile substrate suspended between the first solder ball and the second solder ball; and
an electrically conductive layer formed on the fragile substrate electrically coupling the first solder ball to the second solder ball, such that the impedance discontinuity comprises a break in one or more of the fragile substrate, the first solder ball, and the second solder ball.
12. The article of claim 11 , wherein:
the first pin is a general-purpose output pin of the management controller; and
the second pin is a general-purpose input pin of the management controller.
13. The article of claim 11 ,
wherein the strain force fuse is one of a plurality of strain force fuses electrically coupled in a series configuration.
14. The article of claim 11 , the instructions for further causing the processor to log an event associated with the occurrence of the impedance discontinuity.