Memory device and method for forming the same
A memory device includes a first pull-down transistor, a first pass-gate transistor, a second pull-down transistor, a second pass-gate transistor, a first pull-up transistor, and a second pull-up transistor. A first power line, a first bit line, and a second bit line is provided, the first power line includes first and second portions separated from each other, wherein in a cross-sectional view, the second portion of the first power line is laterally between the first and second bit lines along a direction. A first via electrically connects the first portion of the first power line to the first pull-down transistor. A second via electrically connects the first bit line to the first pass-gate transistor. A third via electrically connects the second portion of the first power line to the second pull-down transistor. A fourth via electrically connects the second bit line to the second pass-gate transistor.
1 . A method, comprising:
forming a first semiconductor strip and a second semiconductor strip protruding over a substrate;
forming first, second, and third isolation structures over the substrate, the first semiconductor strip being between the first and second isolation structures, and the second semiconductor strip being between the second and third isolation structures;
patterning the second and third isolation structures to form first and second trenches in the second and third isolation structures, respectively;
forming first and second metal lines in the first and second trenches, respectively;
after forming the first and second metal lines, patterning the first and second isolation structures to form third and fourth trenches in the first and second isolation structures, respectively;
forming third and fourth metal lines in the third and fourth trenches, respectively;
forming a first pull-down transistor electrically connected to the third metal line, a first pass-gate transistor electrically connected to the first metal line, a second pull-down transistor electrically connected to the fourth metal line, and a second pass-gate transistor electrically connected to the second metal line; and
forming a first pull-up transistor and a second pull-up transistor vertically stacked over the first pull-down transistor, the first pass-gate transistor, the second pull-down transistor, and the second pass-gate transistor.
2 . The method of claim 1 , further comprising:
prior to forming the first and second metal lines, forming first and second liners in the first and second trenches, respectively;
prior to forming the third and fourth metal lines, forming third and fourth liners in the first and second trenches, respectively; and
etching back the first, second, third, and fourth metal lines, such that top surfaces of the first, second, third, and fourth metal lines are lowered to a position below top ends of the first, second, third, and fourth liners.
3 . The method of claim 2 , further comprising after etching back the first, second, third, and fourth metal lines, forming first, second, third, and fourth vias in contact with the first, second, third, and fourth metal lines, respectively.
4 . The method of claim 3 , further comprising prior to forming the first, second, third, and fourth vias, forming first, second, third, and fourth dielectric materials over the second, third, and fourth metal lines, respectively, wherein the first, second, third, and fourth vias are formed in the first, second, third, and fourth dielectric materials, respectively.
5 . The method of claim 1 , wherein the first metal line serves a first bit line, the second metal line serves as a second bit line, and the third and fourth metal lines collectively serve as a first power line, and wherein the method further comprises:
forming a word line electrically connected to the first and second pass-gate transistors; and
forming a second power line electrically connected to the first and second pull-up transistors.
6 . A method, comprising:
forming a semiconductor strip protruding over a substrate;
forming an isolation structure over the substrate and adjacent to the semiconductor strip;
etching the isolation structure to form a trench;
depositing a liner in the trench;
depositing a conductive material in the trench and over the liner;
etching back the conductive material;
depositing a dielectric material over the conductive material; and
forming a semiconductor device over the semiconductor strip and electrically connected to the conductive material.
7 . The method of claim 6 , wherein etching back the conductive material is performed to lower a top surface of the conductive material to a position lower than a top surface of the semiconductor strip.
8 . The method of claim 6 , further comprising forming a liner material over the conductive material after etching back the conductive material and prior to depositing the dielectric material over the conductive material.
9 . The method of claim 6 , further comprising forming a via in the dielectric material and electrically connected to the conductive material.
10 . The method of claim 6 , further comprising forming a source/drain contact over a source/drain structure of the semiconductor device, wherein the conductive material is electrically connected to the source/drain contact.
11 . The method of claim 10 , further comprising forming a via in the dielectric material and electrically connecting the conductive material and the source/drain contact.
12 . The method of claim 6 , further comprising forming another semiconductor device vertically above the semiconductor device.
13 . The method of claim 6 , further comprising etching back the isolation structure, the liner, and the dielectric material prior to forming the semiconductor device.
14 . The method of claim 6 , wherein the conductive material serves as a power line or a bit line of the semiconductor device.
15 . A method, comprising:
forming a first metal line and a second metal line over a substrate and at a first level;
forming a first transistor and a second transistor over the substrate and at a second level higher than the first level, wherein the first metal line is electrically connected to the first transistor, and the second metal line is electrically connected to the second transistor;
forming a third transistor over the substrate and at a third level higher than the second level, wherein the third transistor is electrically connected to the first transistor and the second transistor, and
forming a third metal line over the substrate and at a fourth level higher than the third level, wherein the third metal line is electrically connected to the second transistor wherein the first metal line serves as a power line, the second metal line serves as a bit line, and the third metal line serves as a word line.
16 . The method of claim 15 , further comprising forming a first via and a second via over the first metal line and the second metal line, respectively, wherein the first metal line is electrically connected to the first transistor through the first via, and the second metal line is electrically connected to the second transistor through the second via.
17 . The method of claim 15 , further comprising forming a semiconductor strip over the substrate, wherein the first metal line and the second metal line are on opposite sides of the semiconductor strip.
18 . The method of claim 15 , further comprising forming an isolation structure over the substrate, wherein the first metal line and the second metal line are formed in the isolation structure.
19 . The method of claim 15 , wherein the first, second, and third transistor has a gate-all-around (GAA) configuration.
20 . The method of claim 15 , wherein the first transistor and the second transistor have a first conductivity type, and the third transistor has a second conductivity type opposite to the first conductivity type.